Showing results: 871 - 885 of 1149 items found.
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Cryogenic Ltd.
Adapted MCK model DR inserted into 50 mm 1.6 K300 K VTI VTI cooling power used for condensing stage of DR Versatile solution as the magnet system can also be used with other inserts and measurement probes including He3, heated probes, rotator, VSM etc. Bottom loading DR with options of sample in liquid or sample in vacuum Suitable for use with systems up to 18 T and neutron-scattering split-pair systems
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CIP-1000 -
Advanced Thermal Solutions, Inc.
The CIP-1000, Controllable Isothermal Plate, is a system for providing an isothermal surface that can be precisely temperature-controlled from 10 to 170C with an accuracy of +/- 0.1C. The CIP-1000 features a 75 mm diameter isothermal copper plate whose constant temperature can be raised or lowered both automatically and manually. A three wire RTD sensor and integral PID controller ensure specific, uniform temperature across the entire plate.
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EVG®20 -
EV Group
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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JonDeTech
The sensor measures a very useful 0.17 mm in thickness and is made of plastic. Essentially it is a piece of robust plastic that can be used “bare” – without protective housing, such as a metal casing commonly used by other producers. The sensor it is less than 0.2 mm. thin and it is made using plastic membrane. This configuration makes the sensor so robust it can be used “bare” – without protective housing such as a metal container. Due to the fact thatSince the sensor chip can be used applied bare, means it can be used in a totally new ways, which can re-defines todays the current view on application design and reduces the cost of the entire system, and not just the sensor-element as such.
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Pinnacle 250 -
VIEW Micro-Metrology
The Pinnacle features a damped granite base and column, with passive vibration isolation. A precision compound X-Y stage with high-speed linear motor drives provides velocity of 400 mm / sec and acceleration of 1000 mm / sec2. This combination of high acceleration and high velocity enables the high throughput required for near-line process monitoring.
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MC400 -
Manncorp
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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DLAP-401-Xavier -
ADLINK Technology Inc.
- Deep learning acceleration with NVIDIA Jetson AGX Xavier- Compact system 150(W) x 145(D) x 85(H) mm- 3x USB 3.1 Gen1 lockable type, 2 GLAN, 1 Type C USB 3.1 OTG- Internal function expansions by M.2 E key 2230, M.2 B key 3042- 24V DC input- Additional storage by M.2 B key 2242
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MC1400 -
Manncorp
MC1400 Automatic stencil printer MC1400's automatic dual-vision alignment system ensures accuracy while the printer's linear-guided movements and vertical stencil separation provide high precision and repeatability, a combination that results in ultra-fine-pitch printing capability for component pitches down to 0.3 mm (12 mil). With quick setup and changeover, thanks to the flexible mounting table, MC1400 stencil printer easily keeps pace with medium to high volume production lines and is well-suited to precision batch printing.
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LD-LGST-A10 -
Labodam
Gel Strength Test SystemLD-LGST-A10is mainly used to measure the gel strength of gelatine under the stipulated environment. It has traveling accuracy ± 0.3 % and Test range up to 5 to 1000 g Bloom. It consists of Jelly Strength Tester, Constant Temperature Bath and Refrigerator. Sampling depth can be present arbitrarily in 1 to 60 mm. It consists four kinds of sampling measurement modes: single-step, maintaining, circulating and automatic.
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GEN 2 -
Alpha-Omega Power Technologies, LLC.
The GEN 2 pulsed solar simulator and data acquisition systems can generate over 1,200 suns with a spot size of 12 mm x 12 mm at a rate of 2 pulses per second.
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X-eye 9000 Series -
SEC Co., Ltd.
X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Type 82C -
REINHARDT System- und Messelectronic GmbH
contact pressure up to 2,000 N, working area: 480 x 320 mm. Shift: 26 mm, dimensions: 65 x 64 x 44 cm, weight: 27 kg. Manual test fixture (sloping working area) with twin interface. Use with a REINHARDT-test system with expansion rack. 4 posts guiding. Toggle lever for force transmission. Maximum guiding precision and compression force. Typically more than 1,000.000 closures. Righthanders and lefthanders use it without difficulties. Ergonomically sloping working area. Fatigue-proof operation.
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DLAP-211-JNX -
ADLINK Technology Inc.
*Deep learning acceleration with Jetson Xavier™ NX*Compact fanless system 148(W)x120(D)x49.1(H)mm*Wide temperature range from -20°C to 70°C
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Hildebrand Prüf- und Meßtechnik GmbH
Durometer Hardness System provides hardness readings on elastomers and plastics with a specimen thicker than 6 mm according to IRHD and Durometer hardness. It complies to international standards DIN ISO 48, ISO 48, ASTM D 1415 and DIN 53505.
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DP7000 -
Guzik Technical Enterprises
The DP 7000 Digital Processor with 40/100G Ethernet or 169G Interlaken protocol compatible MPO/MTP® Optics, designed for evolving markets such as Real-Time Stream Processing for High-speed Data-acquisition (DAQ), High Performance Computing (HPC), Machine Learning, Data Center Infrastructure, AI Processing and Network applications. The board is 8U form factor, 322.25 mm x 280 mm x 6 HP (L x W x H), single slot AXIe or AdvancedTCA® blade, ideal for multi-slot 19″ rack mount system integration. In AXIe form factor it provides up-to Gen3 PCIe® backplane connectivity.