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Showing results: 2821 - 2835 of 2913 items found.

  • LXI Optical Switching - 2:1 Multiplexer Plugin Module

    65-281-381 - Pickering Interfaces Ltd.

    The 65-281-381 2:1 multiplexer is part of the 65-280 and 65-281 ranges of optical plug-in modules offering matrix & insert/bypass or multiplexer & SPST topologies respectively with all models based on MEMS fiber optic switches and available in various populations per plugin. In addition, a choice of different connector styles to suit most applications is offered: FC/APC (for optimal performance), FC/PC, SC/PC and ST for general applications and LC for high density applications. They use MEMS (Micro-Electro-Mechanical-Systems) based optical switches to route signals between terminals by redirecting the optical signal. This is achieved using micromechanical mirrors driven by a highly precise mechanism activated via an electrical control signal.

  • LXI Optical Switching - 8:1 Multiplexer Plugin Module

    65-281-323 - Pickering Interfaces Ltd.

    The 65-281-323 8:1 multiplexer is part of the 65-280 and 65-281 ranges of optical plug-in modules offering matrix & insert/bypass or multiplexer & SPST topologies respectively with all models based on MEMS fiber optic switches and available in various populations per plugin. In addition, a choice of different connector styles to suit most applications is offered: FC/APC (for optimal performance), FC/PC, SC/PC and ST for general applications and LC for high density applications. They use MEMS (Micro-Electro-Mechanical-Systems) based optical switches to route signals between terminals by redirecting the optical signal. This is achieved using micromechanical mirrors driven by a highly precise mechanism activated via an electrical control signal.

  • LXI Optical Switching - 4:1 Multiplexer Plugin Module

    65-281-342 - Pickering Interfaces Ltd.

    The 65-281-342 4:1 multiplexer is part of the 65-280 and 65-281 ranges of optical plug-in modules offering matrix & insert/bypass or multiplexer & SPST topologies respectively with all models based on MEMS fiber optic switches and available in various populations per plugin. In addition, a choice of different connector styles to suit most applications is offered: FC/APC (for optimal performance), FC/PC, SC/PC and ST for general applications and LC for high density applications. They use MEMS (Micro-Electro-Mechanical-Systems) based optical switches to route signals between terminals by redirecting the optical signal. This is achieved using micromechanical mirrors driven by a highly precise mechanism activated via an electrical control signal.

  • LXI Optical Switching - 8x8 Matrix Plugin Module

    65-280-313 - Pickering Interfaces Ltd.

    The 65-280-313 8x8 matrix is part of the 65-280 and 65-281 ranges of optical plug-in modules offering matrix & insert/bypass or multiplexer & SPST topologies respectively with all models based on MEMS fiber optic switches and available in various populations per plugin. In addition, a choice of different connector styles to suit most applications is offered: FC/APC (for optimal performance), FC/PC, SC/PC and ST for general applications and LC for high density applications. They use MEMS (Micro-Electro-Mechanical-Systems) based optical switches to route signals between terminals by redirecting the optical signal. This is achieved using micromechanical mirrors driven by a highly precise mechanism activated via an electrical control signal.

  • Ozone Generators & Systems

    MKS Instruments

    MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.

  • Fineliner

    MicroContact AG

    The parallel tester Fineliner enables two-sided contact with fne structures. Withvisual detection of both substrate sides and corresponding adapter position correction≥ 300μm test points can be contacted. The rigid needle adapter with a pitch of ≥ 400μmalso allows a high contact density. This results in a large test depth on the substrate.The integrated DMC reader ensures a correct test result assignment. Multiple PCB canbe tested step by step through in the X-direction of the Fineliner, further eliminatingsubstrate tolerances in the X-direction, and enabling more cost-effective adapters andmeasurement techniques. A quick-release system with identifable replacement kitsensures safe and quick retooling.The measuring technology can be defned customer-specifcally. There are 2040 pyloninterface points per side.

  • PXIe-2541, 300 MHz, 8x12 PXI RF Matrix Switch Module

    780587-41 - NI

    PXIe, 300 MHz, 8x12 PXI RF Matrix Switch Module—The PXIe‑2541 is an RF signal switching matrix. With its non-blocking design, you can simultaneously connect any row or column within the switching matrix and maximize the flexibility of your test system. Isolation relays on the module disconnect unused parts of the switching matrix to maintain RF performance and high isolation. The density and bandwidth of the PXIe‑2541 is ideal for routing signals between digitizers, function generators, and other RF generators and analyzers. For higher channel count applications, you can connect multiple PXIe‑2541 modules together to create switching matrices of 8x24, 8x36, and larger.

  • PXI-2541, 300 MHz, 8x12 PXI RF Matrix Switch Module

    778572-41 - NI

    300 MHz, 8x12 PXI RF Matrix Switch Module—The PXI‑2541 is an RF signal switching matrix. With its non-blocking design, you can simultaneously connect any row or column within the switching matrix and maximize the flexibility of your test system. Isolation relays on the module disconnect unused parts of the switching matrix to maintain RF performance and high isolation. The density and bandwidth of the PXI‑2541 is ideal for routing signals between digitizers, function generators, and other RF generators and analyzers. For higher channel count applications, you can connect multiple PXI‑2541 modules together to create switching matrices of 8x24, 8x36, and larger.

  • BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF

    W6601A - Keysight Technologies

    The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.

  • Microwave Power Modules

    S-BAND to KA-BAND - Communications & Power Industries

    Each of CPI TMD's TWT-based units is comprised of a compact power supply and mini TWT, combined into an ultra-compact, lightweight "drop-in" amplifier block. This simplifies system design and installation, increases reliability and minimizes safety hazards. The units also feature high electrical efficiency and excellent thermal management. Performance is factory set, removing the need for any user adjustments in the field and, if necessary, permitting easy field replacement of the complete unit. The product range covers S-band to Ka-band, and includes continuous wave (CW), pulsed and CW/pulsed units of extremely compact design. At only 1.7 kg with over 110 W output power, the PTXM1000 is believed to be the market’s highest power density MPM.

  • Battery Supervisors

    IBEKO Power AB

    DV Power manufactures ideal tools for maintenance, troubleshooting and performance tests on stationary batteries.Capacity testing is performed in order to detect which cells in the string should be replaced by measuring a cell voltage, temperature, inter-cell connection voltage, and specific gravity.IEEE standards for stationary battery applications also stipulate measuring these key parameters during periodic battery inspections.DV Power provides two types of instruments:BVS series – for automated monitoring of battery parametersBVR series – for manual monitoring of battery parametersIn contrast to BVS, BVR instruments can be used for the transfer of electrolyte specific gravity measurements from a density meter (DMA35) via Bluetooth. This provides a more extensive analysis of each cell in the tested battery string.

  • Wireless In-Circuit Test Fixtures

    Circuit Check, Inc.

    Higher density more complex circuit boards complicate testing requirements while smaller more tightly spaced test pads create a wiring challenge for the fixture fabricators, test engineers and maintenance personnel. Wireless fixtures solve the challenges associated with the nest of wires found in standard long wire fixtures. Wireless fixtures replace the “nest” of wires with copper traces on a multilayered printed circuit board called a Translator Board or T-Board®. Circuit Check’s wireless fixture technologies reduce test program debug and maintenance times while easing the ECO process. Thus allowing for the higher level of test performance, the ability to probe smaller denser targets and achieve ultra-high node counts.

  • Materials And Chemical Analysis

    Anderson Materials Evaluation, Inc.

    Materials characterization, failure analysis, quality control, and materials and process development services are offered.  Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.

  • Activity Detection Unit

    DG009-M1 - Teledyne Defence & Space

    Many advanced EW receivers, particularly those associated with ECM jamming systems, do not require the high resolution frequency information associated with a DFD or IFM based receiver. This is typically the case where a single pulse present within a broad frequency band is required to be detected and instantaneously down-converted to an IF band.TDS manufactures a range of Frequency Activity Detectors (FADs) also known as Activity Detection Units (ADU) which perform frequency measurement of an RF pulse and output data in as little as 15ns. The basis of these products is TDS’s ability to produce high performance broadband channelisers and integrated detectors. These devices are ideal for receivers which must operate in very high pulse density environments.

  • Outdoor Solid State Power Amplifiers

    Teledyne Paradise Datacom

    Tel​edyne Paradise Datacom’s Compact Outdoor (C) series SSPAs bring high power solid state transmit amplifiers right to the antenna’s feed. Designed for antenna-mount applicati​ons, the Compact Outdoor series SSPAs deliver the highest uplink powers available per unit volume and weight offered anywhere in solid state technology. Packaged for outdoor use, these amplifiers are entirely self-contained with onboard power supply, cooling and monitor and control systems.​​Teledyne Paradise Datacom’s High Power Outdoor (H) series SSPAs represent the latest in High Power Microwave Amplifier Technology. The SSPA package achieves the highest power density in the industry along with enhanced maintainability.

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