Showing results: 1 - 15 of 41 items found.
-
Onto Innovation
With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
-
ASML
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
-
NXE systems -
ASML
NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
-
EXE systems -
ASML
EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
-
JetStep W2300 -
Onto Innovation
The JetStep W2300 System has been specifically designed to meet advanced packaging challenges head on. As resolution, overlay and many more technical specifications become tighter and more sophisticated for semiconductor advanced packaging processes, fulfilling lithography requirements becomes a challenge.
-
JetStep S3500 -
Onto Innovation
The JetStep S3500 panel lithography system is designed specifically for advanced packaging panel production. The system incorporates advanced features that address requirements for panel-level packaging, such as die shift due to placement accuracy or subsequent processing steps, CTE mismatch, panel warpage and panel handling.
-
JetStep X500 -
Onto Innovation
The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
-
JetStep G35 -
Onto Innovation
The Jetstep G35 system is a high volume manufacturing imaging system for up to Gen 3.5 displays.The JetStep G35 system enables high resolution imaging down to 1.5µm combined with registration and stitching accuracy required by most advanced manufacturing of high resolution displays.
-
JetStep G45 -
Onto Innovation
The JetStep G45 System features <1.5μm resolution capability across a field size diameter of >200mm. Low distortion optics combined with high-speed precision motions enables the system to achieve overlay of <0.5μm.
-
Neoark Corp.
Desktop Size Maskeless (direct-exposure) Lithography System which supports simple lithography operation by its sophisticated software.
-
ASML
ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
-
AMO GmbH
Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
-
ASML
Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
-
JEOL Ltd.
Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
-
ASML
Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
