Showing results: 1 - 14 of 14 items found.
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Teledyne LeCroy
Teledyne LeCroy’s PCI Express 5.0 Test Platform is part of a suite of tools that facilitates complete protocol testing of PCI Express devices up to and including version 5.0. The latest feature of the Teledyne LeCroy Test Platform is the addition of an integrated interposer, which eliminates the need for an external interposer. This innovation simplifies setup with fewer connection points and outboard devices, making analysis easier and more reliable than ever. In addition to using the Test Platform with the Exerciser, the user can connect two of their own devices and use the Test Platform as a PCIe 5.0 backplane and as an interposer to capture protocol traffic between the systems.
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PXP-500A -
Teledyne LeCroy
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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GT9000 -
Guide Technology, Inc.
GT9000 is a scalable 2 to 10 channelsBench-Top CTIA and/or TIC Test Platformwith 10” touch-screen-display (iPhone quality), integrated GUI with Touch, Ethernet, WiFi and/or wireless keyboard & mouse.
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GT9000P-USB3 -
Guide Technology, Inc.
A 2 channel Portable “CTIA” and/or “TIC” Test Platform controlled by USB3
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GT9000R -
Guide Technology, Inc.
GT9000R is a scalable 2 to 24 channels 19”Rack-Mount CTIA and/or TIC Test Platformwith integrated GUI, Ethernet, Wi-Fi and/orwireless keyboard & mouse.
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iWave Systems Technologies
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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Ironwood Electronics
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Z-Axis Europe
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Ironwood Electronics
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Series S200, S300, S400, and S500 -
AlphaTest Corp.
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Ironwood Electronics
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Verticon® 100 BGA -
Johnstech International Corporation
The Verticon® 100 BGA socket /contactor is an elastomer based contactor technology featuring a combined contact profile, and proprietary plating, and solid contact dynamics providing low inductance and stable contact resistance under multiple (production) landing test conditions. The overall design architecture of the Verticon® 100 contactor enables functional test hardware interface compliance as required by precision analog/mixed signal, high speed digital and RF SOCs’ up to the millimeter wave frequency domain.
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Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Ironwood Electronics
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
