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Product
COM Express
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COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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Product
COM Express Type 7
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COM Express Type 7 with NXP platforms provides super speed I/O, high-bandwidth expansion interfaces, and 10 x GbE interface for data transmission.
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Product
COM Express Type 6
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The COM Express Type 6 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Type 2
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The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Product
COM Express
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The COM Express product platform includes Intel©-based CPU modules and Type 2/3 or Type 6 carrier cards. Additionally, support products are available for prototyping and production such as: development systems, MIL-DTL-38999 front panels, and an assortment of cables.
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Product
COM Express Type 7
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One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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Product
COM Express Type 6
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The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Product
COM Express Type 6 Development Kit
COM Express Type 6 Starter Kit Plus
Computer on Module
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Product
Ultra-Small SBC Using COM Express Type 10 CPU Modules
ZETA
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The Zeta COM Express SBC family of ultra-small embedded computer boards combines a COM Express Mini CPU module with a same-size carrier board to create a complete embedded PC. Designed in the COM Express Mini Type 10 form factor (84 x 55mm/ 3.3 x 2.2 in), Zeta provides an ultra-compact, industry-standard form factor solution.
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Product
COM Express Type 7 10GBASE-T Network Adapter Card
CEI-4x10GBASE-T
Network Interface Controller
- Support up to four 10GbE copper interfaces (10GBASE-T)- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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Product
COM Express Boards
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COM Express is a highly integrated Computer On Module. It can be considered as a component (integrated circuit) in more complex designs.
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Product
COM Express Type 7 10GbE Optical Fiber Network Adapter Card
10GbE Optical Fiber Network Adapter Card
Network Interface Controller
- Supports up to four 10GbE optical fiber interfaces (SFP+)- Compatible with PICMG COM.0 R3.0 Type 7 modules
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Product
COM Express Type 10
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The COM Express Type 10 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Type 10
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The COM Express Type 10 Mini (84 x 55 mm, credit card size) module is intended for low power platforms (TDP 12W and below), capable of entry level processing with ultra-low power consumption, while supporting graphics and optimized I/O count for mobile applications. Type 10 modules are targeted at handheld devices (smart battery) for industrial, medical, transportation, and controllers for outdoor applications.
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Product
COM Express PC/104 SBC with integrated Data Acquisition
ATHENA IV
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Each generation of Athena maintained the same physical shape and most of the I/O connectors and features of the previous generations, while updating key features to stay current with the state of the art. In this way the Athena platform has maintained a low-impact migration path for customers with extended product lifecycles that outstrip the lifetimes of the CPU. Many customers have been able to maintain their products for up to 16 years as a result.
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Product
COM Express basic Type 7 with Intel Atom processor
COMe-bDV7
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The COM Express module COMe-bDV7 based on the Intel Atom processor C3000 series extends Kontron's product family of server-grade COM platforms. The COMe-bDV7 as an entry level platform is as a complementary product to the high performance class COMe-bBD7 equipped with the Intel Xeon processor D-1500 series. The COMe-bDV7 module features scalable CPU performance with up to 16 cores.
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Product
COM Express Type 6 Compact Module With Intel® Atom™ Processor E3845
CEM843
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The CEM843 Intel® Bay Trail SoC system-on-modules come with 6 PCI Express lanes, eight USB signals, double deck DDR3L SO-DIMM sockets supporting up to 8 GB of system memory, and two SATA-300. The CEM843 utilizes quad cores Intel® Atom™ processor E3845, featuring a wide operating temperature range from -40°C to 85°C. The power-efficient compact module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs, human machine interface, IoT & M2M-related and industrial automation controllers.
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Product
COM Express Module
CM22202
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
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Product
COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
Computer on Module
The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor
CEM310
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The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).
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Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
Processor Blade
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
Computer on Module
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
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The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Computer on Module
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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Product
COM Express Type 6 Development Baseboard
CEB94011
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*COM Express type 6 baseboard for evaluation purpose*USB 3.0 supported*Port 80 display for debugging*Smart battery supported
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Product
COM Express Type 2
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Axiomtek COM Express Type 2 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
