Showing results: 511 - 525 of 533 items found.
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Marposs S.p.A.
Marposs complements its geometric measurement solutions with solutions for non-destructive testing using eddy current technology.The testing options can be divided in three large groups:Material integrity test, to check for the presence of defects (cracks, porosity, blow holes, inclusions) on the surface and in the layer just below the surface.Material properties test, to check if the thermal cycles (hardening, hardening and tempering, annealing, stress relieving, etc.) have been performed correctly. Material identification checks are done to sort parts with the same geometry but made with different materials.Thread inspection to check if the treading has been carried out and its quality.In addition to the non-destructive checks performed with the eddy currents, we have developed a durometer for the conventional measurement of surface hardness, according to the Rockwell scale (HRC or HRA); which uses a diamond penetrator to measure the hardness of the sample being tested.
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CENSUS Series -
Multidyne
Working with audio is a complex endeavor. There are broadcast compliance challenges, ensuring that audio loudness thresholds are not exceeded. There are the quality control essentials that assure broadcast signal integrity. Depending on format, the number of signals to monitor and maintain range from very low to high density. MultiDyne acquired Census Digital in 2020 to problem-solve these broadcast and production audio challenges. MultiDyne’s rackmounted CENSUS Series provide reliable confidence monitoring for studios, mobile production and broadcast operations. Each addresses signal density needs for SDI, analog, AES/EBU,MADI or Dante IP audio, and simplifies how engineers visually and aurally monitor individual audio channels, adjust loudness levels and downmix channels. A consistent front panel design and intuitive UI assures a familiar user experience across all models while extracting audio information, setting key parameters and maintaining quality control.
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DCR822 -
Lectrosonics, Inc.
The DCR822 compact 2-channel digital receiver with analog and digital audio outputs utilizes the Lectrosonics signature digital architecture with remarkable audio quality and ultra-low latency. The receiver includes an extended operating range rivaling the best analog and Digital Hybrid Wireless® systems with continuously tunable tracking filters covering 470.100 - 614.375 MHz. The innovative Vector Diversity technology raises the bar for digital transmission integrity with two RF front ends per channel, and a unique phase-matching system. The extremely robust RF front ends of the receiver will hold up in severe RF environments and close carrier spacing, whether analog or digital. The DCR822 has a flexible output routing scheme, allowing a variety of applications including Talkback. And, a digital recorder at 24 bits, 48 kHz is included – and records up to 4 audio tracks on a front-mounted microSD card.
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National Technical Systems
In vibration testing of high value aerospace hardware, over testing of light, high performance structures is a great concern. Discrepancies between the mechanical impedances and the force capabilities of the mounting structure and the vibration shaker can cause catastrophic structural and functional problems to test item. The effectiveness of the radar depends on it retaining its structural integrity over the entire surface of the antenna and that all its electronics are a) tested at, or near levels they will experience in its service life and b) the resonance of various parts of the radar follow those of the model. Consequently, the vibration test lab required 60 data channels to accurately verify the design of the instrument and its ability to withstand launch, cruise and deployment loads. To avoid over testing, NTS used Force Limiting Test Process using four force transducers to prevent exceeding total load of 1000 pounds.
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1824 LP -
Standard Electric Works Co., Ltd
● Microprocessor-controlled.● Measures Earth Resistance without the need for poles in the ground or external measuring wires.● Earth measurement uses the real earth current path and the current generated by the electric network, without the need for any disconnection.● The Earth Resistance displayed is exactly the earth resistance that the earth current will need to go through if an earth fault occurs. (you do not need to add all the bonding points and connection paths)● Displays voltage supply at the transformer(Line to Neutral), without loading the transformer.● Single one smart push button operation; ON, Scroll through results and menus.● Checks wiring integrity (LEDs).● Auto-off / Auto-ranging (software range).● Color-coded test leads.● Combined prospective short circuit current, loop, and earth tester.● Loop test for L-E and PSC between L-N.● Voltage test L-N.● Display can be customized for large orders.
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D9010AUTP -
Keysight Technologies
- Set up your scope to show CAN, CAN FD, CAN XL, LIN, FlexRay, and SENT protocol decode in less than 30 seconds- Support CAN XL protocol trigger and decode of the SIC mode (or slow mode) signal in the arbitration phase as well as the FAST mode signal in the data phase- Get access to a rich set of integrated software-based protocol-level triggers- Save time and eliminate errors by viewing packets at the protocol level- Use time-correlated views to quickly troubleshoot serial protocol problems back to their timing or signal integrity root causeThis application (for Infiniium Oscilloscopes) includes a suite of configurable protocol-level trigger conditions specific to CAN, CAN FD, CAN XL, LIN, FlexRay, and SENT. When serial triggering is selected, the application enables software-based triggering. Application supports CAN-dbc symbolic debug.
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Ironwood Electronics
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Ironwood Electronics
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Analog Devices Inc.
SPI (Serial peripheral interface) is one of the most widely used interfaces between microcontrollers and peripheral ICs such as sensors, ADCs, DACs, shift registers, SRAM, and others. Analog Devices has your isolated SPI bus covered with our dedicated SPI digital isolators which support this synchronous, full duplex master-slave-based interface. Options include devices built with ADI's proven iCoupler® technology and offering a small footprint, simple design-in, fast speeds, and high data integrity, as well as integrated µModules which require no external components. Our SPI isolator solutions increase performance and reduce board space. This simple, compact solution is ideal for isolated SPI data requiring communication across different ground potentials or through large common mode transients often found in Industrial PLCs (programmable logic controllers) and Instrumentation and data acquisition systems.
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LEON Bench -
Konrad Technologies GmbH
The LEONBench test system is a flexible and scalable test system that features an excellent signal integrity and a high-quality fixture interface. This is achieved by combining a cableless connection from ABex modules to Virginia panel interface connectors. The system is optimized for high pin count test applications. Furthermore, it can be equipped with vacuum and pneumatic. Support for multi-level contact fixtures enables separate contact levels for FCT and ICT. The Konrad ITA (Interchangeable Test Adapter) frame allows various fixture houses all over the world to build custom fixtures for the LEONBench. Up to 15U additional rack space allows adding a bunch of high-performance measurement devices from various manufactures. An integrated power distribution unit takes care about power on and off sequencing.As part of the LEON Family, LEONBench is based on the ABex platform which directly incorporates Konrad analog bus technology and PXI/PXIe in one chassis.
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Model 54141A -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Exceptional dynamic range and analog signal integrity- Xilinx® Kintex® UltraScale™ FPGAs- Compatible with several VITA standards including: VITA 66.5 and VITA 67.3C- Supports VITA 49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- uSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Navigator® BSP for software development- Navigator® FDK for custom IP development- SPARK® fully-integrated development system
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AIM GmbH
AIM’s PANAVIA test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core design with one processor for real time bus protocol support, massive memory and IRIG-B time code encoder/decoder functions are standard. AIM delivers versions of our modules with extended temperature range and conformal coating. With 8 Tx and 8 Rx channels per module, functions include autonomous transmit sequencing, continuous clock and data transmissions, host controlled double buffering, programmable interrupts, data selection on specific tag identifier, selectable triggers on data and/or tags with full protocol error injection/detection, real time bus recording and time stamping to ensure your bus integrity. Each module is delivered with a Board Support Package (BSP) comaptible to the legacy PCI and cPCI hardware modules.
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SG1000B/PR1000A -
Praxsym
The SG1000 Signal Generator and PR1000A Preamplifier have been designed to simplify the measurement of shielding integrity in a shielded enclosure. When coupled with a high stability spectrum analyzer and an appropriate selection of test antennas, the SG1000/PR1000A combination can measure shielding effectiveness at all of the NSA 94-106 (supersedes NSA 65-6) defined test frequencies from 1 kHz to 10 GHz.The PR1000A amplifies the received signal from the test antenna and overcomes the high noise figure of the companion test receiver or spectrum analyzer. The PR1000A will ensure that the system noise figure will be less than 4.5 dB at all test frequencies from 1 kHz to 10 GHz. When used with a spectrum analyzer measurement bandwidth of 100 Hz, the system exhibits a sensitivity of -150 dBm at the test antenna output.To overcome high cable loss between the test antenna and the PR1000A assembly at 10 GHz, a remote low noise pre-amplifier (Praxsym PN 310-010091-001) is mounted directly onto the 10 GHz antenna.
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BAW -
Macom Technology Solutions Holdings Inc.
MACOM’s BAW product portfolio is ideal for high performance Industrial, Aerospace, Defense, and Communications applications that require critical frequency filtering. Our high-performance RF filters enable our customers manage signal integrity in the 1 to 6 GHz frequency range. Bulk Acoustic Wave Resonators consist of two metal electrodes above and below a layer of a piezoelectric material. The piezoelectric material converts an electrical signal to a mechanical signal and vice versa. The metal electrodes provide the connections to/from the piezo material. The frequency at which resonance occurs depends on the thickness of the combined metal-piezo-metal stack. Advances in thin-film piezoelectric fabrication have enabled BAW resonators to meet RF filtering challenges up to 6000 MHz using standard MEMS fabrication process. High-performance BAW resonators-based RF filters are made of piezoelectric material having high Q-factor (>3000) and high coupling coefficient. Currently, no competitive technology provides the same high performance for RF filter applications when compared to BAW resonator-based RF filter up to 6000 MHz for the same size and cost.
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Ironwood Electronics
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
