Silicon
atomic number 14 tetravalent metalloid chemical element.
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Product
Digital Solutions
Digital ST60 Thermopile (Preliminary)
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A single channel silicon- based thermopile in a TO-5 package that includes integrated electronics which incorporate an industry standard digital SMBus interface. The small active area size is 0.61mm x 0.61mm.
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Product
SparkFun Triple Axis Accelerometer And Gyro Breakout
MPU-6050
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The MPU-6050 is a serious little piece of motion processing tech! By combining a MEMS 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor™ (DMP™) capable of processing complex 9-axis MotionFusion algorithms, the MPU-6050 does away with the cross-axis alignment problems that can creep up on discrete parts.
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Product
3μm Silicon Interdigitated Electrode (IDE)
SIE1
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3 μm silicon-based interdigitated electrode (IDE) designed for MEMS sensors, gas sensing, biosensing, photoelectric detection, and electrochemical research. Fabricated using precision microfabrication on a silicon substrate, with customizable electrode materials, dimensions, and layouts for laboratory and OEM applications.
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Product
Contactless One-Point Wafer Thickness Gauge
MX 30x
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The MX30x series are manual one-point Thickness gauges for silicon wafers.
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Product
Absolute Contamination Standards (ACS)
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The Absolute Contamination Standard (ACS) is used to calibrate instruments which size and detect particles on the surface of bare silicon wafers. Use ACS to characterize particles, before particles characterize products.
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Product
Lightning Current Generator
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Shanghai Guantu Technology Co., Ltd.
The lightning wave impulse current generator is an impulse current generator that generates a simulated lightning current waveform . Its working process is as follows: first, the transformer charges the capacitor bank through the silicon pile, when the charging voltage reaches a predetermined value, the spark gap is triggered, and the capacitor is discharged through the total inductance and total resistance of the circuit. When the resistance is greater than or equal to the critical damping value, a unidirectional impulse current wave is generated in the circuit. When the resistance is less than the critical damping value, an oscillating impulse current wave is generated. The magnitude of the impact current amplitude is related to the circuit parameters. When the capacitance value and charging voltage are the same, the smaller the inductance value, the greater the current amplitude. In order to obtain as much current as possible, a pulse capacitor with a small inductance value is usually selected, and the total length of the connecting line should be as short as possible when arranging the main capacitor, so that the total loop inductance value can be reduced as much as possible.
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Product
Open Top BGA Sockets
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Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Optical Profiler
DRK8090
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Shandong Drick Instruments Co., Ltd.
This instrument uses noncontact, optical phase shift interferometry method does not damage the surface when measuring graphics can be quickly measured by a variety of three dimensional surface morphology, and analyzed to calculate the measurement results. Suitable for measuring a variety of blocks, the surface roughness of optical components; scale, dial the groove depth; magnetic (optical) disk, the head surface texture measurements; structural morphology of coating thickness and coating trough structure at the boundary of the grating; silicon surface roughness measurement and the graph structure and so on.
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Product
SiC Schottky Barrier Diode
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We offer high-performance products with low forward voltage (VF) and high-speed reverse recovery time (trr) for increasing device efficiency.We are also employing a new material (silicon carbide: SiC) for products with even higher efficiency.
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Product
Computer-On-Module
CM22301
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Product
Solar Cell PL/EL/IV 3-in-1 Testing System
VS6841
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Industrial Vision Technology Pte Ltd.
This luminescence Analyzer integrates a Photoluminescence (PL), Electroluminescence (EL) , and I-V Measurement Technology, has a Device’s PL image, EL image, as well Device’s I-V characteristics in One system. It is being using to quantitatively map Minority-Carrier Lifetime, and to characterize the defect of silicon wafer & solar wafer, and measure the key parameters from solar cell I-V Curve. It is also a useful tool for scientist to develop other methodology & parameters that can be used as a promising technique for online material monitoring and process control.
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Product
Phototransistors
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Phototransistors are photodiode-amplifier combinations integrated within a single silicon chip. The phototransistor can be viewed as a photodiode whose output current is fed into the base of a conventional transistor. These photodiode-amplifier combinations are put together to overcome the major limitation of photodiodes: unity gain. The typical gain of a phototransistor can range from 100 to over 1500.
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Product
DC Input Darlington
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DC input/Darlington transistor output photocouplers (optocouplers) are optically coupled isolators containing a GaAs infrared light emitting diode and an NPN silicon Darlington connected phototransistor. This type can operate on a low-current DC input because of its Darlington configuration.
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Product
Microscopic Four-Point Probes
M4PP
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CAPRES M4PP Microscopic Four-Point Probes have an electrode pitch three orders of magnitude smaller than conventional four-point probes, and are fabricated using silicon micro-fabrication technology.
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Product
Ka-Band Silicon 5G Quad Core IC
AWMF-0108
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The AWMF-0108 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes 5 bit phase and 5 bit gain control for analog RF beam steering, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. The device provides 26 dB gain and +9 dBm output power during transmit mode and 28 dB coherent gain, 5.0 dB NF, and -28 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Product
Schottky Barrier Ring Quads
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SemiGen’s Silicon Schottky Diodes are designed for applications through 40Ghz. The special process technology utilizes various metal schemes to provide excellent performance of Low, Medium, and High Barrier applications. The end result is a low resistance diode with tightly controlled capacitance which allows for optimum performance. Low conversation loss and superior TSS make these diodes ideal for detector / mixer applications with frequency ranges from S band to Ka band as well as modulators, lower power limiters and high speed switches.
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Product
MINIATURE SILICON DIODE TEMPERATURE SENSOR, 2 To 600 Degress Kelvin
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Insight Product Company offers SILICON DIODE TEMPERATURE SENSORS CAN BE USED FOR TEMPERATURE Â MEASUREMENTS IN DIFFERENT FIELDS OF CRYOGENIC ENGINEERING AND EXPERIMENTAL PHYSICS. THEY ARE MINIATURE AND OPERATE IN THE TEMPERATURE RANGE FROM 2 TO 600 K.
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Product
Ultra Pure Pressure Switch
W117G
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The W117G Ultra Pure Stainless Steel Pressure Switches have all welded stainless steel interiors which are Helium leak checked to pass 4 x 10-9 Std CC/Sec. These switches are used in silicon wafer ovens, numerous medical devices and other applications where even the slightest impurities are not tolerated.
