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Solder Joint
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Armature Tester
Qingdao AIP Intelligent Instruments Co., Ltd
This tester is suitable for online or offline detection of various armature electrical properties, such as power tool motors, garden tools, vacuum cleaner motors, small household appliance motors, automobile motors, fitness equipment motors, permanent magnet micro-motors, etc. The tooling of the tester meets the requirements of arbitrary placement of the armature, and can automatically and accurately sort/track faulty solder joints; the equipment startup methods include buttons, remote control, and sliding cover; it meets the armature test of special processes such as double insulation, and automatically identifies solder joints, winding short circuit/open circuit , winding errors, poor welding and other problems; the tester can also automatically count the number of tests, the number of defectives and other data, which is convenient for quality management analysis.The tester test items mainly include:bar-to-bar resistance, diagonal resistance, welding resistance, insulation resistance, ac hi-pot, surge.
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Testing & Measurement Services
Delserro Engineering Solutions
Delserro Engineering Solutions is your complete source forHALT/HASS, Accelerated Life Testing, Environmental Testing, Lead Free Solder Joint Reliability Testing, Linear andNon-Linear FEA, Computational Fluid Dynamics (CFD)
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Event Detectors
STD Series
The STD Series Event Detectors offer test specifications associated with solder joint reliability testing but can also be used for testing other types of interconnects accordingly. Like other Event Detectors, the STD series provides continuous transient resistance detection referenced to a selected threshold resistance with a high degree of electrical noise immunity.
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Current Sense Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide variety of Thick Film Current Sense Resistors (ERJ-B1, B2, xB, xBW, xCW) in a large range of case sizes and in wide terminal types for high solder joint reliability. The ERJ Series of Current Sense Resistors offers power ratings up to 2W with low ohmic ratings ranging from 5mΩ to 10Ω. Panasonic’s Thick Film Current Sense Resistor portfolio offers a more cost effective option with high reliability. Panasonic has a wide line of case size options ranging from 0402 to 2512 in conventional terminal and 0612 to 1020 for wide terminal.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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Inline AOI Machine
Sherlock-300I
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
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Anti-Sulfur Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide variety of Thick Film Current Sense Resistors (ERJ-B1, B2, xB, xBW, xCW) in a large range of case sizes and in wide terminal types for high solder joint reliability. The ERJ Series of Current Sense Resistors offers power ratings up to 2W with low ohmic ratings ranging from 5mΩ to 10Ω. Panasonic’s Thick Film Current Sense Resistor portfolio offers a more cost effective option with high reliability. Panasonic has a wide line of case size options ranging from 0402 to 2512 in conventional terminal and 0612 to 1020 for wide terminal.
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USB-C® Short Channel Rx Precet. Test Fixture
AUT20098
*Easy swap between CC1 and CC2RP & RD Mode: In the older version of the USB-C full breakout board, users had to manually set the jumper with a short pin. But now users can easily swap between the two by just moving the switch.*In the previous version, the soldering joint of Test Fixture Host Fixture 1A gets worn out quickly from repetitive plug and pull. This newly designed fixture is more durable and users can easily replace the worn out SMA connectors with new ones.*DC-in Jack is upgraded to +5V USB C portA boost in user experience as it makes setting up easier.
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Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
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RF Rotary Joints
EVERAXIS is the market leader and supplier of choice for integrated waveguide assemblies, passive microwave components, RF Rotary Joints and rotating subsystems to the military and commercial radar and satcom markets. Working together with customers to create tailor-made solutions optimized to meet their needs has been the EVERAXIS business model for more than 70 years.
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Solderability Tester
LBT210
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
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Solderability Tester
MUST 3
The MUST System 3 is the latest technological evolution of the original Multicore Universal Solderability Tester (MUST) that grandfathered all modern solderability test standards. It remains the unquestioned industry benchmark for solderability testing.
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Solder Past Inspection
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Fiber Optic Rotary Joints
Fiber Optic Rotary Joints ensure flawless high-speed data transmission even in environments with strong electromagnetic interference. They are a maintenance-free alternative that eliminates friction and/or heating between rotating and stationary components.
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Reflow / Wave Solder Process Dashboard
Vantage
Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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SparkFun Solder-able Breadboard
This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Swivel Joints
The Swivel Joint is a special type of RF waveguide joint. It is a joint that is limited in rotation angle, compact in size, with low mechanical torque and high peak power capacity.
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Waveguide and Coaxial Rotary Joint Assembly
Waveguide and Coaxial Rotary Joints are used for the transmission of power and signal between the locked and rotating parts of a radar or satcom system.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
