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A Compact X-ray Inspection System, The MedaScope™ Desktop
A compact X-ray machine weighing only 55 pounds, the MedaScope Desktop is easy to carry and can be set up rapidly. Glenbrook’s MedaScope Desktop is a portable, compact manual system for real-time, magnified x-ray screening of packaged devices including medical devices, electronics, and cables.
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Conformal Coating Inspection System
TROI 8800 CI
The PEMTRON CI Series addresses the limitations of the area of theinspection due to the diversity of wavelengths of the existing UV,and performs a clearly separated area of coating onvarious wavelengths.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Automatic Flight Inspection System
AT-920DG
Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Thickness and Flaw Inspection
OmniScan MX ECA/ECT
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Inspection Toolkit
OTK-4000
The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Semiconductor Package Inspection System
NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Deep Inspection Kit
GRL-KIT-DI20
The GRL Deep Inspection Kit (KIT-DI20) addresses the gap between expensive, challenging-to-use VNAs and simple functional/continuity tests that are not adequate for high speed interfaces. Now, users without years of signal integrity testing expertise can perform professional measurements with high accuracy to 20GHz with easy-to-use equipment.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Regenerative Battery Pack Test System
17040
Conforms to international standards for battery testing: IEC, ISO, UL, and GB/T, etc.Regenerative battery energy discharge (Eff. >90%, PF >0.95, I_THD <5%)Multiple voltage and current ranges for auto ranging function to provide optimum resolutionHigh accuracy current/voltage measurement (0.05%FS/0.02%FS)2ms current slew rate (-90% ~ 90%)Dynamic (current/power) driving profile simulation tests for NEDC, FUDS, HPPCTest channel parallel functionTest data analysis functionData recovery protection (after power failure)Automatic protection for error conditionBattery simulator (option)High power testing equipment- Voltage range : 80~1000V - Current range : 0~750A - Power range : 0~300kWCustomized integration functions- Integrated temperature chamber - BMS data analysis - Multi-channel voltage/temperature recording
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Portable gear inspection- and 3D-measuring systems
ultimate independent measurement - on the production machine or on the shop-floor without rotary table
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Baggage and Parcel Inspection
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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Semiconductor Inspection (SEMI)
A process for detecting any particles or defects in a wafer.
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Post-Mould Inspection Machine
IV-P1000
The IV-P1000 is a post-mould inspection machine best known for being a fully automatic vision inspection station and for having a user-friendly GUI for operator and recipe setup. This machine is best used to inspect packages for surface defects on top and bottom.
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Sensor for Filament Inspection
EyeFI
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Protective Coating Inspection
Kit 4
The Elcometer Protective Coating Inspection Kit 4 provides a range of test equipment to help an inspector assess a substrate prior to the application of a coating.
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Fiber Inspection Probe
FIP-920
FIP-920 Fiber Optic Inspection Probe combines a 3.5” high definition TFT LCD display, provides a detailed image of fiber end-face, zoom in/out feature make it easy to identify the smallest particles, scratches. With the attached SD card memory, you can capture/record the live end-face image, the image file can be reviewed/transferred via SD card reader or USB cable. Up to 8hrs battery working make it possible to inspect the fiber end-face at any time and any place.
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BT Imagine New wafer Thickness System
IS-T1
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Drone Inspection Software
Qii.AI
Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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3D Automated Optical Inspection Systems
New 3Di Series
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
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EMS Test System
TS9982
The R&S®TS9982 is the base system for conducted and radiated EMS measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for complete motor vehicles with 200 V/m.
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Macro Inspection
High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Inspection Microscope
This compact, lightweight and ergonomic Inspection Microscope is specifically designed for inspecting ferrule and fibre end faces in the field or the laboratory. The microscope provides dual-illumination, both coaxial and oblique; to produce the highest-quality image detail and superior view of fibre end face cleanliness and core condition.
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Semi-Automatic Contactless Wafer Detector
NCS-200SA
Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm
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Concrete Inspection System
StructureScan Pro
Geophysical Survey Systems, Inc.
StructureScan Pro is a versatile concrete inspection system offering a wide variety of antenna options for concrete and other applications. Based on the SIR 4000 controller, the StructureScan Pro provides the GPR professional with solutions to any scanning situation.
