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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
Computer on Module
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
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The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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Product
Mini Type 10 Module
SOM-7532
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Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) COM Express® Mini Type 10 Module. COM Express® R3.0 Mini Module Type 10 Pinout, Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors.
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Product
COM Express Type 6 Application Board With LVDS, VGA, DDI, Dual LANs And Audio
CEB94021
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*125 x 95 mini size form factor*2 GbE LANs*SATA-600*LVDS, VGA and DDI*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS- 232/422/485 and 1 RS-232
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Type 7 Starter Kit
COMe Type 7 Ice Lake-D STKit
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The Type 7 Starter Kit Plus consists of a COM Express Type 7 module with ATX size Type 7 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for 10GbE adapter card that convert 10GBase-KR to 10GbE Optical Fiber or 10GbE Copper signal, one PCI Express x16 slot, two PCI Express x8 slots, Serial ATA, USB3.0/2.0, Gigabit LAN and Super I/O. in addition, a IPMI BMC (miniBMC) located on carrier board connect to COM Express Type7 module by NC-SI interface to support some of out-of-band management features. All necessary cables are included.
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Product
COM Express Type 10 Reference Carrier Board
miniBASE-10R
Carrier Board
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
COM Express® R3.1 Compact Module Type 6 Pinout
SOM-6873
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AMD Ryzen Embedded 8000 COM Express® Compact Type 6 Module. AMD RYZEN Embedded 8000, Hi-Performance Zen4 CPU up to 8C / 16T. AMD Radeon RDNA3 Graphics, 4 independent 4K displays.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Product
Development Board
SOM-DB5920
Carrier Board
Development Board for COM Express® R3.0 Type 7 Modules. PICMG COM.0 R 3.0 Type 7 Pin out. COM Express ® Basic/Compact module, 10 Gigabit Ethernet support by OCP mezzanine card. Extension: PCIe x16, PCIe x8, 2 PCIe x4.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
Computer on Module
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
Computer on Module
The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Computer On Modules
COM Express Mini
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Advantech COM Express Mini series boards includes Intel Core i, Intel 4th Generation, Intel Atom processor. With mere 84 x 55 mm in size, COM Mini series are the most compact COM modules and match all demands from Intel Core i, Intel 4th Generation, to Intel atom processor. COM Express Mini series is compliant with the COM Express Type 1/10 standard pin definition, and with a slight modification are able to commit with the existing COM Express carrier boards.
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Product
COM Express Type 6
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The COM Express Type 6 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Product
COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Computer on Module
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
Compact Carrier Board
CM22002
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22002 is a compact carrier board which matches the dimensions of a COM Express® Basic module.CM22002 is ideal for space constrained applications, and supports extended temperature ranges of -40℃ to +85℃.
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Product
Ultra-Low Power Computing Module
CM22303
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22303 uses Intel® 7th generation Kaby Lake-Y platform and Core M Ultra low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.6 GHz and the display output resolution can be up to 4K. CM22303 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. SPI BIOS is designed on board to support dual-channel low voltage on board memory (up to 16GB), Gigabit Ethernet, TPM module and other functions. With high-performance and low power consumption, it can be widely used in the field of low power embedded systems. Meanwhile, CM22303 adopts COM Express standard and is compatible with Type10 pin out definition, and also provides rich peripheral interfaces such as USB3.0/2.0, PCIe, SATA, HD Audio etc.
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Product
Intel® Atom™ E3900 & Pentium® / Celeron® Processor COM-Express Mini Module
SOM-7569
Computer-on-Module
COM R.2.1 Type 10 Mini Module, Intel® Atom™ E3900 & Pentium® / Celeron® Processor, Max 8GB DDR3L onboard memory (support ECC, E3900 SKU only).
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Product
Chassis Platforms
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Elma offers a comprehensive range of standard, modified standard and custom packaging solutions with integrated backplane, power and cooling for; 19" rack-mount, test/development, and field deployable applications. Supporting the full range of VITA, PICMG and Small Form Factor architectures Elma has configurations based on VME, VME64x, OpenVPX, AdvancedTCA, CompactPCI, CompactPCI-Serial and COM Express.
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Product
COM Express PC/104 SBC with integrated Data Acquisition
ATHENA IV
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Each generation of Athena maintained the same physical shape and most of the I/O connectors and features of the previous generations, while updating key features to stay current with the state of the art. In this way the Athena platform has maintained a low-impact migration path for customers with extended product lifecycles that outstrip the lifetimes of the CPU. Many customers have been able to maintain their products for up to 16 years as a result.
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Product
COM Express
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The COM Express product platform includes Intel©-based CPU modules and Type 2/3 or Type 6 carrier cards. Additionally, support products are available for prototyping and production such as: development systems, MIL-DTL-38999 front panels, and an assortment of cables.
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Product
Computer-on-Modules
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Arm-based Computer-on-Module with OSM, SMARC, Qseven, rugged RTX, and COM Express Type 7 as well as embedded board design services.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
COM Express Type 2
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The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
