Showing results: 571 - 585 of 1176 items found.
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Bowers Group
Designed to measure both internal and external diameters and lengths, the high modulus carbon fibre beam is stiff, lightweight and has an extremely low co-efficient of thermal expansion (CTE). Suitable for measuring high accuracy diameters and lengths up to 4000mm+.
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Radiant Technologies, Inc.
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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FLIR A35 -
Teledyne FLIR
The FLIR A35 is a thermal imaging temperature sensor for condition monitoring, process control/quality assurance, and fire prevention applications. The A35 integrates seamlessly into existing systems, offering comprehensive visual temperature monitoring. As part of the Ax5-Series, the A35 is among the only thermal imaging temperature sensors on the market to provide temperature linear output through GenICam™ compliant software.
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FLIR X6980 SLS™ -
Teledyne FLIR
The FLIR X6980 SLS is an extraordinarily fast longwave IR camera designed for scientists and engineers who need to capture high-speed imagery for accurate thermal analysis and custom radiometric measurements. This thermal imaging camera combines 640 × 512 resolution from the SLS detector with the fastest high-speed frame rates to offer the shorter snapshot speeds and wider temperature bands needed to record crisp stop motion images of high-speed events. With a four-position motorized filter wheel and support for FLIR motorized focus lenses, the X6980 SLS will provide high quality recordings, save time, and mitigate frustration in dynamic acquisition environments.
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TA Instruments
Heating microscopy is a non-contact technique that, based upon an advanced image analysis of a specimen subjected to a thermal treatment reproducing industrial firing conditions, identifies several characteristic shapes and related temperatures key to the optimization of manufacturing processes in ceramics, metals, and alloys.
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Mitsubishi Electric Automation, Inc
Mitsubishi Electric thermal overload relays protect motors and motor circuit conductors against over heating caused by current overloads and or phase-loss. The TH-N and TH-T series relays can be paired with the Mitsubishi Electric contactors or utilized as a stand-alone overcurrent protection device.
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JEOL Ltd.
Thermal damage can be reduced by cooling the specimen with liquid nitrogen during processing.Designed to suppress the consumption of liquid nitrogen, allowing long cooling periods.Rapid cooling of the specimen while immersed in liquid nitrogen. Return to room temperature. Designed to allow parts to be detached.
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MIV-X -
Shimadzu Corp.
Thanks to Shimadzu’s proprietary light imagining technique, which combines an ultrasonic oscillator with a stroboscope, defects near the surface of a material, including peeling of the bonding and adhesive surfaces of heterogeneous materials, as well as paint, thermal sprays, and coatings can be inspected easily and non-destructively.
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MMS Series -
Carl Zeiss AG
The MMS family is a series of cost-efficient, miniaturized and robust spectrometers. This high-throughput spectrometers are equipped with a diode array detector for highest SNR, ideally suited for portable, process and OEM applications. The optical design ensures permanent calibration, thermal stability and long lifetime.
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Minitile™ with Advanced Cantilever™ technology and WedgeTile™ -
Celadon
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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PHT-3500 -
Phase II Plus
State of the art, digital tester is designed to test the hardness of large hard metal parts. Loaded with useful functions and a built in mini-printer the PHT-3500 is clearly the industry leader for fast accurate hardness testing with advanced USB output and thermal printing capabilities.
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Premier Electrosystems
Premier Electrosystem's apparatus are used for testing screwless terminals. These tests are used to check the effect of electric and thermal stress on screwless terminals. Deflection test is used to check the effect of mechanical movement on the screwless terminals. The products are designed as per IS 1293, IS 3854.
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323 -
Ballentine Laboratories, Inc.
The Ballantine 323 True RMS analog ac voltmeter uses advanced true rms circuitry to achieve square law response from rugged, fast responding silicon diode detectors with no thermal lag and overload vulnerability inherent in thermocouple devices.
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MIC-3332 -
Advantech Co. Ltd.
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.