-
Product
Mini Module
COMeT10-3900
-
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that can be plugged onto a carrier board that contains user-specific I/O requirements.
-
Product
Computer On Module
COMET6-DEVKIT-460-I7
-
The COMET6-DEVKIT-460-I7 is designed for rapid testing and evaluation of WINSYSTEMS’ COM Express Type 6 processor modules. This DevKit ships with WINSYSTEMS’ COMET6-1185GRE-32IL module and 11th Gen Intel® CORE™ i7 UP3-Class embedded processor. The DevKit includes all essential components for quick and easy system setup so you can start programming right out of the box, reduce engineering and software development time, perform rapid product evaluation, design validation, and speed time to market.
-
Product
Compact Carrier Board
CM22002
-
LinkedHope Intelligent Technologies Co.,Ltd.
CM22002 is a compact carrier board which matches the dimensions of a COM Express® Basic module.CM22002 is ideal for space constrained applications, and supports extended temperature ranges of -40℃ to +85℃.
-
Product
Development Board
SOM-DB5800
-
Development Board for COM Express® R2.1 Type 6 / 10 Modules. Development Board Compliant to PICMG COM.0 R2.1 Type 6 / 10 Pin-out. Support COM Express Basic, Compact & Mini modules. Expansion: PCIe x16, PCIe x4, PCIe x1, Mini-PCIe, Express Card.
-
Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
-
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
-
Product
COM Express Type 10 Reference Carrier Board
miniBASE-10R
-
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
-
Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
-
The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
-
Product
Single Board Computers
SBC
-
Our extensive line of compact, rugged SBCs is based on CPUs targeting embedded applications, ranging from the economical AMD LX800 and Vortex86DX to the high performance Intel Core i7 latest generation U series Skylake/Kaby Lake. These products adhere to industry-standard form factors such as PC/104, COM Express, ETX, EPIC, and EBX.
-
Product
Multipurpose Debug Board
DB40 Debug Module
-
The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: - Port 80/81 decoding for Power On Self Test (POST) via LPC - Interface to SPI Flash for BIOS update - Interface to Board Management Controller (BMC) for update - Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. (Includes DB40 Debug Module, two 40-pin FFC cables, and 14-pin cable for SP100 DediProg USB to SPI programmer.)
-
Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
-
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
-
Product
COM Express Type 7 10GBASE-T Network Adapter Card
CEI-2x10GBASE-T
-
- Support up to two 10GbE BASE-T interfaces- Marvell AQR113C inside- COM.0 R3.1 Type 7 compliant- Dedicated for Express-VR7
-
Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
-
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
-
Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
-
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
-
Product
Computer-On-Module
ETX®
-
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
-
Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
-
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
-
Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
-
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
-
Product
Chassis Platforms
-
Elma offers a comprehensive range of standard, modified standard and custom packaging solutions with integrated backplane, power and cooling for; 19" rack-mount, test/development, and field deployable applications. Supporting the full range of VITA, PICMG and Small Form Factor architectures Elma has configurations based on VME, VME64x, OpenVPX, AdvancedTCA, CompactPCI, CompactPCI-Serial and COM Express.
-
Product
Computer On Module
ITX-M-CC452-T10
-
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
-
Product
COM-Based SBC with WL8665UE CPU / COM Express Carrier
GEMINI
-
GEMINI is a COM Express Compact type 6 carrier board and SBC with PCI/104-Express I/O expansion. Feature-rich GEMINI offers the highest performance in a compact 4.0 x 4.0' / 102 x 102mm size, with its combination of COM Express CPU module and full support for PCIe/104 type 1 connectivity (PCI-104 up to 4 modules, PCIe-104 x1 up to 4 modules, and PCIe/104 x16). Gemini is designed to support a variety of COM Express modules including Bay Trail, Apollo Lake to Core i7 8th generation and Xeon.
-
Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
-
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
-
Product
COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
-
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
-
Product
COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
-
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
-
Product
COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
-
The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
-
Product
COM Express Type 7 10GBASE-T Network Adapter Card
CEI-4x10GBASE-T
-
- Support up to four 10GbE copper interfaces (10GBASE-T)- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
-
Product
COM Express Type 10 Mini Module With Intel® Atom™ E3800 Family
CEM846
-
The CEM846 COM Express type 10 Mini module is powered by the Intel® Atom™ processor E3800 family (codename: Bay Trail) with Intel® HD graphics (Gen 7with 4EU) engine. The CEM846 addresses the need for modular and small form factor computing platform that provides flexibility and scalability, and aimed at operating in an extended range of temperature. The computer on module is only 84mm x 55 mm form factor which supports onboard 4 GB DDR3L memory, wide voltage, rich I/O, and four lanes of PCle interfaces. From all these features together, the Intel® Atom™-based COM Express type 10 CPU module can be widely applied to IIoT (Industrial Internet of Things), medical, transportation, security, military, portable device and many more.
-
Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
-
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
-
Product
COM Express Type 7
-
The COM Express Type 7 modules deliver powerful server-class performance in a small form factor. Its high-speed interfaces and extreme performance increases the flexibility for building up Industrial IoT applications which are in need of multi-tasking, multi-threading or video rendering. Axiomtek’s COM Express Type 7 modules are well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughput, such as edge computing, micro server, data transmission device, and other networking fields.
-
Product
COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
-
The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
-
Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
-
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
-
Product
COM Express Type 6 Application Board With MXM Slot
CEB94022
-
*MXM type A supported*SATA-600*LVDS, VGA, HDMI, and DisplayPort*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS-232/422/485 and 1 RS-232
