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Wafer Edge
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Edge AI Box
EPC-R7000
EPC-R7000 is an ARM-based Edge AI Inference Box Computer powered by NVIDIA® JETSON™ TX2 Dual-Core NVIDIA Denver2 + Quad-core ARM Cortex-A57 processor and NVIDIA Pascal™ 256 CUDA cores GPU which provides high performance computing and supports the AIM-Linux/Edge AI Software Package. It is an ideal solution for AI and Machine Vision applications.
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Edge AI Box
Arm-based edge AI boxes are powered by NXP, NVIDIA and Rockchip. They provide AI inference capabilities in a low-power fanless design.
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Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Universal Edge Finder
BORDO
No matter what surface condition may be given, our easy to use BORDO detects various edges in incident light and measures their position. The results of the measurement are transmitted with 1/10 mm resolution via a digital or serial interface to a PC or a PLC which now can place the object into the desired position. This makes BORDO being the perfect tool in many lay-down processes such as the alignment of tiles or other pressed goods. Other applications are checks of alignment. BORDO succeeds even under hard onditions e.g. with missing background, if a thickness of at least 5 mm is given. With its lasercross BORDO is fast and simple adjusted. Another ighlight are the selfregulating algorithms , which optimize parameters of easurement while processing.
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360° Edge Analytics
360° Edge Analytics fills the gap between location data and the individual business application. The Location Data Analytics technology leverages precise position data augmented by application context information to gain business insights from complex processes. Assessment, optimization as well as process restructuring will be possible with nanotron’s complete solutions based on its Location-Aware IoT Platform with Location Data Analytics.
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Edge Compute Solutions
Innovate in real time. With the world’s largest serverless compute platform, Akamai puts your code closer to your users.
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Edge Gateway
Arm-based industrial gateways are based on NXP, Qualcomm, Rockchip, and TI, delivering LTE, 5G and Wi-Fi with wide operating temperature range.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Edge AI & Intelligence Solutions
Advantech provides a series of edge AI modules, AI inference systems, edge intelligence servers and IoT gateways to accelerate AIoT development.
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Stand Alone Wafer Sorter
MicroSORT
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Edge Gateway
UBC-330
UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Azure SQL Edge
Bring the security and performance of the Microsoft SQL engine to the edge with Azure SQL Edge running on ARM64 and x64 architecture. This productivity tool for edge computing combines new capabilities such as data streaming and time series with in-database machine learning and graph features. Develop your application once and deploy anywhere across the edge, your datacenter, and Azure. Get the Microsoft SQL database engine optimized for the edge for as low as USD60 per device.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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In-situ Wafer Temperature Monitoring
CI Semi's family of noncontact temperature monitors (the NTM line), offers high end pyrometry products for the measurement of wafer temperatures during process. CI Semi’s flag ship of the line, the NTM Delta, incorporates real-time, same point emissivity measurement and compensation making it the ideal solution for in situ monitoring for processes such as RTP, CVD and PVD. The NTM family is sold to leading tool manufacturers.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Edge Connector Fixture
EDGE
An edge connector fixture can be a low cost alternative to a bed of nails fixture. The most important features of this Edge Connector Tester is its portablility, ease of use, intuitive control functions, and durability in a production environment.
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Signage & Edge Computers
Compact, powerful computers and servers support diverse smart city applications at edge points.
