Thin Film
layer of material ranging < a nanometer to > a micrometer in thickness.
See Also: Film, Ellipsometers
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TFProbe Wafer Measurement Tools
Angstrom Sun Technologies, Inc.
Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.
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Instrumented Indentation Tester
With Anton Paar’s versatile indentation testers you can precisely determine the mechanical properties of thin films, coatings, or substrates such as hardness and elastic modulus. The instruments handle almost any type of material, whether soft, hard, brittle, or ductile. You can also conduct creep, fatigue, and stress-strain studies on surfaces in the nanometer range.
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Powerful and Cost Effective Spectroscopic Ellipsometer
Smart SE
The Smart SE from HORIBA Scientific is a versatile spectroscopic ellipsometer for fast and accurate thin film measurements. It characterizes thin film thickness from a few Angstroms to 20µm, optical constants (n,k), and thin film structure properties (such as roughness, optical graded and anisotropic layers, etc).The spectral range from 450 to 1000nm is measured in a few seconds and ellipsometric data are analyzed using the DeltaPsi2 software platform. The software integrates two levels of software to fulfil both routine analysis with predefined recipes and advanced analysis with state-of-the art ellipsometric modelling.
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FWDM Module
Flyin Optronics' Micro-Optical WDM utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging. It provides low insertion loss, high channel isolation, low temperature sensitivity and epoxy free optical path.
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PLD Systems
Pulsed Laser Deposition
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Datapaq Solar Tracker System
The SolarPaq® Thermal Profiling Systems from Fluke Process Instruments are designed specifically for solar photovoltaic (PV) manufacturing including applications like contact firing, contact drying, anti-reflection coating for the solar cell, lamination and other thin film processes. These systems, consisting of user-friendly Insight™ software, Datapaq® Q18 data loggers, stainless steel thermal barriers, thermocouples with PTFE or mineral insulation and accessories, provide users with the tools needed to gather accurate, repeatable results for process optimization, maximize cell efficiency and throughput, and more.
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CWDM Mux/Demux in LGX Box(4,8,16,18-Channel)
Flyin Optronics’ Coarse wavelength division multiplexer (CWDM Mux/Demux) utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging. It provides low insertion loss, high channel isolation, wide pass band, low temperature sensitivity and epoxy free optical path.
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Metrology System
IMPULSE V
With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Ellipsometer
alpha-SE®
For routine measurements of thin film thickness and refractive index, this ellipsometer allows you to mount a sample, choose the model that matches your film, and press "measure". You have results within seconds. Works with your materials - dielectrics, semiconductors, organics, and more.
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Compact Passive and Active Resistor Trimming for Thick and Thin Film
LRT 2000C
*Travel: 6" x 6"*Laser : Fiber Laser Ytterbium 1064 nm*Kerf: 30 to 80 micron Adjustable*Pulse width : 80 nano second*Rap Rate: 1 to 1 million Pulse Per Second*Average Power: 20 watts
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100GHz Dense Wavelength Division Multiplexer
DWDM-1000
Hangzhou Huatai Optic Tech. Co., Ltd.
DWDM series is based on mature thin film filtering technology and adopt metal sealing technology to encapsulate. It has the feature of flat channel bandwidth, flexible channel configuration, low insert loss and high isolation. The flexibility of channel configuration and modularized design make it convenient for system upgrading and expanding. All the Huatai products have no epoxy glue in optical line and can be used in high power optical communication system.
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Pure Boron Foils
MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Microspectrophotometer
MSP Series
Angstrom Sun Technologies, Inc.
Microspectrophotometer (MSP) is an advanced optical system. The key difference with typical low cost reflectometer is in its capability to characterize optical properties of thin films over a micron region area. With unique design by Angstrom's professionals, user can enjoy digital imaging capability in Microspectrophotometers (MSP series) by live video, powerful digital editing, measurement tools for reflection, transmission, absorption spectra. Data acquisition only takes milliseconds.
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ALD Advantages
Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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DUV-NIR Spectroscopic Reflectometry
FilmTek 2000
Scientific Computing International
Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of a second per site.
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Spectroscopic Ellipsometry
Spectroscopic ellipsometry is a surface-sensitive, non-destructive, non-intrusive optical technique widely used for thin layers and surface characterization. It is based simply on the change in the polarization state of light as it is reflected obliquely from a thin film sample. Depending on the type of material, spectroscopic ellipsometers can measure thickness from a few Å to tens of microns. It is also an excellent technique for multi-layers measurement.
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1550 & 1310/1490nm MWDM
WD1543
Hangzhou Huatai Optic Tech. Co., Ltd.
WD1543 WDM is based on mature thin film filtering tech, with wide bandwidth, flatness, low insertion loss and high isolation. It is mainly applied to FTTx PON network to achieve the combination and separation of the 1550nm (CATV) and 1310/1490nm (data).
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Multi-Test Resistivity Measurement System
Sheet resistance mapping of thin films with a collinear 4-point probe, Temperature co-efficient of resistance (TCR) of thin films with collinear 4-point probe, Precision temperature co-efficient of resistance (TCR) with 2-point Kelvin probes and precision surface temperature probe, resistor testing with 2-point Kelvin probes,Precision resistor testing with a Kelvin probe card, temperature co-efficient of resistance resistor test (TCR), and Standard TCR test of multiple resistors with Kelvin probes or a probe card.
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Surface Analysis
A UHV surface analysis system for thin film depth profilingMeasures the surface composition of the first few nanometers and/or micrometers depth of solid samples.
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Dynamic Ultra Micro Hardness Tester
DUH-210/DUH-210S
A new evaluation system for measuring the material strength of micro regions, such as semiconductors, LSI, ceramics, hard disks, vapor deposited films, and thin coating layers, not addressed by previous hardness testers. It can also be used to evaluate the hardness of plastics and rubbers. This instrument uniquely measures dynamic indentation depth, not the indentation after the test. This in turn permits measurement of very thin films and surface (treatment) layers that are impossible to measure with conventional methods. Additionally, this same method supplies the data needed to calculate elastic modulus on the test specimens.
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Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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RF Amplifiers
UST specializes in the testing, repair and refurbishment of all types of RF amplifiers (broadband and narrowband), microwave amplifiers and millimeter-wave amplifiers: solid state, thin film, traveling wave tube (TWT), low noise RF amplifiers, intermediate power RF amplifiers, limiting RF amplifiers, doubler RF amplifiers, driver RF amplifiers, variable gain RF amplifiers, and active frequency multipliers.
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RFoG 4-Band Multiplexer. 1550, 1590 & 1310/1490nm MWDM
WD5943
Hangzhou Huatai Optic Tech. Co., Ltd.
WD5943 WDM is based on mature thin film filtering tech, with wide bandwidth, flatness, low insertion loss and high isolation. It is mainly applied to FTTx PON network to achieve the combination and separation of the 1550nm (CATV) and 1310/1490nm (data).
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Adhesion Tester
ilm adhesion testing of thin films and stacks on substrates for material evaluation.
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Hybrid Amplifiers
Gain Block
Macom Technology Solutions Holdings Inc.
MACOM’s portfolio of hybrid amplifiers cover a frequency range of 10 kHz to 6 GHz. Each amplifier is designed to be unconditionally stable and have excellent cascadability. Our amplifiers are designed using thin film technology and are integrated components thindat include internal DC biasing circuitry, allowing them to maintain excellent electrical performance over the 55˚C to 100˚C range. Hermetically sealed and screened up to space level, these amplifiers are ideally suited for hi-reliability and mission critical applications.
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Benchtop Amplifiers
Benchtop, broadband driver amplifiers are designed and manufactured by utilizing the most advanced PHEMT or MMIC devices, thin film technologies, and an improved DC power supply to deliver a high output power and a superior gain flatness and low noise performance. The standard offering focuses on general purpose applications and covers the frequency range of 1 to 110 GHz. However, custom designs are also offered to meet any user’s specific needs.
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Thin Film SPY Inspection w/ Built In Jeep Meter
780
For thin film coatings the easy-carry and easy to handle SPY Model 780 speeds inspection time with its built in Jeep meter and various other time saving and comfort features.
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Benchtop Metrology System
FilmTek 2000 SE
Scientific Computing International
Benchtop metrology system delivering unmatched measurement performance, versatility, and speed for unpatterned thin to thick film applications. Ideally suited for academic and R&D settings. Combines spectroscopic rotating compensator ellipsometry, multi-angle polarized spectroscopic reflection, and intuitive material modeling software to make even the most demanding of measurement tasks simple and reliable.
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NEX CG II Energy Dispersive X-ray Fluorescence Spectrometer
NEX CG II
Applied Rigaku Technologies, Inc
NEX CG II, a powerful second-generation energy dispersive X-ray fluorescence (EDXRF) spectrometer, delivers rapid qualitative and quantitative determination of major and minor atomic elements in a wide variety of sample types — from oils and liquids to solids, metals, polymers, powders, pastes, coatings, and thin films.
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Physical Vapor Deposition Systems
Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
