ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
NVIDIA® Jetson Xavier™ SOM-Based Platform for Rapid Development of ROS and AI Applications
ROScube Pico NPN
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The ROScube Pico Series is an integrated development board powered by an NVIDIA® Jetson Xavier™ NX and Nano system-on- module (SOM) platform designed for rapid development and deployment of ROS and AI applications. The straightforward design allows users to quickly get started on development using open-source ROS libraries and packages. In addition to NVIDIA JetPack SDK, the ROScube Pico NX/Nano supports the full complement of resources provided by ADLINK’s Neuron SDK, Neuron IDE, and Neuron Library. The ROScube Pico NX/Nano is especially suited for robotic applications that demand cost-effective deployment without compromising AI computing capability.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7210
MEC Server
The MECS-7210 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. As one of the first NGC-Ready validated and OTII compliant edge servers, the MECS-7210 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 420mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and dual FHFL PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7210 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
ATX Motherboards
Motherboard
ADLINK's ATX motherboards provide optimal platforms for industrial automation, with one-piece PCBA design with no board-to-board connection significantly improving reliability and durability. The 305 x 244 mm profile is particularly suitable for space/cost sensitive applications where fewer than 7 slots are required. Rich features such as multiple PCIe/PCI/LAN/USB3.0 enable immediate multi-tasking deployment, balancing performance and expandability.
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Product
32-CH Discrete Input Modules with U Profile
HSL-DI32-UD
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HSL U series is designed as compact & horizontal-placed slave module. For I/O module, ADLINK adopts three types of connectors to meet different users' requirements & habits. Compared with past models, U series brings compact size, easier-to-wire and cost-effective advantages for users. DI/O, AI/O and motion control module are supported
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
Software Development Kit
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
PICMG Single Board Computers
Single Board Computer
ADLINK's industrial Slot Single Board Computers (SBCs) and backplanes follow PCI Industrial Computer Manufacturers Group (PICMG) 1.0 and 1.3 standards, with card-on-backplane architecture delivering faster Mean Time to Repair (MTTR) over conventional motherboard designs, flexible backplane configurations, functional with a broad range of off-the-shelf peripheral cards. ADLINK’s wide range of PICMG 1.0/1.3 CPU board-compatible backplanes are fully co-functional with ADLINK systems, for flexible configuration and expandability in industrial applications.
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Product
Intel Atom® Processor E3900 Family-Based Ultra Compact Embedded Platform
MXE-210 Series
Embedded Platform
ADLINK’s new Matrix MXE-210 series of ultra compact embedded platforms, based on the Intel Atom® x5-E3930/x7-E3950 Processor, delivers optimum I/O design for maximum connectivity.
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Product
1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 6 PCI™ Slots Backplane
EBP-9E2
Backplane
- Segment: 1- Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 6 PCI™- Support ATX power supplies- Dimension: 328 mm x 206 mm
















