IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Product
Performance Board
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The role of the performance board is accurate transmission of tester signals all the way to the device leads. Custom performance boards from ADVANTEST deliver support for DUTs (devices under test), as they become faster and smaller, with greater pin counts, and increasingly take the form of SMDs. ADVANTEST performance boards also support a host of test requirements, such as analog test, high-speed performance, and high-density, for testing state-of-the-art ICs.
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Product
Clock and Data Recovery/Retiming
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Analog Devices provides single rate, multiple rate, and continuous tuning clock and data recovery (CDR) ICs for metro, long haul, DWDM, FSO, instrumentation, and other applications. Our any rate CDR ICs allow easy integration into protocol agnostic applications, automatically locking onto incoming data streams at any rate, from 10 Mbps to 2.7 Gbps or from 6.5 Mbps to 11.3 Gbps, without the aid of a reference clock while reporting the acquired data rate over the I2C interface. With a proprietary dual loop design, our any rate CDR ICs feature fast locking with superior jitter performance.
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Product
Wireless Connectivity Solutions
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With the massive growth of the Internet of Things, wireless connectivity has never been more important. Quickly incorporate connectivity into your designs with wireless ICs, modules, software and development kits that make connecting effortless for your customers. Our comprehensive wireless portfolio has the technology to meet your range, data rate, interoperability, frequency and topology needs.
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Product
40~860 MHz Trunk Hybrid Amplifier
AS 1616
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Hybrid Amplifiers used in Trunk and branch lines specially designed to serve the needs of cable systems with very Long Trunk Cables. They are in Aluminium Housing providing maximum heat dissipation and have RFI Shielding. They incorporate superior quality Hybrid IC Module to obtain excellent features.- Frequency Range: 40 ~ 860 MHz- Mains cum Power Pass- Output Level: 102 dBµV- Level Flatness: ±0.75 dB- 32 dB Gain (40 dB Optional)- Optimum for Trunk Distribution- Superior Quality Hybrid IC Module- Hybrid IC Protected- Voltage Selection LED - for Easy Selection
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Product
DIP-to-JEDEC TO Adaptor Socket
1109522 & 1109523
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DIP to TO Adapter Sockets. 8 pin DIP IC socket on the top and a circular, 8 pin TO can male pin footprint on the bottom. ICs now available only in 8 pin DIPs can be readily mounted on boards having TO thru-hole footprints without having to redesign the board.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
LOAD BOARD
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The semiconductor manufacturing process is divided into a front process (WAFER) and a post process (PACKAGE). The LOAD BOARD is an INTERFACE device for inspecting the function and performance of a package state IC, which is a post process, It is an INTERFACE key device for inspection. In particular, LOAD BOARD is widely used in non-memory semiconductor inspection equipment.
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Product
PXIe-4139 , ±60 V, ±3 A DC, ±10 A Pulsed, 40 W DC, 100 fA Precision System PXI Source Measure Unit
782856-03
Source Measure Unit
PXIe, ±60 V, ±3 A DC, ±10 A Pulsed, 40 W DC, 100 fA Precision System PXI Source Measure Unit - The PXIe-4139 is a high-precision, system source measure unit (SMU) that features 4-quadrant operation and sources up to 40 W of DC power. This module features analog-to-digital converters that help you perform high-precision measurements with a current resolution of 100 fA or high-speed acquisitions up to 1.8 MS/s. The module can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. You can use the PXIe-4139 for applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers.
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Product
RF Power Generators
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MKS RF Power Generators provide reliable solid state power for thin films processing equipment. They are vital components of semiconductor fabrication systems, which produce the integrated circuits (ICs) or chips required by modern computers and electronic equipment. MKS RF Generators, combined with our Impedance Matching Network and our V/I Probe form a complete RF Delivery System.
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Product
Dip Clip, 16 Pin With Nickel Silver Contacts
3916A
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Dip Clip, 16 pin with Nickel Silver contacts. Pomona DIP Clip® test clips are designed for testing dual-in-line IC packages on PC boards. These devices incorporate many built-in features that assure a positive electrical connection as well as hands free testing.
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Product
IC Measurement Technology
Emission
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is used to measure conducted emissions (measurements with direct 1 Ohm/150 Ohm-coupling) according to IEC 61967-4 at IC pins.
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Product
IC-3120, 1.91 GHz Intel Atom Quad-Core Processor, 2-GigE Port Industrial Controller
784959-01
Controller
The IC‑3120 is a compact and rugged industrial controller that withstands the harsh environments common in automation, supervisory control, distributed control, and industrial embedded OEM applications. The IC‑3120 offers two Gigabit Ethernet ports with Power over Ethernet (PoE) technology, FPGA-based I/O capabilities, and network connectivity for distributed control applications. The advanced features include the ability to synchronize image inspection results with industrial I/O and configure hardware-timed network triggers to trigger camera acquisition, motion control, or data acquisition. You can use the advanced FPGA personality that is shipped with the system or customize the FPGA functionality using the LabVIEW FPGA Module.
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Product
Optoelectronics
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Renesas provides a wide range of optoelectronic devices, including IC output photocouplers (optocouplers) featuring a high response from 1Mbps to 15Mbps, as well as general purpose transistor output devices featuring high isolation voltage, high temperature operation and compliance with various international safety standards. For motor drive applications, dedicated photocouplers provide high isolation voltage, high temperature operation, high output current, and high-speed switching. These are complemented by a diverse range of ultra-high speed devices for fiber-optic applications, as well as solid state relays (OCMOS FETs).
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Cold Rooms
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Our walk-in cold rooms offer reliable, efficient environmental controls for a variety of applications; including: GMP Storage and Cold Storage for Seed and Agricultural Products, Nutritional Supplements, and more. Our cold rooms are typically supplied with desiccant or refrigeration based dehumidification in order to maintain a low dew-point and prevent ice accumulation on both product and equipment surfaces. Typical temperatures for our cold rooms range from of 0o C to 10o C.
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Product
PXIe-4135, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 10 fA Precision System PXI Source Measure Unit
783762-01
Source Measure Unit
PXIe, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 10 fA Precision System PXI Source Measure Unit - The PXIe-4135 is a high-precision, system source measure unit (SMU). It features 4-quadrant operation and sources up to 40 W of DC power and can pulse up to 500 W. Analog-to-digital converter technology and native triaxial connectors help you perform high-precision measurements with a current resolution of 10 fA or high-speed acquisitions up to 1.8 MS/s. The module also can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. The PXIe-4135 is ideal for a broad range of applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
DUAL-IN-LINE (DIL/DIP) SERIES 97 - 98
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Pickering’s dual-in-line (DIP/DIL) reed relays are through-hole electronic components that enclose two parallel rows of connection pins on the standard DIL spacing with switching capability up to 2 Amps, 50 Watts. The reed relays come with 5, 12 or 24 V coils with or without internal diode. Many standard build options are available on request, or we can fully customise the parts to suit your exact specifications.It is often possible to replace TTL ICs with their equivalent CMOS ones and replace standard DIL relays with Pickering Series 98, to obtain the benefits of CMOS without any circuit or PCB redesign.
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Product
Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Product
EMI Tester
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The EMI tester automatically measures the noise distribution of the electric field and the magnetic field radiated from electronic equipment with high accuracy.・ Even if PCB and IC parts have complicated bumpy shape and surface. The movable assembly can automatically trace them.・ EMI noise distribution is expressed as a variety of maps, such as 4D/3D/2D graphics and cross section view.
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Product
Board Fault Locator
SYSTEM 8 (BFL)
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The SYSTEM 8 Board Fault Locator provides the user with the ability to functionally test all common digital ICs in and out-of-circuit. A combination of industry recognised test techniques provides a high level of fault coverage. Additional tools are provided by the SYSTEM 8 Premier software to further enhance the unit\'s wide range of applications.
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Product
Wireless Test Solutions
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Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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Product
PXIe-4137, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 100 fA Precision System PXI Source Measure Unit
783761-02
Source Measure Unit
PXIe, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 100 fA Precision System PXI Source Measure Unit - The PXIe-4137 is a high-precision, system source measure unit (SMU). It features 4-quadrant operation and sources up to 40 W of DC power and can pulse up to 500 W. Analog-to-digital converter technology helps you perform high-precision measurements with a current resolution of 100 fA or high-speed acquisitions up to 1.8 MS/s. The module also can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. The PXIe-4137 is ideal for a broad range of applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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Product
Millimeter-wave and Microwave GaAs Specialty ICs
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Keysight Technologies provides MMIC Specialty ICs ideal for microwave radio, aerospace and defense, and instrumentation applications.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Circbord
8003
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VECTOR Electronics and Technology, Inc.
Pad per hole & peripheral ground plane.0.085” Square pads etched around each hole on wiring side.Accommodates any type DIP IC device or discrete component.Single sided board with pads and peripheral GND plane on one side only.Single-sided with no etch and plating on reverse side.
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Environmental Testing
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Environmental Testing is the evaluation of a product in conditions which simulate the physical environments that may harm or adversely affect the products performance. Environmental testing can play an important role throughout a product's development cycle to ensure that the materials and manufacturing processes can survive the stresses of the environment in which the product is likely to operate. These environments may include high and low temperatures as well as quickly changing temperatures. Also, temperature humidity environments may also be a factor. Environments with an added media such as dust, ice and freezing rain may also have an adverse effect on products. Listed below are some of Global Testing Services Environmental Testing capabilities
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Product
VXI Register Interface Board
VXI-5524A
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*VXI Register Interface mates with user's PCB to form a B or C-size module.* 48 Digital IO Lines - Three 16-bit registers set as latched outputs or gated inputs.* 16 line bi-directional expansion bus for driving external logic.* Digital IO and VXIbus lines are 3.3V logic levels and are 5 V tolerant for compatibility with 3.3V logic and 5V VXIbus signals.* User selectable 3.3 and 5 Vdc puliup voltage on the digital IO lines for sensing switches etc.* The VXI-5524A board is a complete VXI-1 Rev 1.4 and VXI-2 compliant register-based interface.* User configurable model number, manufacturer ID, version and serial numbers.* Two companion component boards available for prototyping IC or RF assemblies.* Companion hardware kits available for building 1, 2 or 3-slot wide modules.
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Product
UDIMM DDR3L 1600
SQR-UD3N
Dual In-Line Memory Module (DIMM)
Micron Original memory IC, FIXED BOM. 3yrs longevity & lifetime warranty, Undergo strict test program. Support Smart Monitoring (SQR Manager)Select Product.
