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Showing results: 181 - 186 of 186 items found.

  • COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors

    Express-TL - ADLINK Technology Inc.

    ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • Desktop Network Appliance Platform With Intel® Atom® Processor C3338/C3558/C3758 And Up To 10 LANs

    NA362 - Axiomtek Co., Ltd.

    The NA362 is powered by the low power consumption Intel® Atom™ processor C3338/C3558/C3758 (Codename: Denverton). In addition to six 10/100/1000 Mbps LAN ports (Intel® i210 Ethernet controller), this desktop network appliance also comes with four 10 GbE SFP+ fiber ports for high bandwidth and long-distance communications. The NA362 is an excellent choice for a wide array of network applications including UTM, VPN, firewall, gateway, SD-WAN and vCPE with its enhanced security and performance. The Denverton–based NA362 features the Intel® QuickAssist Technology (Intel® QAT) for accelerated data processing including symmetric encryption and authentication, asymmetric encryption, digital signatures, RSA, DH, ECC, and lossless data compression. Furthermore, it also supports the Intel® Data Plane Development Kit (Intel® DPDK), which greatly boosts packet processing performance and throughput, allowing more time for data plane applications. The NA362 comes with either two or four DDR4 R-DIMM/U-DIMM with 64GB or 128GB of non-buffer non-ECC/ECC memory. The slim-type network communication platform is equipped with one 2.5" SATA3 HDD and one mSATA for sufficient storage. It also supports wireless communication of Wi-Fi, 3G, LTE through a PCI Express Mini Card slot. I/O options include two USB 2.0 ports and a serial console port. To ensure reliable operation, the 10-port network platform supports watchdog timer. Moreover, it also supports mainstream Yocto, Linux, Windows® Server 2012 R2, and Windows® Server 2016 operating systems.

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • 6U CompactPCI 4th Generation Intel® Core™ i3/i5/i7 Processor Blade with ECC support

    MIC-3396 - Advantech Co. Ltd.

    Using 4th generation Intel® Core™ i3/i5/i7 processors based on 22nm process technology supporting up to four cores / eight threads at 2.4GHz and 6MB last level cache, the MIC-3396 blade boosts computing performance deploying the latest virtualization, techniques and CPU enhancements. Onboard soldered low voltage DRAM (1.35V) with ECC support and optional memory expansion via an SODIMM socket extend the memory to a maximum of 16GB supporting the most demanding applications in high performance or virtualized environments. Dual channel design and memory speeds up to 1600MT/s along with increased cache size and cache algorithms guarantee maximum memory performance. Combined with the powerful Intel® QM87 chipset, the 4th generation Intel® Core™ processors offer improved I/O performance by leveraging 5GT/s DMI and 3rd generation PCIe interfaces. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines such as the MIC-3666 dual 10GE XMC card. With SATA-III support and up to 7Gbps I/O. the latest enhancements in storage technology such as high speed SSDs or traditional HDDs can be used on the MIC-3396. Five gigabit Ethernet ports based on Intel® GbE controllers for front and rear,including two PICMG 2.16, ensure best in class network connectivity The processor’s integrated enhanced graphics engine (Iris) offers twice the performance over previous generations. With triple independent display support, the MIC-3396 is an ideal fit for demanding workstation applications. RASUM features integrated in the CPU and chipset combined with PICMG 2.9, IPMI-based management make the MIC-3396 a highly available and reliable computing engine. The RIO-3316 RTM module supports one PS/2 connector with both keyboard and mouse ports, one USB 3.0, two USB 2.0 ports, two RS-232 ports, two SATA ports, two DVI ports, and two Gigabit Ethernet ports. In case of the SATA disk drives and SATA RAID support of the QM87 do not meet performance and reliability requirements, the RIO-3315 SAS version supports a 4-port SAS controller with RAID and fail over support.

  • Robust DIN-rail Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Dual Modular I/O Expansion Design

    ICO500-518 - Axiomtek Co., Ltd.

    The ICO500-518 featuring flexible I/O expansion, sufficient storage and network capability is well-suited for transportation, public utility, smart building, solar energy, as well as factory automation fields. By bundling Axiomtek’s intelligent AMS software solution for device monitoring and remote management, the ICO500-518 is able to implement environment signal monitoring, edge analytics and remote device management in the IIoT world. It has also passed the EN 50121-4 certified for railway applications. The rugged high computing edge gateway has scalable CPU options with the 7th gen Intel® Core™ i7/i5/i3 (codename: Kaby Lake-U) or Celeron® processors and supports one DDR4-2133 SO-DIMM slot for up to 16GB of system memory. The ICO500-518 features basic benefits whether low latency or cost efficiency; moreover, offering much more other advantages for IIoT applications. It not only supports multiple OT communication protocols that can significantly reduce the effort required to collect data from different field devices, but also provide local intelligence to allow operators respond faster to events that happen at the remote site and minimizes latency between edge devices and the cloud server. Also, with TPM 2.0, this IIoT edge gateway provides tailored levels of security depending on the application needs. Axiomtek’s ICO500-518 has two optional plug-in I/O module slots and four different types of I/O modules to meet different customization requirements. An integrator can choose from four available I/O modules including an 8-port GbE LAN module; 8-port isolated RS-232/422/485 module; 4-port isolated RS-232/422/485 with one isolated DIO (8-in/8-out) module; 8-port isolated CANbus 2.0A/B module to customize the ICO500-518 to fit its specific project requirements. Additionally, the ICO500-518 offers flexible communication options - two full-size PCI Express Mini Card slots and one external SIM card slot for 4G/3G, GPS, LoRaWAN, Wi-Fi and Bluetooth connections. Furthermore, it supports swappable 2.5-inch SATA drive and external CFastTM card to provide sufficient storage capability. For withstanding harsh operating conditions, this IP40-rated embedded box PC offers an extended operating temperature range of -40°C to 70°C, a wide range DC input of 12V to 48V with OVP, UVP, OCP, RPP power protection, and up to 3G vibration endurance.

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