ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
Categories
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product
2 PICMG® CPU, 4 PCI™, 3 ISA Slots Backplane
HPCI-8S4
- Supports AT, ATX power supplies- Slots: 2 PICMG® CPU, 4 PCI™, 3 ISA- Segment: 1- Dimensions: 264.2 mm x 218 mm
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Edge AI Platforms
ADLINK is committed to delivering artificial intelligence (AI) at the Edge with its architecture-optimized Edge AI platforms. Featuring heterogeneous computing architecture, ADLINK’s Edge AI platforms integrate hardware acceleration in deep learning (DL) workloads, high performance per watt and per dollar, end-to-end connectivity to break down information silos, and industrial environmental compliance for 24/7 operation, generating actionable intelligence required to achieve operational improvements, performance boost, and efficiency gains in manufacturing, transportation, medical, gaming, defense, smart city, and retail applications.
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3U CompactPCI® Single 64-bit PMC Slot Carrier Board
cPCI-8301
- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- Supports one single-size 32,64-bit/33,66 MHz PMC site in 4HP width- Universal V(I/O) decided by backplane- Comprehensive EMC shielding
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Intel® Core™ Ultra Processor-Based Fanless Open Frame Touch Panel PC
SP2-MTL Series
- Intel® Core™ Ultra H series (Meteor Lake) processor- 10.1"/15.6"/21.5" Projected capacitive touch screen- 3x independent display output, LVDS, DP, USB type C- Full customization for fast integration with all form factors, kiosks, and all-in-one panel PC applications- Extensive I/O and function expansion through board-to-board connectors (Function Modules)- Support PoE by extension module (optional)- Support NVIDIA MXM GPU type A by carrier board (optional)- Pre-compliance EMC testing and high ESD tolerance
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ATX Motherboards
ADLINK's ATX motherboards provide optimal platforms for industrial automation, with one-piece PCBA design with no board-to-board connection significantly improving reliability and durability. The 305 x 244 mm profile is particularly suitable for space/cost sensitive applications where fewer than 7 slots are required. Rich features such as multiple PCIe/PCI/LAN/USB3.0 enable immediate multi-tasking deployment, balancing performance and expandability.
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PCI Express Control of PXI/CompactPCI
PCIe-8560/PXI-8565
The PCI Express-to-PXI/CompactPCI expansion kit provides control of PXI/CompactPCI modules installed in a PXI/CompactPCI expansion system using the high-bandwidth PCI Express technology. With comprehensive hardware and software transparency, the expansion kit enables fast and convenient detection of any installed PXI/CompactPCI cards in the expansion system, without requiring additional drivers or software installation. The PCIe-8560 and PXI-8565 are connected by a shielded twisted copper cable of up to seven meters for remote operating convenience. Suitable for remote industrial control or automation, the PCI Express-to- PXI/CompactPCI expansion kit is designed to withstand rugged environments and harsh operating conditions.
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3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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PLC-Interoperable IIoT Gateway
GW-01
The GW-01 is powered by iM-Connect, a web-based and simple-to-use programming software that support a variety of industrial communication protocols, PLC drivers, and IIoT cloud connections as a simple but reliable protocol conversion and data acquisition platform for connected industries.
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Industrial-Grade Intelligent Analog & Digital Interface Modular Control Box With Arduino Compatibility
I-Pi OT2IT
Discover the freedom of open-source innovation with ADLINK's industrial-grade I-Pi Arduino-Compatible PLC. Say goodbye to restrictive proprietary systems and embrace the vast, versatile world of the Arduino ecosystem. Accelerate your project's journey from concept to commercialization across diverse automation and control tasks. All this, while ensuring steadfast reliability, professional-grade functionality and industry-ready performance.I-Pi-OT2IT is equipped with numerous analog and digital sensors to manage different OT devices in smart factories. It features 8x Digital inputs, 11x Digital outputs, 9x Analog inputs, and 2x Analog outputs, and can be easily controlled by Computer-on-Modules via software over Ethernet/LAN. By consolidating OT with IT, it is the ideal solution to transform your factory into a smart one.
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NVIDIA® Jetson™ TX2-Based IP67-Certified AI Smart Camera Kit
NEON-2000-JT2-X Series Kit
- IP67-rated chassis and connectors, integration of NVIDIA Jetson TX2, image sensor and vision software suites, ready to deploy- All-in-one design minimizes cabling, footprint, and maintenance- FPGA-based DI/O for accurate, real-time triggering- Validated and comprehensive accessories, saves effort on surveying and debugging- Pre-installed software and sample code, easy to get started
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LEC-Starterkit with LEC-BASE 2.0 Carrier, SD Card and ATX Power Supply (without LEC Module and Cooling Solution), Optional LVDS Display
LEC-Starterkit 2.0
The LEC-Starterkit 2.0 consists of a SMARC 2.0 compliant LEC-BASE 2.0 carrier board, data media, an AC/DC adapter, power cords and is suitable for LEC-AL, LEC-BT, LEC-BTS or LEC-BW modules.
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MXM 3.1 Type A based on Intel® Arc™ GPU
MXM-AXe
Integrating Intel’s latest line of powerful, discrete graphics — Intel® Arc™ — ADLINK introduces its MXM-AXe, one of the industry’s first MXM (R3.1) Type A discrete GPU modules. Packing hardware ray tracing, AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in commercial gaming, healthcare, media processing, and transportation. ADLINK MXM-AXe provides up to 8 hardware ray-tracing cores, 128 execution units, 4GB GDDR6, and 8x PCIe Gen4 at maximum 35W TGP and the industry’s first full AV1 hardware encoding.
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32-CH EtherCAT I/O Terminal Base For M-Type Modules
ECAT-TB32-M-DIN
The ECAT-TB32-M-DIN is a 32-channel EtherCAT I/O Terminal Base designed specifically for ADLINK's M-Type EtherCAT IO Slave Modules. This terminal base unit serves as a foundational component for enabling communication and interaction with various peripheral devices through the EtherCAT protocol.
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SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.






















