Showing results: 1 - 15 of 45 items found.
-
Series 514 -
Aries
TO Collet Sockets. Aries TO sockets feature molded chamfer lead-ins for easy device insertion. High stand-off design for heat dissipation and easy cleaning. External polarization for positive location.
-
1109522 & 1109523 -
Aries
DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
-
HBM-S1-B -
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) 2-pin tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, and 8010C hardware systems and software (upgrade on request)*Suppression of trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT voltage and DUT current sensor for real time voltage and current monitoring*Integrated DC test DUT switchIntegrated hardware 50 Ω trigger output for high speed digital oscilloscopesIntegrated overvoltage protection of voltage sense and DC test interfaces for oscilloscope and SMU protection during high voltage HBM testing*Fast and efficient HBM measurements including transient waveform data management using the HPPI TLP software*Compact size 145 mm x 82.5 mm x 44 mm
-
HBM-TS10-A -
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
-
Series 505 -
Aries
PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
-
95-132I25 -
Aries
QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
-
1110748 -
Aries
Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
-
ESDdoctor -
Sofics
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
-
TableTop Shadow Moiré (TTSM) -
Akrometrix, llc
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
-
ITC59100 Rg/Qg -
Integrated Technology Corp.
The ITC59100 Test Measurement Unit (TMU), which plugs into the ITC59000 Test Platform, performs gate charge (Qg) measurements that conform to MIL-STD-750C, Notice 2, Method 3471 and JEDEC Standard JESD24-2. In addition the ITC59100 TMU performs an internal gate resistance (Rg) test method that conforms to JEDEC Standard JESD24-11.
-
Keysight Technologies
Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
-
Ironwood Electronics
A large number of LPDDR sockets have been developed to cover the wide variety of ball I/O configurations. This catalog supports the JEDEC 209 Standard configuration.
-
IV-T3300 -
In.D Solution
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
-
PSD-510 -
Prostat Corporation
The PSD-510 is a low cost, light weight, battery powered Human Body Model (HBM) simulator designed to help customers determine the HBM ESD sensitivity of a device in accordance with ANSI/ESDA/JEDEC JS-001.
-
Renesas Electronics Corp.
Is a Static Random Access Memory. The pinout is the JEDEC 28 pin, 8-bit wide standard, which allows easy memory board layouts which accommodate a variety of industry standard ROM, PROM,EPROM, EEPROM and RAMs.
