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Wafer Inspection System
JRT Photovoltaics GmbH & Co. KG
In close cooperation with well-known providers of inspection systems, we provide modular systems for quality control and classification of raw wafers.
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Inspection Microscope
Z-NIR
The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Automated Optical Inspection System
AOI Series
Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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The Ultimate Inspection Tool
ULTRAPROBE 9000
The Ultraprobe 9000 Kit Complete is a digital ultrasonic inspection, information storage and retrieval system that is so versatile, so easy (most operators are able to use the Ultraprobe 9000 within 15 minutes) and so much fun to operate, you'll be looking for opportunities to use it every day.
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Over-Line Vision Inspection System
Over-Line vision inspection systems utilize a compact sensor head mounted directly over an existing production line to scan every object that passes underneath, in any orientation and at any belt speed, in order to generate a continuous stream of critical QA data, such as size, shape and color attributes, and production metrics such as throughput, uptime and capacity.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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3D Digital Inspection
Digital stereo 3D imaging is a unique, advanced, stereo image presentation system designed to provide fully interactive real time natural 3D viewing and visualisation with outstanding depth perception.
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Automated Wafer Prober for Magnetic Devices and Sensors
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Fiber Optic Inspection
Optical Wavelength Laboratories
A dependable connector endface inspection scope is a vital part of any fiber optic professional’s tool kit. Inspecting patch cord connector endfaces before attaching them to equipment or patch panels saves time and effort, and ensures a clean, quality connection. These 400x video inspection scopes allow users to view connector endfaces on a PC or laptop screen, preventing harmful invisible light from entering the users eye, and ensuring maximum eye protection.
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WAFER MVM-SEM
E3300 Family
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Industrial Inspection Cameras
Industrial Inspection Cameras are our top-of-the-line inspection cameras. They feature glass lenses, superior optics, crystal-clear displays, and compatibility with the thinnest probes on the market. All Industrial Inspection Cameras were recently upgraded to capture VGA (640 x 480 pixel) resolution video clips and remove glare and reflections from them. All cameras in this sub-category are made in Taiwan, making them compliant with the Trade Agreements Act (TAA) of 1979a necessity for many buyers with the U.S. military and federal agencies.
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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X5 Pack X-Ray Inspection
Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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Thickness and Flaw Inspection
NORTEC 600
Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Magnetic Particle Inspection
Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Backplane Profiling & Inspection System
603d
A major problem in the backplane industry is detecting bent connector pin defects. The most difficult being when the pin bends underneath the shroud rather than going into the hole. Many times this defect cannot be detected electrically as the connector pin is touching the conductive annular ring of the hole, allowing electrical test to pass. Unfortunately, it is an intermittent connection and will fail later on as there is not an actual mechanical connection.
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Wafer ESD Tester lineup
Hanwa Electronic Ind. Co.,Ltd.
◆Correspond to 300mm Wafer. This tester can measure LED or the large sizes Wafer, such as a system LSI. And Zap of HBM/MM can be performed. The Automatic destructive judging by V/I measurement can also be performed after Zap.◆Waveform guarantee in Zap needles. HED-W5100D carries out the calibration before shipment in the place of Zap needles. Therefore, Correlation of the Result of a Package Device becomes clear easily.◆Correspondence to Standards This Tester corresponds to the Standard of JEITA, ESDA, and JEDEC. A Zap unit adopts the plug-in system and also has the waveform of Customer's requests.◆Connection with TLP This Tester is the best for TLP Testing with deep relation of ESD. The protection circuit of a device with an ESD problem is investigated.
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Automated Optical Inspection System
AV880 Series
The AV880 Series of AOI solutions from ASC International provides the same high level inspection capabilities as found in our AV862/AV871 Series of AOI systems all wrapped into an inline platform for continuous flow requirements. A price to performance ratio sure to please those looking for a quick ROI.
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PXIe System Sync Module, 2 Port
M9032A
The M9032A has a Soft Front Panel (SFP) that provides a graphical user interface to the system sync module. It allows the user to set up the most commonly used functionalities of the module. The SFP also gives you the ability to check the module's connection status, configure the reference clock and IO settings, and perform firmware udpates.
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AXI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Digital Inspection
The DI-1000 and DI-1000L-PRO inspect fiber optic connector endfaces, providing clear sharp digital images on your Windows® PC. The DI-1000 and DI-1000L-PRO use LIGHTEL's Series 2 Tips and come with a soft case designed to fit easily into a standard laptop case.
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Digital Video Inspection Microscope
Contamination is the first reason for troubleshooting optical networks. Proactive inspection and cleaning of fibre connectors can prevent poor signal performance, damage to equipment, and network downtime. DIAMOND’s Video Microscope Kit contains all necessary tools for proper inspection and cleaning of the connector’s front-faces to help ensure optimal connector performance.
