Filter Results By:

Products

Applications

Manufacturers

Density

measure of a space to it's matters.

See Also: Flux Density


Showing results: 2761 - 2775 of 2913 items found.

  • Pack (IP) Modules

    IP & MM - Data Patterns Pvt. Ltd.

    Industry Pack (IP) modules are international standards as per ANSI-VITA 4.These are mezzanine modules of approximately the size of a business card (99mm x 45mm). Featuring a 16 or 32 bit wide I/O interface and 50 user defined I/O pins, these modules are ideal for providing the capability for high density I/O.IP carriers provide multiple slots on a single carrier. This allows multiple IP modules to be provided on a single slot in a Compact PCI / VME / VXI / PCI card cage.Industry Pack modules provide some unique advantages in system integration. These include:

  • PXI BRIC8 FIBO Matrix Dual 248x4 2pin Brkout

    40-592A-118 - Pickering Interfaces Ltd.

    The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units. Typical faults that can be simulated are open-circuits, short circuits to ground or battery, or short-circuits between input/output lines. Typical applications are in automotive and aerospace industries which involve safety or mission critical systems that have to behave predictably when cabling or sensor faults occur.

  • PXI BRIC4 FIBO Matrix Dual 124x4 2pin Brkout

    40-592A-014 - Pickering Interfaces Ltd.

    The 40-592A FIBO (Fault Insertion Break-Out) Matrix Module is a large-scale high density switching matrix based on the Pickering BRIC format. The fault insertion BRICs are designed for applications requiring the simulation of a variety of faults in complex, high pin count, applications involving sensors and control units. Typical faults that can be simulated are open-circuits, short circuits to ground or battery, or short-circuits between input/output lines. Typical applications are in automotive and aerospace industries which involve safety or mission critical systems that have to behave predictably when cabling or sensor faults occur.

  • DC Power Supply

    62000H - Chroma Systems Solutions, Inc.

    Chroma’s new 62000H Series of programmable DC Power Supplies offer many unique advantages for telecom, automated test system & integration, industrial, battery charge & simulation for hybrid cars and solar panel simulation. These advantages include a high power density of 15KW in 3U, precision readback of output current and voltage, output trigger signals, as well as the ability to create complex DC transients waveforms to test device behavior to spikes, drops, and other voltage deviations. For high power applications, parallel up to 10 units for up to 150kW.

  • 128 Channel Digital I/O Modular PXI Card

    GX5733 Series - Marvin Test Solutions, Inc.

    The GX5733 is a 3U modular digital I/O card that offers up to 128 I/O channels. Designed for ATE, data acquisition, or process control systems where a large number of discrete I/O channels are required, the GX5733 offers the highest channel density and flexibility in the industry for a single-slot, 3U PXI plug-in board. 96 channels support TTL levels and an additional 32 I/O channels can be customized by installing one of Marvin Test Solutions' GX57xx series I/O modules. Alternatively, the remaining port can be configured to support 32 TTL channels.

  • Multi Protocol Boards

    Excalibur Systems, Inc.

    The EXC-4000 carrier board series was developed to meet the needs of avionic testers for multi-protocol integrated, digital bus testing. Modules may be selected out of a growing list which currently includes MIL-STD-1553/1760, MMSI, H009, ARINC-429, ARINC-708/453, Serial (232/422/485), Discrete and CAN bus. Additionally, an IRIG B decoder implements a global time stamp relative to the IRIG B pulses. The need for higher density, different protocols, and multi-channel on one integrated test card has made the EXC-4000 series very successful.

  • Hall Effect Measurement system

    HMS-3000 - ECOPIA

    Hall Effect Measurement System is very useful for measuring Carrier Concentration, Mobility, Resistivity and Hall Coefficient that should be pre-checked in order to grasp the electrical specifications of semiconductor device. Therefore, it is essentially required system to understand the electrical characteristics of semiconductor device.Ecopia’s HMS series consist of constant current source , terminal conversion system by Van der Pauw technique, low temperature(77K) test system and magnetic flux density input system. So, it is well-established system that has all the things needed to Hall Effect Measurement System.

  • PXI/PXIe RF Matrix, 16x2, 100 MHz, 75 Ω SMB

    40-728A-101 - Pickering Interfaces Ltd.

    The 40-728A-101 (PXI) and 42-728A-101 (PXIe) are 16x2 75 Ω RF matrices with SMB connectors. The 4x-727A/728A/729A range are high density RF matrix modules suitable for switching up to 300 MHz in 50 Ω or 100 MHz in 75 Ω. They are available in 50 Ω or 75 Ω versions with SMB connectors or in 50 Ω versions with a multiway connector. They provide a simple and scalable bidirectional matrix for RF signals and are intended for the construction of high performance switching systems. All X and Y connections have isolation switches.

  • 130/180 MS/s Dual Channel PXI Express Digitizer for Frequencies up to 175 MHz

    PXIe-1803 - Astronics Corporation

    This 130/180 MS/s Dual Channel PXI Express digitizer provides the best speed and performance available for input frequencies up to 175 MHz.With exceptional signal integrity, high density and modularity, and channel synchronization options, this new digitizer provides massive functionality in a compact form factor.Key features include:Dual 14/16-bit digitizer configurable as separate or fully synchronized channelsWaveform bandwidths of 65-175 MHz (typical)64M words of waveform memory per channelExternal clock input for synchronization up to 180 MHz250 μV Measurement AccuracyNoise Floor and RelativeAccuracy as Precise as 0.006%

  • LXI Low Thermal EMF Matrix 1-pole 42x33

    60-510-002 - Pickering Interfaces Ltd.

    The 60-510 is a high density 1-pole matrix module controlled via LXI. It has excellent thermal stability and substantially reduced thermal EMF figures when compared to a conventional switching matrix. Typical applications include signal routing in ATE, selecting thermocouple inputs, switching amplifier gain circuits and high accuracy DC micro-volt measurements. Ruthenium reed switches are used because of their good low level switching capability. They also have a very long life with excellent contact resistance stability, minimal wetting current and low thermal offset.

  • sbRIO-9264, Non-Enclosed, 25 kS/s/ch Simultaneous, ±10 V, 16-Channel C Series Voltage Output Module

    781119-01 - NI

    Non-Enclosed, 25 kS/s/ch Simultaneous, ±10 V, 16-Channel C Series Voltage Output Module - The sbRIO‑9264 is a simultaneously updating analog output module that accommodates higher‑channel‑count systems. Higher density modules conserve chassis space, which leaves room for other measurement types. Each channel has its own digital‑to‑analog converter. The spring-terminal version of the sbRIO‑9264 uses a 36‑position connector for the output channels, and each channel has a ground connection. Non-enclosed modules are designed for OEM applications.

  • DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF

    W4643A - Keysight Technologies

    The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.

  • DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF

    W4641A - Keysight Technologies

    The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.

  • PCI Module

    PCI-6713B-4IP - ALPHI Technology Corporation

    The PCI-6713B-4IP module provides a high performance flexible I/O scheme, thatsupports industry standard Industry Packs™. For application requiring low cost,high density I/O or unique combinations, the 6713B-4IP is the ideal solution. The local 6713B DSP can be used to simply move data to and from the PCI bus or provide pre processing functions such as local PID controls, FFT’s, digital filtering, etc. Custom application software can be downloaded to the DSP via the PCI bus. A very low cost, non-intelligent version is also available, PCI-SIP.

  • High-Density Precision SMU Mainframe (4 Slots, 1U)

    PZ2100A - Keysight Technologies

    The Keysight PZ2100A is the precision source / measure unit (SMU) mainframe that uncompromisingly and densely integrates 20 SMU channels into valuable 1U height, full width, rack space with flexible module options at their best performance. It supports a variety of resources such as the Keysight PZ2110A Precision SMU, PZ2120/21A High-Speed SMUs, and PZ2130/31A High Channel Density SMUs with multiple functions such as pulser and digitizer, as well as precise voltage / current sourcing and measuring to adapt to a wide range of application requirements. The PZ2100A has 4 slots and allows any mixed module configuration for flexible scalability.

Get Help