IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Product
J1939 Simulator
DFLSJ1939BV1
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The DFLSJ1939BV1 simulator is designed to simulate the truck or car''s ECU using J1939 protocol. It uses the DFL-SJ1939 IC with compact size. You can use free configuration software to customize the source address and 8 bytes of device name, and provide 2 extra customized PGNs. The configration software is free. You can download right now. New version 2.00 allows you to configure VIN#, and you can select J1939 DTC frame format from version1 to Version4. Furthermore, you can use our free PCTOOL software to change PGN value in real time.
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Product
Dip Clip, 14 Pin With Nickel Silver Contacts
5014
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Pomona DIP Clip test clips are designed fortesting dual-in-line IC packages on PC boards. Thesedevices incorporate many built-in features that assurea positive electrical connection as well as hands freetesting.
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Product
MPI Sorter Series
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MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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Product
AMIDA 3001XP Tester
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AMIDA has introduced two new analog/mixed-signal and logic options in the AMIDA-3000 series in recent years—the AMIDA-3001XP and AMIDA-3KS test systems. Both reinforce the AMIDA-3000 series' ability to provide cost-optimized test solutions for a variety of consumer components in power management and mobile device components. The AMIDA-3000 series provides more than twice the number of analog channels of its modules per test system, thus greatly reducing the acquisition cost of each channel and more than doubling the number of analog channels in the entire test system. This results in a higher number of parallel tests and a higher level of capability for this system, as well as a lower and more cost-effective IC unit test cost for this tester. This series of test systems provides a powerful test combination with high-speed hardware and software integration. The built-in instant messaging protocol detection function of AMIDA-3001XP test machine not only simplifies the complexity and difficulty of test development, but also greatly shortens the test time by using its high-speed computing capability.
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Product
MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J47
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Hall Effect Proximity Switches/Sensors
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ChenYang Technologies GmbH & Co. KG
A Hall Effect proximity switch is a non-contact electronic switch, which consist of a permanent magnet or ferromagnetic part as trigger intermediary and a Hall Effect sensor IC. The Hall sensor IC detects the change of the magnet field when the permanent magnet comes in the close proximity to it and generates an electric signal. This signal is amplified and rectified to control the output signal of the switch.
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Product
Interface ICs
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Easy to use, flexible, and reliable. Allegro’s sensor interface ICs offer accurate and fast output for signal conditioning in a wide range of applications, from electric vehicle HVAC systems to transmission oil pressure. Our innovative algorithms deliver robust EMC performance and provide critical diagnosticsthat support automotive safety.
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Product
Mixed-Signal Design
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Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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Product
OBD Chips
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STNxxxx OBD-II to UART Interpreter ICs are developed by our in-house engineering team at OBD Solutions. STNxxxx chips combine ELM327 compatibility with advanced hardware at an unbeatable price. We utilize STN11xx technology in all of our OBDLink scan tools.
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Product
LilyPad Arduino USB
ATmega32U4 Board
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This is the LilyPad Arduino USB board, controlled by an ATmega32U4 with the Arduino bootloader. It has a built in power supply socket and an on/off switch with the only extra piece of hardware you need to program the LilyPad USB is a micro-USB cable, since the new IC has built-in USB support. Any of our LiPo batteries can be plugged right into the JST socket to provide you with easy, on-the-go power. That LiPo battery is even rechargeable through the board, no more special external LiPo chargers required!
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Product
Bus Analyzer
Scribe I2C
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The Blackhawk Scribe is an entry level, yet feature-packed and robust I2C debugging tool. The Scribe was designed to help engineers developing products which utilize the IC and SMBus interfaces.
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
Millimeter-wave and Microwave GaAs Specialty ICs
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Keysight Technologies provides MMIC Specialty ICs ideal for microwave radio, aerospace and defense, and instrumentation applications.
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Product
High Voltage ICs
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Hitachi Power Semiconductor Device offers intelligent power devices and high voltage analog switch ICs integrating high voltage output devices and control circuits on a single chip/single package using dielectric isolation technology. *High voltage ICs are suitable for household apparatus fields such as home electric appliances and beauty appliances.* These ICs can be easily used for various purposes, and market-leading companies in air conditioner fan motors have adopted them.※We have continued to improve performance and quality of the ICs since sales start in 1994 and have more than 20 years of sales results.
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Product
Near Field Probes 30 MHz up to 3 GHz
RF1 set
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The RF1 near field probe set consists of 4 passive near field probes for making measurements in the development phase of E-field and magnetic field in the ranges of 30 MHz to 3 GHz on electronic assemblies. The probe heads of the RF1 set allow for measurements close to the electronic assemblies, e.g. on single IC pins, conducting paths, components and their connectors in order to localize interference sources. Field orientation and field distribution on an electronic assembly can be detected through a trained special use of the near field probe. The near field probes are small and handy. They have a sheath current attenuation and are electrically shielded. They can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. They do not have an internal terminating resistance.
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Product
5G Active Antenna Innovator’s Kit
AWMF-0129
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The AWMF-0129 is an active array for 5G wireless applications developed using planar antenna technology resulting in a very low profile, lightweight unit. The surface mount assembled antenna board is based on Anokiwave’s AWMF-0108 Silicon Quad Core IC and demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0108, the antenna provides +50dBmi output power while consuming just 12W DC power in the RF circuits and has achieved Gb/s data rates in OTA trials. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. The AWMF-0129 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmW bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage, and reliability.
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Product
Power ICs - MicroBUCK® - Voltage Regulator
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*Highly integrated microBUCK POL solutions deliver high efficiency while reducing costs*Each family offers a large portfolio of high density parts with common pinouts, allowing designers to scale for the best combination of cost and performance*Our PowerCAD simulation tool allows users to select the appropriate microBUCK regulator and generate a full circuit schematic**For performance optimization and comparison purposes, the schematic can then be edited as required.**Once the basic circuit is created, the user can perform DC, transient, and start-up simulations with visibility of all the circuit node waveforms.**Following these steps, the PowerCAD 2.0 simulation tool generates a bill of materials (BOM) available for online ordering.
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Product
Advanced Design System (ADS) Core
W2200BP
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Advanced Design System (ADS) is the flagship product from Keysight EEsof EDA, the technology and innovation leader in high-frequency, mixed-signal electronic design automation (EDA). It is the only design simulation platform that enables the co-design of IC, package and board in high-frequency and hi-speed applications. ADS seamlessly integrates system, circuit, and full 3D electromagnetic simulation with Keysight's test instrumentation to perform single pass successful electronic designs repeatedly.
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Product
ESD Latch Up Tester
1100-ESD
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Tokyo Electronics Trading Co., Ltd.
The Model 1100-ESD can easily and accurately perform ESD tests (HBM, MM) on ICs up to 64 pins. Also, all common pin combinations required by the standard can be realized.
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Product
Small Target Surveillance
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system has proven value on offshore platforms, support vessels and in a range of coastal surveillance and monitoring applications. Our install base also includes coastal patrol vessels where the system is used for search and rescue operations and detection of small craft for interdiction and security purposes. Small Target Surveillance is used for applications as diverse as detecting birds, scouting for ice, wildlife monitoring, and lost container detection.
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IC Testing System
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Is a system for giving electrical signals to a semiconductor device to compare output signals against expected values for the purpose of testing if the device works as specified in its design specifications.
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PLCC-to-DIP Adaptor
Series 352000/353000
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PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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Product
Power ICs - VRPower® (DrMOS) - Power Stage
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The Next Generation VRPower® Power Stage, Vishay’s family of VRPower modules offers an integrated MOSFET and driver power stage with unsurpassed performance. The flagship device, SiC620R is capable of 70 A and achieves more than 95 % efficiency in a typical multiphase buck converter design. The device has several package enhancements that enable it to offer superior MOSFET dynamic performance. Combined with Vishay’s state-of-the-art Gen IV MOSFET technology, these enhancements enable 3 % better efficiency and over 50 °C lower operating temperatures compared to previous generation DrMOS devices while shrinking the footprint by 33 %.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
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Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
IC-VSR-BOXa, 19’’ 1/10 Gigabit Ethernet Rackmount Router
IC-VSR-BOXa
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Gigabit Ethernet Rackmount Router.
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Product
Inductive Motor Control
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The inductive motor control position sensor family detects the electrical position within one pole-pair of a rotating shaft and can be used for the motor commutation of a brush-less DC (BLDC) motor. Based on the inductive sensor technology, this family measures the coupling between an excitation coil (TX) and two receiver coils (RX) via a rotating target. The coils are executed as printed circuit coils and the rotating target is a simple punched metal part. With the correct layout of the coils and the target, both synchronized to the number of pole-pair count of the motor, the IC output is proportional to the electrical angular position within one pole-pair segment with increased resolution and high performance of only 0.3° electrical INL!
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Product
Analog IC test system
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A paradigm shift has been occurred in Japan’s major brand WL25 series tester. Ultimate simple system is available by effective analog pin architecture.This cost performance system is covered analog IC extensively, which are high accuracy, speed and multi-site test function.
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Failure and Technology Analysis
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Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Product
Automated Programmer Superpro Sb05
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※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
