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JEDEC
semiconductor test methods and standards setting organization, Joint Electron Device Engineering Council.
See Also: UFS
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HBM Discharge Simulator
PSD-510
The PSD-510 is a low cost, light weight, battery powered Human Body Model (HBM) simulator designed to help customers determine the HBM ESD sensitivity of a device in accordance with ANSI/ESDA/JEDEC JS-001.
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HBM Verification Tester
HBM-VT
High Power Pulse Instruments GmbH
- HBM pulse generator verification tester according ANSI/ESDA/JEDEC JS-001 up to ±10kV- To be used in HBM test and qualification labs for regular pulse generator specification compliance test in order to fulfill lab audit and certification requirements- Fully automatic compliance test and verification of HBM pulse generators regarding ANSI/ESDA/JEDEC JS-001 normative standard at 3 different load conditions: Short Circuit, 500 Ω, and a reference diode at VBR=15 V reverse breakdown voltage, including DC test- Parameter evaluation and verification of the transient HBM current waveforms: Peak Current, Rise Time, Decay Time, Maximum Ringing Current- Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, 8010C, HBM-TS10-A hardware systems in combination with HBM-S1-B (6kV) pulse generators (upgrade on request)- Fully automatic test report generation (PDF)- Electrically floating (no fixed system ground): The HBM loads, current sensor output, USB control interface and the enclosure are electrically floating. There is no limiting system ground which may introduce common-mode interference induced HBM current measurement errors.- Isolated industrial full-speed USB control interface- Isolated power supply derived from USB port- Compact size 126mm x 82.5mm x 44.5mm
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High Performance Chipscale Test Sockets
SC
Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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SD Card
SD Card v.3.0 / eMMC v.4.51 IP Family
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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mSAT SSD for Industrial Embedded Applications
mSATA SSD Series
ADLINK’s mSATA SSD Series with the SATA 6Gb/s interface is fully compliant with the standard mSATA form factor, also known as JEDEC MO300. Utilizing Toggle 2.0 MLC flash technology, capacities of up to 1TB are available with support for read/write speeds of up to 550MB/sec and 500MB/sec respectively . Additionally, the power consumption of the ADLINK’s mSATA modules is much lower than that of traditional hard drives.
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ESD & Latch-Up Test Service
MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
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IP Solution
eMMC 5.1
Demand for mobile content capacity and bandwidth for video, pictures and music is ever increasing. To address this demand in the next generation of smartphones, tablets, and portable devices, the eMMC 5.1 Specification from JEDEC, improves the current HS400 speeds operating at 3.2Gbps, with "command queuing" making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.
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Walk-In Climatic Test Chamber
WEIBER climatic test chamber is ideally suited for specimen test requiring quick changes of temperature. It covers various applications from JEDEC and IEC test standards. The climatic chamber is equipped with advanced technology such as specimen temperature control which allows linear specimen temperature rates of change during rapid thermal cycling or accurate temperaThe walk in option provides facility to test large sized, heavy weight specimen as well as the facility to test the specimen in bulk. Capacities ranging from 2000 to 10,000 Lt are available. Standard as well as customizable sizes and facilities are provided.
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Analyzer Probes
The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Detective Logic Analyzer
LPDDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured States at 1600MT/sContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsMode Register Listing providedSupports Auto-Clock rate detect and clock stoppageConnects to the target under test with Flying Lead, BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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DDR4 Parametric Test Reference Solution
Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Climate Control Test Chamber
ACMAS's Climate Test Chamber is ideally suited for specimen test requiring quick changes of temperature. It covers various applications from JEDEC and IEC test standards. ACMAS Thermal Cyclic Chamber is equipped with advanced technology such as specimen temperature control which allows linear specimen temperature rates of change during rapid thermal cycling or accurate temperature ramp control. This chamber is also known as Climatic Test Chamber and Climate Controlled Test Chamber.
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Flash SATA Disk/mSATA Mini SATA 3 SLC, MLC
FSA 301 Series
*SATA III (6.0Gb/s) interface*Capacity: SLC 1 GB to 32 GB, MLC 4 GB to 64 GB*iSMART disk health monitoring*Intelligent error recovery system*Write protection security*Anti-vibration mechanical design*Excellent data transfer speed*Zero mechanical interference*JEDEC standard MO300B dimension
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Universal Flash Storage
UFS
Universal Flash Storage (UFS) is a JEDEC standard for high performance mobile storage devices suitable for next generation data storage. The UFS is also adopted by MIPI as a data transfer standard designed for mobile systems. Most UFS applications require large storage capacity for data and boot code. Applications include mobile phones, tablets, DSC, PMP, MP3, and other applications requiring mass storage, boot storage, XiP or external cards. The UFS standard is a simple, but high-performance, serial interface that efficiently moves data between a host processor and mass storage devices. USF transfers follow the SCSI model, but with a subset of SCSI commands.The Arasan UFS IP family consists of Host controller IP, Device controller IP, and MPHY.
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Flash SATA Disk /mSATA SATA 3 SLC,MLC
FSA 300 Series
*SATA III (6.0Gb/s) interface*Capacity: SLC 1 GB to 64 GB, MLC 4 GB to 128 GB*iSMART disk health monitoring*Intelligent error recovery system*Write protection security*Anti-vibration mechanical design*Excellent data transfer speed*Zero mechanical interference*JEDEC standard MO-300B dimension
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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LPDDR
A large number of LPDDR sockets have been developed to cover the wide variety of ball I/O configurations. This catalog supports the JEDEC 209 Standard configuration.
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Detective Logic Analyzer
DDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsRow Hammer Analysis for potential data corruptionInteractions among up to 8 ranks, over two slots are analyzed.Mode Register Listing providedSupports Auto-Clock rate detect and clock stoppage Connects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Rugged Half Slim SATA3
RunCore Innovation Technology Co. Ltd.
Standard Half Slim SATA SSD JEDEC MO-297.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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test measurement unit
ITC59100 Rg/Qg
The ITC59100 Test Measurement Unit (TMU), which plugs into the ITC59000 Test Platform, performs gate charge (Qg) measurements that conform to MIL-STD-750C, Notice 2, Method 3471 and JEDEC Standard JESD24-2. In addition the ITC59100 TMU performs an internal gate resistance (Rg) test method that conforms to JEDEC Standard JESD24-11.
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Memory Tester for DDR4 DIMMS
RAMCHECK LX
USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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±6 kV ANSI/ESDA/JEDEC 2-Pin HBM Tester
HBM-S1-B
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) 2-pin tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*Optionally available upgrade for all HPPI TLP-3010C, 4010C, 8010A, and 8010C hardware systems and software (upgrade on request)*Suppression of trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT voltage and DUT current sensor for real time voltage and current monitoring*Integrated DC test DUT switchIntegrated hardware 50 Ω trigger output for high speed digital oscilloscopesIntegrated overvoltage protection of voltage sense and DC test interfaces for oscilloscope and SMU protection during high voltage HBM testing*Fast and efficient HBM measurements including transient waveform data management using the HPPI TLP software*Compact size 145 mm x 82.5 mm x 44 mm
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DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
