Memory Test Systems
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Product
Memory Test Systems
T5503HS2
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Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Product
Memory Test Systems
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ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Product
Memory Test System
T5511
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Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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Product
Memory Test System
T5830/T5830ES
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Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Product
Memory Test System
T5833/T5833ES
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T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Product
Memory Test System
T5230
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T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Product
Memory Burn-In Test
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The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Product
Memory Test System
T5221
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The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Product
Memory Test System
T5851/T5851ES
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The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Product
Memory Test System
T5835
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The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Product
Flash Memory Test System
T5830
Test System
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Product
Memory Test System
T5801
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Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Product
Automatic Test System
Test System
Automatic Test system is the ultimate solution for power electronic testing. The system includes a wide range of hardware choice such as AC/DC Sources, Electronic Loads, DMM, Oscillate Scope, Noise Analyzer and Short /OVP Tester. This flexibility combined with its open architecture software platform-PowerPro III, gives users a flexible, powerful and cost effective test system for almost all types of power supply testing.
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Product
RSE Wireless EMC Spurious Emission
TS8996
Test System
The R&S®TS8996 RSE test system is designed for EMI and radiated spurious emission testing on wireless devices in semi-anechoic or fully anechoic chambers. The modular design makes it easy to extend the system to include new communications technologies. Typical devices under test include mobile phones or radio sets along with radiated measurements of other short-range devices. Standards require a wide range of test setups and a wide and high frequency range (up to 40 GHz). ESW or FSW frequency ranges are extended up to 325 GHz with option B21 using receive units TC-RSE for 5G FR2. Dedicated RSE test routines are also covered for this frequency range.
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Product
Component Test Systems
Test System
These products include test peripherals used with test systems, such as interfaces that connect semiconductor devices with test systems, and handlers that transport semiconductors to the test system. System-level test equipment and software are also included in this category.
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Product
VXI Digital Multiplier
4152A
Test System
The 4152A’s advanced features like limit testing, averaging, speed/resolution trade-offs, and fast function changes provide the high “test system” throughput required in today’s production test environments.
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Product
VLSI Test System
3380D
Test System
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Product
Mixed Signal Battery Test System
Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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Product
ESD Test System
58154 Series
Test System
ESD (Electrostatic Discharge) Test Systems are PXI/PCI controlled module to simulate electrostatic discharge pulse during electronic device testing. The 58154 series offer both ESD STM5.1-2001-Human Body Model and ESD STM5.2-1999-Machine Model. The user friendly software offers programmable and flexible features, such as sampling test on a wafer, ESD model, ESD pulse polarity, ESD pulse interval in a sequence, and automatic testing function.
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Product
Test System
BMS HIL
Test System
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Product
OTP-Based Test System
Test System
Power electronics assemblies often cannot be tested using conventional technology for their electrical performance. Due to the adaptability of the instrumentation, the OTP concept offers an ideal platform even beyond the space requirements of several control cabinets. In order to achieve high test flexibility with different assemblies, the system was equipped with three-phase AC sources and AC loads as well as a precise three-phase power meter. DC sources and loads with different current and voltage ranges cover the test of frequent DUT operating parameters. Time-dependent voltage or current signals can be stimulated by an arbitrary generator with power amplifier. General measurements such as current, voltage, frequency, resistance can be carried out flexibly at various test points using the matrix concept. An oscilloscope with RF multiplexer is available for high-frequency measurements such as residual ripple, switching processes, etc.
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Product
Bluetooth RF Test System
FRVS
Test System
FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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Product
VLSI Test System
3380P
Test System
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (512 I/O pins to test 512 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Product
SAS Protocol Test System
Sierra M124A
Test System
The SAS Sierra M124A Protocol Test System is Teledyne LeCroy's 7th generation protocol analyzer system that provides 100% accurate protocol capture of both SAS (SAS 3.0) and SATA (SATA 3.0). The industry's most widely used test platform for SAS and SATA features unmatched analysis and debug capabilities to help pinpoint problems at every layer of the protocol.
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Product
H(3)TRB & HTGB Test Systems
Test System
SET offers two H(3)TRB and HTGB product lines which differ in the number of test object channels and the range of technical possibilities. The innovative systems are scalable, modular and standardized.
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Product
Automated Test Systems
Test System
WinSoft designs, develops and integrates automated functional test systems for use in aerospace, military, high tech and commercial applications
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Product
In-Circuit Test System
TestStation LX
Test System
TestStation LX is a cost-effective in-circuit test solution providing high-volume electronics manufacturers with reliable, high-quality test for the latest printed circuit board assembly technologies.
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Product
Advanced SoC Test System
3680
Test System
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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Product
Seno-Con Test System
PANTHER 2K QST
Test System
Qmax Test Technologies Pvt. Ltd.
Panther 2K-QST is a versatile ultra fast Seno-Con test system designed to test high volume ,low to high pin count consumer semiconductor IC’s for its assembly line wire bonding faults. Its innovative test technology helps learn from known good device and test against target device drastically reduces time required to develop Test programs.The operating software is designed in such a way that it is fully user friendly with GUI programming.
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Product
LitePoint RF Test System
J750
Test System
The option of adding LitePoint instrumentation to the J750 system delivers a cost-effective, complete production test solution covering global wireless connectivity standards.
