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Showing results: 166 - 180 of 186 items found.

  • SWaP Optimized Processing and Multifunction I/O & Communications System

    NIU3A - North Atlantic Industries

    The NIU3A is a small, rugged, low-power, self-contained processing and multifunction I/O system preconfigured with 24-CH programmable Discrete I/O, 8-CH ARINC 429/575, 4-CH CANBus and 2-CH MIL-STD-1553 functions. The NIU3A can also be configured with up to three smart Configurable Open Systems Architecture™ (COSA®) function modules. The NIU3A boasts Dual or Quad Core ARM Cortex®-A53 processors for customer software applications and I/O and communications management. The NIU3A is configured with two 10/100/1000BASE-T (GbE) Ethernet ports and an RS-232 port for maintenance / diagnostic or configuration interface. Ideally suited for rugged Mil-Aero applications, the NIU3A delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

  • Modular 6U Processor Board

    VP62109 - LinkedHope Intelligent Technologies Co.,Ltd.

    VP62109 is a 6U VPX board based on Intel® 4th Gen i3/i5/i7 2-core or 4-core embedded CPU, with modular design. Supporting up to 4-core Intel® i7 4860EQ processor, VP62109 is able to perform vector operation and floating-point arithmetic that require high throughput. Besides, VP62109 supports Intel® Turbo Boost, with the processing speed of CPU up to3.4GHz. The high-performance CPU and the Turbo Boost technology leave no worries for extra cost and complexity of system settings.VP62109 provides 4x PCIe 3.0 x4 for VPX Data Plane communication, 4x GbE for VPX Control Plane communication. Rich data exchange interfaces on VP62109 make it easy to build box-level or system-level solutions.

  • 3U Processor Board

    CP32108 - LinkedHope Intelligent Technologies Co.,Ltd.

    CP32108 is a compact modular 3U CPCI single board computer compliant with CompactPCI specification. Based on Intel® 6th Skylake-H platform, CP32108 supports a variety of processors. On CP32108, there are rich interfaces like SATAIII, USB3.0, GbE, PCIe2.0, etc. In addition, CP32108 can provide up to 1TB SSD storage with mSATA interface.CP32108 applies high-speed CPCI connector on J2, in order to transmit PCIe2.0, USB3.0, SATAIII signals. CP32108 supports up to x4 PCIe to rear with flexible PCIe configuration including 1 x4, 2 x2, 1 x2+2 x1 or 4 x1.CP32108 integrates Intel® Gen9 HD Graphics P530 display controller, and supports various display outputs like eDP, DP and HDMI(with resolution up to 2560x2160 @24Hz, 24 bpp).

  • 3U VPX Single-Board Computer

    VP32003 - LinkedHope Intelligent Technologies Co.,Ltd.

    VP32003 is a high-performance 3U VPX single-board computer, compatible with PC architecture, especially it is a China Local-design, Local-assembling product. VP32003 is an all-in-one design, supporting the 3rd generation of Intel core processors and QM77 chipset; also supports up to 16 GB onboard DDR3 memory and up to 32GB Disk-On-Modules, these features ensure its stable operation in strong shock and vibration environments. VP32003 supports a XMC interface and various I/O interface such as two SATA600 channels, two Base-BX/T GbE, RS232/422/485 interface and two USB2.0 interface.The data plane of VP32003 uses Serial RapidIO 2.0 bus, which can be configured as follows: 2x SRIOx4, 4x SRIOx2, 8x SRIOx1. This feature makes it suitable for either distributed switching system or centralized switching system.

  • 6U VPX Board

    VP62009 - LinkedHope Intelligent Technologies Co.,Ltd.

    VP62009 is a 6U VPX board based on Intel® Xeon® D-15xx processors, with more than 7-year life cycle. Supporting up to Intel® Xeon® D-1577 (16x 1.3GHz) processor, VP62009 is able to perform vector operation and floating point arithmetic that require high throughput. Besides, VP62009 supports Intel® Turbo Boost, with the processing speed of CPU up to 2.7GHz. The high-performance CPU and the Turbo Boost technology leave no worries for extra cost and complexity of system settings.VP62009 provides 2x 10 Gigabit Ethernet for VPX Data Plane communication, 2 x8 PCIe for VPX Expansion Plane communication, 4 GbE for VPX Control Plane communication. Rich data exchange interfaces on VP62009 make it easy to build box-level or system-level solutions.

  • 1U Rackmount Network Appliance Platform With LGA1150 Socket Intel® Xeon® E3/Core™ Family Processor, Intel® C226 And Up To 24 LANs

    NA570 - Axiomtek Co., Ltd.

    NA570 1U rackmount Network Security Platform, supports the 4th generation Intel® Xeon® E3 / Core™ processor family, formerly codenamed "Haswell". NA570 offers greatly improved performance and reduced power consumption base on the new Intel architecture marked improvements in power efficiency and performance. The system supports up to 32GB DDR3 1600 non-ECC / ECC (only NA570) memory. NA570 support 4 pairs of LAN Bypass function. Bypass ports allow users to experience uninterrupted network traffic even if a single in-line appliance hangs or sudden shutdown. Expandable LAN Modules via the PCIe 3.0, support up to 24 GbE ports, or up to 4 ports at 10GbE, and a future upgrade to 40GbE, port density and optional networking ports to suit your demands.

  • Rugged Embedded Multifunction I/O System with 10 GB Fiber Optic & 1 GB Copper Ethernet Switch

    NIU3E - North Atlantic Industries

    The NIU3E is a small, rugged, low-power, self-contained multifunction I/O processing system preconfigured with 24-CH programmable Discrete I/O, 8-CH ARINC 429/575, 4-CH CANBus and 2-CH MIL-STD-1553 functions and incorporates an Ethernet switch module that offers four (4) 10GBase-SR multimode fiber optic ports and sixteen (16) 10/100/1000Base-T Ethernet ports. The NIU3E can also be configured with one smart Configurable Open Systems Architecture™ (COSA®) function module. The NIU3E boasts a Dual or Quad Core ARM A53 processor for customer application and I/O and communications management. The NIU3E is configured with two 10/100/1000Base-T (GbE) Ethernet ports and an RS-232 port for maintenance / diagnostic or configuration interface. Ideally suited for rugged Mil-Aero applications, the NIU3E delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.

  • 6U VPX Board

    VP62003 - LinkedHope Intelligent Technologies Co.,Ltd.

    VP62003 is a 6U VPX board based on Intel® Xeon® D-15xx processors, with more than 7-year lifecycle. Supporting up to Intel® Xeon® D-1577 (16x 1.3GHz) processor, VP62003 is able to perform vector operation and floating point arithmetic that require high throughput. Besides, VP62003 supports Intel® Turbo Boost, with the processing speed of CPU up to 2.7GHz. The high-performance CPU and the Turbo Boost technology leave no worries for extra cost and complexity of system settings.VP62003 provides 4x Rapid I/O (SRIO) x4 for VPX Data Plane communication, 2x 8 PCIe for VPX Expansion Plane communication, 4x GbE for VPX Control Plane communication, and 2x 10Gb SFP+ in front I/O for remote data transmission and communication. Rich data exchange interfaces on VP62003 make it easy to build box-level or system-level solutions.

  • PCI-X Carrier For AMC Modules

    PCI102 - Vadatech Inc

    The PCI102 allows testing of AMC.1, AMC.2 and AMC.3 modules in a PC environment during development and manufacturing; reducing the costs associated with maintaining different platforms. The PCI101 is a PCI-X edge style carrier with PCIe x4 lanes going to the AMC module. The AMC.1 module connects to the host PC’s PCI-X bus via a PCI-X to PCI ebridge. The AMC.2 module’s GbE ports are routed to RJ-45s. The AMC.3 differential pairs are routed to two SATA connectors. ThePCI102 is available with an optional VT001 IPMI controller which can test the AMC IPMI management functionality. The dual I2C bus connectors allow for connecting any I2C bus to any other I2C bus as well as being able to debug and monitor the I2C bus traffic. Provides two current sense resistors to measure the payload power as well as the management power of the AMC. The PCI102 can be powered on the bench without the host PC.

  • 6U CompactPCI 6th/7th Gen Intel® Core™ i7/i3/Celeron® Processor Blade

    cPCI-6630(KL) Series - ADLINK Technology Inc.

    The ADLINK cPCI-6630 Series is a 6U 4/8 HP CompactPCI® processor blade featuring a 6th/7th generation Intel® Core™ i7/i3/Celeron® processor and Mobile Intel® HM170 PCH with DDR4-2133 non ECC memory up to 32GB via 2 SODIMM sockets. The single-slot 4HP cPCI-6630 features front panel I/O including 1x DVI-I, 1x DVI-D, 3x GbE, 3x USB 3.0, 1x USB 2.0, 1x RJ-45 COM port and 1x PS/2 KB/MS. The dual-slot 8HP cPCI-6630D provides one DB-9 COM port and one 32-bit/33MHz PMC space in additional to single slot version's front panel IO. Available storage options for both the cPCI-6630 and cPCI-6630D include a 1x 2.5" SATA drive space and 1x 7-pin SATA connector. In addition, the cPCI-6630 Series offers an onboard CFast slot with CompactFlash slot as option.

  • 3U VPX Single Board Computer

    VP32002 - LinkedHope Intelligent Technologies Co.,Ltd.

    VP32002 is a high-performance 3U VPX single-board computer, compatible with PC architecture, especially it is a China Local-design, Local-assembling product. VP32002 is an all-in-one design, supporting the 3rd generation of Intel core processors and QM77 chipset; also supports up to 16 GB onboard DDR3 memory and up to 32GB Disk-On-Modules, these features ensure its stable operation in strong shock and vibration environments. VP32002 supports a XMC interface and various I/O interface such as two SATA600 channels, two Base-BX/T GbE, two UARTs and two USB interface.The board provides a flexible PCI-Express bus interface to the backplane. The interface can be configured as follows: 1 Port x8 PCIe, 2 Ports x4 PCIe, 4 Ports x2 PCIe. This feature makes it suitable for either distributed switching system or centralized switching system.For the user to quickly form application solutions, LinkedHope provide VP32002 a complete driver package including Windows, VxWorks, Linux and QNX.

  • Computer-On-Module

    CM22301 - LinkedHope Intelligent Technologies Co.,Ltd.

    CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.

  • SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9

    LEC-iMX6R2 - ADLINK Technology Inc.

    The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W. The Modules are used as building blocks for portable and stationary embedded systems. The core CPU and support circuits, including DRAM, boot flash, power sequencing, CPU power supplies, GBE and a single channel LVDS display transmitter are concentrated on the Module. The Modules are used with application specific Carrier Boards that implement other features such as audio CODECs, touch controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while still maintaining low costs, low power and small physical size. To stress on its low power consumption feature, ADLINK has named SMARC products as LEC (Low Energy Computer on module) series.

  • OpenVPX CPU Blade with 4th Generation Intel® Core™ Processor

    MIC-6311 - Advantech Co. Ltd.

    Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6314 - Advantech Co. Ltd.

    The MIC-6314 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ embedded platform with increased cache size and efficiency, as well as instruction set improvements. The MIC-6314 provides two configurable PCIE x 8 ports in the VPX data plane and two PCI Express ports x8 lanes in the VPX expansion plane to enable the highest performance available in the 6U VPX form factor compute intense applications. These PCIE interfaces offer high speed up to PCIE gen. 2 (5Gb/s) throughput, low latency, scalable, error recoverable deterministic interconnectivity to the mainstream peripherals and I/O cards such as DSP and FPGA cards. The PCIE widths and ports on the data plane and the extension plane of MIC-6314 is user configurable, which make MIC-6314 capable to replace the PCIE switch blade in a small system. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6314 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a SSD socket is also available for a cost-efficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6314 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The Intel® next generation graphics engine Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using VGA and 2 DVI ports on MIC6314. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. A PCIEinterface is reserved for the optional M.2 high speed storage.Besides the modern M.2 storage, three SATA III one SATA II and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485selectable) can be leveraged to interface to legacy devices and consoles.

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