Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Semiconductor
Package FunctionSMV(2.9mm*2.8mm) AND GateUSV(2.0mm*2.1mm) NAND GateFM8(5.0mm*4.5mm) NOR GateSM8(2.9mm*4.0mm) OR GateUS8(2.0mm*3.1mm) INVERTER
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Semiconductor Solutions
Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products.
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Supercontinuum White Light Lasers
SuperK series
The SuperK series is an industry-leading range of turn-key supercontinuum white light lasers used by the most innovative companies within bio-imaging, semiconductor inspection, sorting, device characterization, and scientific instrumentation. The sources are robust and reliable, built for intensive use, and can replace multiple single-line lasers as well as broadband sources like ASE sources, SLEDs and lamps.
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Test Automation
TetraMAX®
The Synopsys TestMAX™ family of products offers innovative, next-level test and diagnosis capabilities for all digital, memory and analog portions of a semiconductor device. The Synopsys TestMAX family contains unique capabilities for automotive test and functional safety as well as technologies that unlock new levels of test bandwidth and efficiency by leveraging high-speed interfaces common on many designs.
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Semiconductor & Electronic Systems Test and Diagnostics Services
Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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13MP MIPI Camera Module
e-CAM130_CUMI1820_MOD
e-CAM130_CUMI1820_MOD is a 13MP MIPI Camera Module. This small form factor 13MP camera module comes with S-Mount lens holder. It is based on AR1820HS – an 18MP CMOS Image sensor from Aptina™ / ON Semiconductor® and has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs all the Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images and video and the optional MJPEG compression. Though the AR1820HS is an 18MP image sensor, the e-CAM130_CUMI1820_MOD supports only up to 13MP resolution.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Osram High Power Blue Violet Laser Diodes (450-488nm)
The Optoelectronics Company Ltd
OSRAM Opto Semiconductors is a key player in the field of visible InGaN (Indium Gallium Nitride) lasers. OSRAM Opto Semiconductors offer leading product performance and innovative packaging. Thanks to their excellent beam quality, OSRAM laser diodes are ideally suited for the optical imaging of light. Not only that, but their small package size is particularly beneficial to highly compact systems, such as pico projectors. OSRAM laser diodes offer high efficiency and long lifetime: due to their excellent efficiency (ratio of light produced compared to electric power consumed), the temperature increase experienced by blue InGaN lasers during operation is kept to an absolute minimum, allowing them to deliver a long life – up to 10,000 hours at 40 °C.
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High Purity Germanium (HPGe) Radiation Detectors
Semiconductor based photon radiation detectors have been evolving for over half a century, with ORTEC pioneering commercial availability for a majority of that time. Initial offerings were based around lithium-drifted germanium Ge(Li) and lithium-drifted silicon Si(Li). Ge(Li) was later replaced with more advanced, high purity germanium (HPGe) detectors. ORTEC provides a comprehensive suite of HPGe detector solutions covering an extensive range of energies and for a variety of applications.
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Non-Linear Junction Detector
ORION™ HGO-4000
The ORION HGO-4000 is REI’s original high gain Non-Linear Junction Detector for special applications. The ORION HGO-4000 can locate listening devices and semiconductors in walls floors, ceilings, fixtures, furniture or containers and provides a user the capability to detect hidden electronic devices, regardless of whether the device is radiating, hard wired, or even turned off.
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3.4 MP Custom Lens Low Light Camera Module
e-CAM30_CUMI0330_MOD
e-CAM30_CUMI0330_MOD is a high performance, small form factor, 3.4 MP pluggable Low Light Camera Module with S-Mount lens holder. It is based on AR0330 - a 3.4MP CMOS Image sensor from ON Semiconductor®. It has a dedicated, high-performance Image Signal Processor chip (ISP) on-board that performs the entire Auto functions (Auto White Balance, Auto Exposure control) in addition to complete image signal processing pipeline that provides best-in-class images, videos and the optional MJPEG compressions.
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Wave Inverter - New Compact, High-performance Series
CSI 280-F3 Series
ABSOPULSE Electronics has released the CSI 280-F3 Series of ultra-compact, high-performance dc/ac sine wave inverters. The units introduce new semiconductor technology and a unique design topology that simplifies the circuitry and enables significantly more compact construction, lower weight and cost, and higher MTBF than previous 300VA inverter designs. The total footprint of each unit is 132 x 64 x 300 mm.
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The Nanoworkbench
In light microscopy it is natural to use toolsets like tweezers, knives, probes and several different measurement tools. Without this many present-day products and methods would not exist. The operators of SEM/FIB-Systems generally work without toolsets, although the wavelength limit of light is no physical boundary. It can be imagined how technology would be pushed when a SEM/FIB Workbench reaches the same degree of practicability and utilization as toolsets for light microscopes. The Nanoworkbench is the first system substituting the eye-hand coordination effectively with nm precision in a SEM/FIB-system. The Nanoworkbench features a set of applications including TEM lamella preparation, nano probing, nano cutting, nano cleaning, force distance measurement, particle sorting and material preparation. Every application supports automated processes so almost no user interaction is needed. Even complex processes can be done within seconds and even by untrained users. Applications can be combined to create new and more complex processes. Expanding the SEM/FIB to a material processing system and a nano-analytical workbench by utilizing the Klocke Nanoworkbench enables new applications in research and production of material research, live sciences, tribology, environmental & forensic research and semiconductor technology.
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Non-Linear Junction Detectors
ORION® HX Deluxe
The hand-held ORION HX Deluxe Non-Linear Junction Detector (NLJD) has interchangeable 2.4 GHz and 900 MHz antenna heads. The ORION HX Deluxe NLJD is used to sweep areas for electronic semi-conductor components. In this way, the ORION HX Deluxe NLJD detects and helps to locate hidden electronics or eavesdropping devices regardless of whether the electronic device is turned on.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Semiconductor Device Testers
are particularly suitable for certain semiconductor test requirements, but other models may also be of interest. Our knowledgeable application engineers can guide you to the most suitable model.
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Semiconductor Thermal Transient Tester
T3Ster®
T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Standard GaN Amplifiers
A GaN (Gallium Nitride) amplifier is a power amplifier that uses GaN, a wide-bandgap semiconductor material, to provide high power density, efficiency, and frequency capabilities.
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LCR Meter
ET/QuadTech 1910/1920
The 1920 1 MHz LCR Meter is the most popular and designed to perform capacitance and impedance measurements on a variety of electronic components and materials over a frequency range from 20 Hz to 1 MHz. The1920 features programmable bias voltage from 1 mV to 2 V for biasing capacitors and other semiconductor devices during measurements.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Materials Metrology
VeraFlex Family
World-class XPS and XRF metrology technologies for semiconductor process control.
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VXI Digital Test Instrument
T940 Series
The T940 Series for the VXIbus provides the basis for a complete state-of-the-art digital solution at the subsystem level. The T940 is the solution for both legacy digital replacement and new test stations to be built for digital test including aircraft/ avionics, weapons systems, spacecraft, semiconductors and medical devices.
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Automation Controllers And Modules
Our complete automation platform solution along with a suite of automation control hardware and software configurable modules allow semiconductor and other industrial manufacturing customers to better automate their processes through computer-controlled automation and seamlessly integrate with existing MKS products to provide a complete solution.
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PXI 8x SPST High Voltage Reed Relays
40-310-001
The 40-310/320 range of high voltage switching modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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PXI 12 Channel High Voltage Multiplexer
40-320-001
The 40-310/320 Range of High Voltage Switching Modules will hot switch up to 750V peak and cold switch up to 1000V peak in either general purpose relay (40-310) or multiplexer (40-320) configurations. These modules contain high-quality reed relays with switching ratings comfortably higher than the 40-310/320 specification. Applications for the 40-310/320 series modules include; circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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Materials Test Systems
An impedance analyzer is a device that uses a programmable AC voltage / current source, together with voltage and current measurement circuits, to characterize sample impedance over a wide range of frequency. An example of this being the world famous Solartron Analytical 1260A Impedance Analyzer that provides EIS impedance characterization over more than 12 decades of frequency from uHz to tens of MHz. Impedance Analysis characterization is a key technology that enables new materials development for semiconductors, smart-materials, ferroelectrics, piezo-electrics, solid oxide, solid electrolytes, ceramics, polymers, OLED and many more materials.
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Programmable DC Power Supply
62000L Series
The Chroma 62000L Series Programmable DC power supplies have low noise linear performance and fast transient response. The units have many unique functions that are targeted for overall automated test system integration, automotive power electronics MCU/ECU, power semiconductors, wireless communications, etc. The 62000L Series is a high quality yet cost effective programmable DC Source, designed to meet the stringent requirements of the next generation of power electronics. The GPIB and USB control interfaces come standard with the 62000L Series, no additional purchase required. The 62000L Series can be easily remote controlled via either of these two interfaces. The 62000L weighs less than 2.5 kg, and its case measures 214.6W * 88.6H * 280D mm. Its light weight and compact size makes it easy to handle and stack safely.。
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Backgrinding & Stress Relief
Grinding and Dicing Services, Inc.
GDSI delivers complete backgrinding solutions to the semiconductor, MEMS and biomedical industries. Backgrinding is a necessary process step to reduce wafer thickness prior to dicing and final assembly. By utilizing fully automated grinders staffed by highly qualified engineers, GDSI’s grinding procedures produce unsurpassed precision and repeatability.
