ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
24-Bit High-Resolution Dynamic Signal Acquisition and Generation Module
PCI-9527L
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The PCI-9527L is a high-performance, 2-CH analog input and 2-CH analog output dynamic signal acquisition board. This board is specifically designed for audio testing, acoustic measurement, and vibration analysis applications.The ADLINK PCI-9527L features two 24-bit simultaneous sampling analog input channels. The 24-bit sigma-delta ADC provides a sampling rate up to 216 KS/s at high resolutions, making it ideal for higher bandwidth dynamic signal measurements. The sampling rate can be adjusted by setting the onboard DDS clock source to an appropriate frequency. All channels are sampled simultaneously and accept an input range from ±40 V to ±0.316 V. The PCI-9527L analog input supports software selectable AC or DC coupling and 4 mA bias current for integrated electronic piezoelectric (IEPE) sensors.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Quiet Safety 4U Rack Mounted Industrial Chassis With 14-Slot Backplane And Motherboard
RK-620 Series
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- EIA RS-310C 19” rack mount standard- Supports 14-slot backplane and ATX motherboard- Two 5.25” external, one 3.5” external and one 3.5” internal drive bay- Two USB ports inside front I/O- Replaceable, easy-to-clean air filter- PS2 ATX power supply- Low noise 12cm PWM controlled (103 CFM)
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Product
32-CH Sinking Type Digital Ouput EtherCAT Module
EPS-2132
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ADLINK" s EPS slave system features modular design for flexible high channel density, rugged construction, easy maintenance, and intelligent performance, compatible with 3rd party EtherCAT products. Precise time-deterministic control enables I/O synchronization for critical applications, and FPGA and ARM technology allow users to fully monitor status of EPS modules and systems, including operating temperature and usage cycle of relay switching, as well as motion control status for general purpose motor drive control. In addition, the ADLINK EtherCAT configurator enables auto-scan and configuration across EtherCAT systems. The EPS" unique structural and electronic design supports hot-swappable function, reducing repair time, and the rugged construction and operating temperature range of -20°C to 60°C allow operation in the harshest environments.
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Product
PCI Express Graphics Cards With NVIDIA RTX 4000 SFF Ada
NVIDIA RTX 4000 SFF Ada
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- NVIDIA Ada Lovelace Architecture- Half height, half length design- PCIe Gen4x16 interface- 20GB GDDR6 Memory, 160-bit Bandwidth- 6144 CUDA Cores, 19.2 TFLOPS SP Peak- 192 Tensor Cores, 106.8 TFLOPS- 4 x mDP (mini Display Port 1.4), 1 x USB-C
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Product
SMARC Module
LEC-MTK-I1200
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The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-4x10G SFP+
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- Support up to four 10GbE SFP+ interfaces- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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Product
Jetson TX2 NX™ Edge AI Inference Platform
DLAP-211-JT2
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- Deep learning acceleration with NVIDIA® Jetson™ TX2 NX- Linux® Ubuntu operating system- Support wide operating temperature- Compact, durable and fanless design for 24/7 operation- Wide variety of industrial I/O ports and visual inferencing capabilities- Available with AWS IoT Greengrass service and Allxon remote device management
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Product
96-CH 12-Bit 3 MS/s High-Density Analog Input PCI Express Card
DAQe-2208
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ADLINK DAQe-2208 is an high-density and high-performance analog input card. The device can sample up to 96 AI channels with different gain settings and scan sequences. It makes them ideal for dealing with high-density analog signals with various input ranges and sampling speeds. These devices also offer differential mode for 48 AI channels in order to achieve maximum noise elimination.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
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The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Industrial ATX Motherboard With 10th Generation Intel® Core™ I9/ I7/ I5 /i3 Processor
IMB-M46
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The ADLINK IMB-M46 Industrial ATX Motherboard supports lines of the 10th Generation Intel® Core™ i desktop processors, an Intel® Q470E Chipset, and 5 PCIe expansion slots to provide a cost-competitive embedded computing solution.
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Product
4CH GigE Vision Compact Vision System with 6th Generation Intel® Core™ i7/i5/i3 Processors
EOS-1300
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ADLINK’s EOS-1300 is a high performance compact vision system equipped with 6th Generation IntelR Core? i7/i5/i3 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s. EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
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The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
3 PICMG® CPU, 4 PCI™, 7 ISA Slots Backplane
HPCI-13S4LU
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- Segment: 1- Slots: 3 PICMG® CPU, 4 PCI™, 7 ISA- Supports AT, ATX power supplies- Dimensions: 314.7 mm x 259 mm
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280






















