Memory Test Systems
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Product
Memory Test Systems
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ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Product
Memory Test System
T5851/T5851ES
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The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Product
Memory Test System
T5833/T5833ES
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T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Product
Memory Test System
T5801
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Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Product
Memory Test System
T5835
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The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Product
Memory Test System
T5830/T5830ES
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Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Product
Memory Test System
T5221
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The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
Memory Test System
T5230
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T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Product
Memory Test System
T5511
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Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Product
Memory Burn-In Test
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The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Product
Flash Memory Test System
T5830
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T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Product
Display Driver Test System
T6391
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High-resolution flat-panel displays (LCDs / OLEDs) are becoming increasingly integrated. It is common for today's display driver ICs (DDIs) to contain a multitude of logic/analog circuits to manage advanced operations including touch-sensor functions. At the same time, the rapidly growing applications of LCDs / OLEDs in mobile electronics are driving demand for DDI's with smaller sizes and greater capabilities. These factors present serious IC-testing challenges. ADVANTEST's T6391 system is designed to address these needs along with DDIs' increasing number of pins and faster interfaces.
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Product
Seno-Con Test System
PANTHER 2K QST
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Qmax Test Technologies Pvt. Ltd.
Panther 2K-QST is a versatile ultra fast Seno-Con test system designed to test high volume ,low to high pin count consumer semiconductor IC’s for its assembly line wire bonding faults. Its innovative test technology helps learn from known good device and test against target device drastically reduces time required to develop Test programs.The operating software is designed in such a way that it is fully user friendly with GUI programming.
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Product
OLED Lifetime Test System
58131
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The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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Product
LTE RRM Test System
T4010S
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The T4020S LTE RRM tester is the Keysight platform for LTE RRM conformance testing of LTE UEs. T4020S belongs to the Keysight LTE product family and, as the other LTE T4000S test platforms, is based on the T2010A LTE Wireless Communications Test Set.
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Product
Photonics Wafer Probing Test System
58635
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The advancement of the photonics device technology continues to enable broader and more demanding applications in the industry.
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Product
Regenerative Battery Pack Test System
17040E
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High-power testing equipment up to 1,700V/ 4800A/ 1.2MW Multiple safety protections for personnel safety risk management and control of battery testing Flexible Integration for automated battery verification solutions
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Product
H(3)TRB & HTGB Test Systems
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SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
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Product
Test System
BMS HIL
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The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Product
VLSI Test System
3380P
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The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Product
SoC Test Systems
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SoC (System on Chip) devices integrate multiple different functions into a single chip. Our SoC test systems can test all the integrated circuits in SoC devices, including logic, analog, RF, DC and imagers by flexible configuration of the cards/modules used in the test system.
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Product
Rack based antenna test system
R&S®ATS800R CATR
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Very compact far-field over-the-air (OTA) test system based on compact antenna test range (CATR) technologyUnrivaled quiet zone size within 0.8 m2 footprintState-of-the-art reflector ensuring a high quiet zone accuracyUnique rack based CATR system supporting over 50 GHzIndirect far-field method (approved by 3GPP for 5G OTA testing)
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Product
Build-to-Print for Test Systems
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Built-to-print / test system replication addresses your internal capacity and capability constraints. Ball Systems has perfected quoting, procurement, planning, assembly, testing, quality, delivery and installation to ensure your testers are on-time and on-budget, and meet design and production standards while keeping open and transparent communication.
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Product
OTP-Based Test System
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Power electronics assemblies often cannot be tested using conventional technology for their electrical performance. Due to the adaptability of the instrumentation, the OTP concept offers an ideal platform even beyond the space requirements of several control cabinets. In order to achieve high test flexibility with different assemblies, the system was equipped with three-phase AC sources and AC loads as well as a precise three-phase power meter. DC sources and loads with different current and voltage ranges cover the test of frequent DUT operating parameters. Time-dependent voltage or current signals can be stimulated by an arbitrary generator with power amplifier. General measurements such as current, voltage, frequency, resistance can be carried out flexibly at various test points using the matrix concept. An oscilloscope with RF multiplexer is available for high-frequency measurements such as residual ripple, switching processes, etc.
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Product
Photonics Module Test System
58625
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Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Product
VLSI Test Systems
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50/100 MHz clock rate50/100 Mbps data rate1024 I/O pins (Max :1280 I/O pins)Up to 1024 sites Parallel testing32/64 M pattern memoryVarious VI sourceFlexible HW-architecture (Interchangeable I/O, VI, ADDA,)Real parallel trim/match functionTime & frequency measurement unit (TFMU)High-speed time measurement unit (HSTMU)AD/DA test optionSCAN test option (max 1G M/chain)ALPG test option for embedded memorySTDF tools supportTest program/pattern converter(J750, D10, V50, E320, SC312, V7, TRI-6020, ITS9K)User friendly windows 7 environmentCRAFT C/C++ programming languageSW (Software) same as 3380P & 3360P
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Product
In-Circuit Test
TestStation LH
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The TestStation LH in-circuit test system is a lower-cost, small footprint, feature scalable version of Teradyne's popular, award winning TestStation product family. TestStation LH features SafeTest protection technologies for accurate, reliable, and safe testing of the latest low-voltage technologies.
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Product
Photodiode Burn-in Reliability Test System
58606
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The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Product
Bluetooth RF Test System
FRVS
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FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
