Showing results: 31 - 45 of 47 items found.
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Model LGA-4000Z -
Teledyne Analytical Instruments
Teledyne’s LGA-4000Z series leverages the latest in Tunable Diode Laser Absorption Spectroscopy (TDLAS) to achieve an ultra-fast gas measurement in-line without resorting to extraction and sample conditioning. By tuning the laser to a specific absorption wavelength, based on the gas of interest, the attenuation of the light through a sample cell and the detector can be correlated to the concentration of each gas, per Beer-Lambert Law. The laser provides a narrow absorption band which minimizes the effect of interfering compounds in the process.
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SX-23BT -
Silex Technology
The SX-32BT is a Bluetooth® 5.0 Low Energy compatible microcomputer module based on a 32-bit RX microcomputer, the "RX23W", from Renesas Electronics. Certified for North America, Europe, and Japan, the module's design also includes a PCB antenna. Furthermore, it adopts a 0.7mm pitch LGA package, ideal for OEM's looking to increase the efficiency of their manufacturing process while lowering the total BOM cost of their product.
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Ironwood Electronics
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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Z-Axis Europe
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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MVP-5100-MXM Series -
ADLINK Technology Inc.
*9th Gen Intel® Core™ i7/i5/i3 LGA processor*Dual SODIMMs sockets for up to 32GB DDR4*Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0*3x USB 3.1 Gen 1, 3x USB 2.0*Rich storage options: 2x 2.5" SATA, M.2 2280
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MVP-6100 Series -
ADLINK Technology Inc.
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor*Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory*Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0*2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0*Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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MVP-5000 Series -
ADLINK Technology Inc.
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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AS7261 -
ams AG
Calibrated XYZ color sensor provides complete, integrated platform for handheld color analyzers, color calibration and mobile analysis devices. Tri-stimulus XYZ realized by silicon interference filters. UART or I²C slave digital Interface. 16-bit ADC with digital access. Programmable LED drivers. 20-pin LGA package 4.5mm x 4.7mm x 2.5mm, with built-in aperture. Compact true-color sensing. Applications; Color/CCT sensing, Fluid or reagent analysis, Color point comparison, Display calibration.
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MVP-6100-MXM Series -
ADLINK Technology Inc.
*9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor*Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC*Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0*2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0*Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Ironwood Electronics
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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DLAP-8000 Series -
ADLINK Technology Inc.
- 9th Gen Intel® Xeon®, Core™ i7/i3 LGA processors with workstation C246 chipset- Dual SODIMMs for up to 64GB DDR4 / ECC options*- Rich I/O: 2x DP++, 1x DVI-I, 3x GbE, 4x COM, 8-ch DI, 8-ch DO, TPM 2.0- 2x USB 3.1 Gen2, 1x USB 3.1 Gen1, 3x USB 2.0- Up to 4 hot swappable 2.5" SATA 6 Gb/s tray with RAID 0/1/5/10 support, CFast, M.2 2280- Embedded expansion: 1x Mini PCIe, 1x M.2 3042, 2x USIM- Front accessible I/O and adaptive Function Module v.2 option- Flexible and powerful PCIe expansions via backplane
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Ironwood Electronics
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Ironwood Electronics
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.