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Chip Manufacturing
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Thickness Gauges for Plastic films & Paper
CHY-CA
CHY-CA is a highly precise thickness gauge with mechanical contact method, which can be used to measure the thickness of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Scorch Tester (Sublimation Fastness Tester)
TF415D
TESTEX Testing Equipment Systems Ltd.
Scorch Tester, to determine fabrics Ironing color fastness and sublimation color fastness, and dimensional stability under hot dry conditions. Sublimation Fastness Tester complies with ISO 105, BS 1006, AATCC 92/114/117/133. Sublimation machine price is reasonable.
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Water Vapour Permeability Tester
TF165B
TESTEX Testing Equipment Systems Ltd.
Water Vapour Permeability Tester, to determine the resistance of textiles and textile composites (particularly action wear fabrics) to water vapour penetration. Water Vapour Permeability Tester complies with BS 3424/7209, etc.
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Oscillatory / Wyzenbeek Abrasion Tester
TF212
TESTEX Testing Equipment Systems Ltd.
Wyzenbeek Abrasion Tester. Modern ergonomic design to determine the abrasion resistance of fabrics when rubbed against a standard abrasive or a wire mesh screen with a backward and forward motion over a curved surface. Wyzenbeek abrasion tester applies to automotive and furniture industry fabric manufacturers working to US Standards Motor driven with 4 abrasion heads and electronic digital counter to control the number of cycles.
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3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-7 FPGA - XMC
Model 71720
- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with swtiched fabric interfaces- Optional user configurable gigabit serial interface- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Digital Signal Processor Card
CHAMP-FX2
Curtiss-Wright Defense Solutions
Utilizing a 6U VPX-REDI form factor, the CHAMP-FX2 FPGA-based computing platform harnesses the tremendous computing power of two Xilinx Virtex-5 FPGAs, combined with the high-performance floating-point capabilities of the NXP (formerly Freescale) MPC8641D dual-core Power Architecture processor and the performance and flexibility of a Serial RapidIO switching fabric to flexible computational performance.
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Bench & Characterization Boards
Engineer, Design, Fabricate & Assemble Custom Boards for:*Device Characterization and Verification*Bench Testing*Failure Analysis*General Laboratory Use
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81 lane, 21 port, PCI Express
PEX 9781
Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
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Controlled Environment Chamber
STME-CEC
Statclean Technology (S) Pte Ltd
The Controlled Environment Chamber is made from 0.25" clear and white acrylic with internal volume of 9 cu. ft. The equipment is designed to provide a controlled environment for conditioning, research, testing, fabrication and storage.
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Circular Locus Tester
TF225
TESTEX Testing Equipment Systems Ltd.
Circular Locus Tester, to determine surface deterioration and quality of fabrics (wool, chemical fiber, mixed, kitted and woven fabrics). Circular Locus Tester complies with GB/T 4802.1-2008, etc.
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Diode Submounts
Ultra-precise patterning of thin film metals on dielectrics with high thermal conductivity are used for diode submount applications. Via the acquisition of Ion Beam Milling, Inc., SemiGen is the industry leader for laser diode submount fabrication. As each application is different, we work with customers to develop a custom design that perfectly fits their requirements. We have experience producing circuits utilizing substrates of varying thicknesses with high thermal conductivity such as alumina (Al), aluminum nitride (AlN), and beryllium oxide (BeO). SemiGen can deliver laser diode submounts with or without Au/Sn pads depending on your needs.
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Systems Integration for Circuit Card Assembly
Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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EEE Component Testing and Screening Services
DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner.
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Wet Oxidation System For VCSEL Fabrication
VIXEL-320
The VIXEL-320 is a wet oxidation system intended for the fabrication of Vertical Cavity Surface Emitting Lasers. It is an atmospheric-pressure oxidation system with in-situ monitoring of oxide aperture formation. It accommodates single wafers of up to 150mm (6") in diameter.
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Electronic Yarn Count System
Y006
Consists of an electronic balance (220 grams x 0.001 grams) with internal and external custom software which calculates yarn, sliver and roving counts as well as fabric yield in various systems and provides statistics on any number of tests including totals, average, CV and SD
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40 Gigabit Ethernet AdvancedTCA® Fabric Interface Switch Blade
aTCA-3710
The aTCA-3710 is a high performance, high bandwidth, 40G Fabric switch blade for AdvancedTCA® platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controller, DPI/security network, IPTV, IP multimedia subsystem, RNC/BSC, broadband access/bearer network, data center, and LTE/4G network applications. The aTCA-3710 provides 40GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Thin Film Circuits
SemiGen offers build-to-print services for a wide range of materials and metallization schemes. We use our processing technology to fabricate circuits on As-Fired Alumina, Polished Alumina, Superstrate TPS, Aluminum Nitride, Beryllium Oxide, Fused Silica/Quartz, Sapphire, and Hi-K Dielectrics.
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Coefficient Of Friction Testers
Saicheng coefficient of friction (COF) tester is specialized in measuring the static and kinetic coefficients of friction of plastic film and sheet, rubber, paper, cardboard, woven bag, fabric style, metal material composite belt for communication cable and optical cable, conveyor belt, wood, coating, brake pad, wiper, shoe material, tire and other materials when sliding.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Process EDXRF Spectrometer
NEX LS
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX LS represents the next evolution of scanning multi-element process coatings analyzers for web or coil applications. To deliver superior analytical performance and reliability, the EDXRF measuring head assembly was derived from the established Rigaku NEX Series high-resolution benchtop instrumentation. With this proven technology, the Rigaku NEX LS delivers rapid, non-destructive, multi-element analyses — for coat weight, coating thickness and/or composition — for elements from aluminum (Al) through uranium (U). The measuring head is mounted on a rigid beam and is equipped with a linear traversing mechanism positioned over a roller so that the head-to-surface distance is constant. Common applications include silicone release coaters, converters, denesting Si for vacuum-formed plastics, RoHS compliance, conversion coatings, metalized plastic, top coatings on metal coil and fire retardants on fabric.
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PCB Design and Assembly
Innovative Circuits Engineering, inc
Turnkey services for Printed Circuit Boards: Design, Fabrication, Assembly and Testing
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Infrared Simulation Services
INO offers a simulation service to assist with the hardware and software design of infrared and electro-optical devices. Precise performance predictions help integrators understand application requirements and bring application performance in line with client specificationsbefore the advance design and fabrication phases. For a minimal investment, infrared simulations help minimize risk in the early stages of development.
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Air Traffic Control Antennas
Kratos Defense & Security Solutions, Inc.
Kratos’ Air Traffic Control (ATC) radar antennas and pedestals are manufactured in accordance with ISO9001 Quality Assurance to stringent specifications and perform to the exacting standards demanded of them. Kratos’ L-band and S- band Primary Surveillance Radar Antenna Systems are widely deployed and have a proven record of performance and reliability. Utilizing advanced antenna and pedestal design, these surveillance radar antenna systems are fabricated with proven performance advantages.
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2-Channel 200 MHz A/D with 766 DDCs, Kintex UltraScale FPGA - XMC
Model 71865
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete software radio receiver solution for extremely high-channel-count applications- Uses Xilinx Kintex UltraScale KU035 FPGAs- Two 200 MHz 16-bit A/Ds- Four wideband DDCs (digital downconverters)- Up to 762 narrowband DDCs- Sample clock generation and synchronization to an external system reference- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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6U VPX Intel Core i7 Broadwell SBC
VPX6-1959
Curtiss-Wright Defense Solutions
The VPX6-1959 rugged, high performance 6U OpenVPX Single Board Computer (SBC) combines Intel's powerful Core i7 processor with the power and flexibility of the VPX platform's high speed fabric interconnects.
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Plano Optical Substrate Fabrication
Keysight has the technology and expertise to fulfill all your requirements for precision plano substrates up to 300mm:
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Halt Hass Chambers
HALT and HASS chambers from WEIBER provide extreme temperature & vibration capabilities used during the product design and manufacturing cycles to compress the time normally required to identify design and process weaknesses. HALT techniques are important in uncovering many of the weak links inherent to the design and fabrication process of a new product. HASS techniques are incorporated during the production phase to find manufacturing process defects that could cause product failures in the field.
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20 x GB ETH Switch
SL4-TUBA
SL4-TUBA is a peripheral slot card for CompactPCI® Serial systems. The board is equipped with a modular Gigabit Ethernet switch fabric up to 20 ports.
