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Showing results: 3121 - 3135 of 3184 items found.

  • Copy Tools

    DemiYG1020 - YEC Co. LTD

    Supports SATA 6Gbps. ATA storage is supported by using optional products sold separately.Ultra high speed data transfer at 37GB (*1) per minute.(*1 Theoretical value. Varies according to performance of connected devices.)Execution logs can be immediately saved to USB memory connected to the main unit.Deletion reports can be created based on saved logs. *2(*2 Host program sold separately is required to create deletion reports.)Rugged built-in evidence preservation functions including hash value generation (MD5, SHA1, and SHA256), DD image creation and E01 creation.Deletion function conforms to various standardsSupports NSA (National Security Agency) recommended, DoD (Department of Defense) conforming, U.S. military and NCSC systems.Enables deletion operation report creation by using optional terminal software (sold separately).Built-in deletion function and quick diagnosis functionDeletion report can be created using host software (sold separately).

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • 3U OpenVPX CPU Blade with Intel® Xeon® Processor E3v5 and E3v6 family

    MIC-6330 - Advantech Co. Ltd.

    Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.

  • 2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN

    NA860 - Axiomtek Co., Ltd.

    The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.

  • BGA SMT Adapters

    Giga-snaP™ - Ironwood Electronics

    Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.

  • EMC Test Equipment

    TDEMI Mobile series - Gauss Instruments

    New dimensions for pre-certification. The TDEMI Mobile (TDEMI M) product line of GAUSS INSTRUMENTS is a very compact designed instrument especially for mobile use outside as well as in labs on the developer workbench providing a great variety of functionalities. By its standard 12V power supply it can be easily used for onboard testing, e.g. in vehicles or aircrafts. Designed for pre-certification tasks the TDEMI M provides the absolutely unrivaled advantages in speed and performance of the very well established and approved real-time signal processing and microwave technology of GAUSS INSTRUMENTS. Thus, your pre-certification investigations can be performed up to 16000 times faster than by conventional receivers. The instruments can be ordered for the frequency ranges up to 1 GHz, 3 GHz, 6GHz or 7 GHz starting from 9 kHz or optional even starting from 10 Hz. The fully gapless real-time analysis bandwidth of 225 MHz (Option RTEMI225-UG) of the spectrogram mode makes the TDEMI M series unique in the instrumentation market for pre-certification and provides a perfect tool for

  • Patch Panel Automation Switch

    Echola Systems LLC

    Echola's Optical Patch Panel Automation switch allows test engineers/system developers to dynamically reconfigure testbed connections from remote. It reduces test configuration time as they don't need to make any physical fiber connections for each set of tests, so more testing can be performed with fewer resources. It provides all-optical connectivity with zero latency and can be used with any protocols and speed. Unlike O-E-O (optical to electrical to optical conversion) switches you don't need expensive transceivers for each port. The all-optical connectivity also allows systems under test to be tested without introducing another variable (ie, another conversion layer which could introduce significant latency). The patch panel automation switch allows users to configure, control and monitor the device from remote using any standard internet browser, a command line interface (CLI) via Telnet or SSH and SNMP v2c. The event notifications are supported through Syslog. It can be automated using TCL based scripts.

  • Battery Tester

    IT5100 Series - I-TECH Electronic Co., Ltd

    IT5100 series is a series of battery internal resistance testers with high precision, high resolution and high speed. IT5100 adopts AC 4-terminal sensing, that means the tester can test internal resistance and voltage simultaneously with high precision. Resistance resolution is down to 0.1 μΩ, voltage resolution is 10 μV.  Combined with external USB disk, IT5100 is available for long-term statistics calculation.Built-in comparator function, IT5100 can automatically determine whether the battery parameters meet the standards and count pass rate, which is suitable for a variety of battery`s test and pick. Built-in GPIB / USB / LAN communication interface to support SCPI communication protocol.Single unit of IT5102 support 16 channels batteries measurement, master- slave connection up to max.17 sets and extension channels quantity up to 272, that greatly improves testing efficiency. Built-in LAN / RS232 communication interface, IT5100 series can be widely applied in cellphone lithium batteries,electric vehicle batteries and other batteries inspection and sorting.

  • GPS NTP Time Server - SYNTIME

    Signals & Systems India Private Limited

    Your product description goes hGPS NTP Time Server (SYNTIME) for Network Time Synchronization is a highly accurate time server. It generates time protocols to synchronize NTP/SNTP clients (Simple Network Time Protocol)/PTP clients (Precision time protocol IEEE 1588) over the network and operates at a speed of 10/100/1000Mbps. The NTP server accepts the time and frequency signals from sources like GPS or GLONASS. It achieves nanosecond accuracy and the system clock operates at stratum 1 when synchronized with time sources. It is a sleek, rack-mountable unit that synchronizes and maintains equipment/device time and avoiding any time drifts due to local RTCs. NTP output from time server supports unicast, broadcast, and multicast methods based on selection and behaves like a reference clock for the network. Apart from time synchronization protocols, it supports MD5 (Security key), SNMP, SSH, HTTP (Configuration), TELNET, FTP, and SYSLOG. IP address of the LAN ports can be field configurable.

  • 3D Guidance®

    Northern Digital Inc.

    The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.

  • Erbium Doped Fiber Amplifier

    S-102 - Notice

    The EDFA slot module of FOTS system with built-in power booster EDFA module offers a special function that is able to change the optical signal amplification feature variously, which is followed by user’s driving embedded pump LD freely. The output power of eash pump LD can be controlled separately by the program that is set up by user. When an optimum optical signal amplification particularity is needed, it is made up so that it can be materialized by choosing the Default mode provided along with User mode. More stable application of EDFA is possible through the monitoring of the factors such as in/out signal power, gain, alarm status and pump LD enabled by the application of FPGA processor which makes high speed driving possible. It is also set up that user’s present-time monitoring and control through LCD monitor of system main frame or GUI display for remote control can be possible. Through optimization of amplifier gain, noise figure, and saturated output power, this EDFA module will expand test capabilities in systems, components or sub-assembly manufacturing.

  • Thermitest

    THW-L2 - Thermtest Instruments

    Designed with speed and operational simplicity in mind, the Transient Hot Wire (THW-L2) Liquid Thermal Conductivity Meter is an advanced measurement system for direct determination of the thermal conductivity of liquids and pastes in accordance with ASTM D7896-19. In less than 2 seconds, a single measurement of small volumes of liquids and pastes can be accurately and precisely measured for thermal conductivity. Using a non-stationary measurement approach, the THW-L2 uses rapid test times to limit convective effects for samples with a wide range of viscosities. The THW sensor consists of a 60 mm heating wire that is fully inserted into an isothermal sample. A constant current source (q) is used to heat the sensor wire and the temperature rise is recorded by monitoring the change in electrical resistance of the wire. The slope (m) is determined from the plot of temperature rise vs. logarithm of time and is used in the calculation of thermal conductivity (λ). Liquid samples of high thermal conductivity will have a lower slope, while liquid samples with low thermal conductivity will have a higher slope.

  • VME

    Data Patterns Pvt. Ltd.

    One of the world's leading architectures for high reliability electronics applications is the VME platform.The VME standard is managed by the VME bus International Trade Association, VITA.Embedded computing's most successful bus standard, VME bus, shows no signs of slowing down as it maintains it's position as the industry's de facto standard into the 21st century. The foundation of VME's longevity, namely it's steady rate of technological evolution combined with a commitment to backward compatibility with legacy hardware and software, has been the linchpin of it's popularity for nearly twenty-five years. Today, innovative enhancements to the standard, through the VME Standards Organisation (VSO), continue to improve VME bus' speed, performance and reliability, strengthening it's position as the ideal solution for today's increasingly stringent commercial, industrial and military system requirements (Source: VITA).Data Patterns has implemented a number of standard VME boards, driven by Customer needs for Processor and I/O requirements in this platform. Today, standard modules are available covering the needs of:

  • Vibrating Sample Magnetometer (VSM)

    8600 Series - Lake Shore Cryotronics, Inc.

    The 8600 Series VSM raises the bar for magnetometer performance and convenience. These VSMs combine high sensitivity (33 nemu), rapid measurement speed (10 ms/‌pt), and simple operation for more accurate measurements, faster. The entire 8600 Series system has been reimagined with a focus on clean, ergonomic design that simplifies the researcher’s interaction with the system. A motorized head brings the sample to a comfortable height for easy, one-handed exchange of the QuickLIGN™ sample rods. Temperature options include a cryostat, high-temperature oven, and single stage variable temperature insert. The combined temperature range of the options is 4.2 K to 1273 K. All three GlideLOCK™ options quickly slide into place and are auto-detected, with the software automatically displaying controls for the specific option. The magnet poles are also easily adjusted with the ExactGAP™ indexed positioning system that allows the pole gap to be set at one of six repeatable positions, eliminating the need to recalibrate after each change.

  • Programmable Digital Attenuator

    LDA-602EH - Vaunix Technology Corporation

    The LDA-602EH has a large attenuation range of 120 dB with an exceptional 0.1 dB step size, allowing for both precision and accuracy during fading tests or device characterizations. This attenuator also features a fast 15 us switching speed, an operating temperature from -30oC to 50oC, a maximum RF input of +28 dBm, and is priced at $875. The LDA602-EH operates with a low insertion loss of 9 dB to 6 GHz, an input IP3 of +55 dBm and a typical VSWR of 1.3:1. Easily programmed for ATE applications, the LDA digital attenuators are a cost effective solution whether you are in engineering, the production test lab, or in the field. Units are ROHS compliant and can be used with any PC or laptop computer with USB 2.0 port (or powered USB hub) and Windows operating system. Lab Brick Signal Generators are provided with easy to use Lab Brick GUI software, 32 and 64 bit API DLL files, LabVIEW and Linux compatible drivers.

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