Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
Rad Hard GaN FETs
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Wide band gap semiconductor technologies such as Gallim Nitride Field Effect Transistors (GaN FETs) have been gaining interest for power management and conversion in space applications. These devices feature higher breakdown voltage, lower RDS(ON) and very low gate charge enabling power management systems to operate at higher switching frequencies while still achieving higher efficiency and a smaller solution footprint. There is an additional benefit from GaN devices that make them attractive to the space market. These devices are inherently immune to total ionizing dose radiation.
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Product
Digital Instruments
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Digital Instruments generate and acquire high-speed digital waveforms for transmitting data, communicating with devices under test, or testing digital interfaces. These instruments are ideal for semiconductor characterization and production, interfacing to LVDS and TTL digital electronics, and testing the functionality of high-speed serial links.
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Product
5G Testing
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Teradyne test solutions are at the forefront of the 5G test era. Why? We work with the leading semiconductor manufacturers and provide optimized test coverage for the major wireless standards. From emerging millimeter wave devices to the traditional sub-6GHz, our test solutions are already leading the way.
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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Product
Semiconductor Test Platform
PAx
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PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Product
FCB Probe Card
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The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Product
Automated Discrete Semiconductor Tester (ATE)
5000E
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Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Product
MPI Advanced Technologies & Accessories
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MPI Advanced Semiconductor Test
MPI become very fast the truly innovation leader in the Advanced Semiconductor Tests market. By offering wide range of system’s accessories and unique advanced technologies, such as Automated Test over Multiple Temperatures ATMT™, NoiseShield™, PHC™, VCE™, mDrive™, MPI is offering variety of complete test solutions at highest value.
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Product
Wafer Test
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Faraday Cages
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LBA's EMFaraCage® faraday cages are EMI and RFI shielding boxes and RF test enclosures that bring convenience to device testing. Faraday cages are ideal for isolating critical systems in high field RF environments or wherever RF ingress or egress must be minimized. Security, production testing, biomedical research and semiconductor testing are only a few of the many areas where EMFaraCage® faraday shielded enclosures are employed. EMFaraCage® faraday cage enclosure systems are fully featured to support a wide variety of test missions. The standard faraday cages include effective power, dataline and RF signal isolation in large test volumes. EMFaraCage® faraday cages are much more affordable than shielded room solutions and offer the convenience of portability.
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Product
Product Lifecycle Management Software
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Siemens Digital Industries Software
Our product suites offer capabilities that span the product lifecycle, from design inception to manufacture and support. By doing so, they help turn more of our customers' ideas into successful products. Solutions for: Aerospace & Defense, Automotive & Transportation, Consumer Products & Retail, Electronics & Semiconductor, Energy & Utilities, Industrial Machinery & Heavy Equipment, Marine, Medical Devices & Pharmaceuticals.
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Product
High-Resolution Precision SMU (10 FA, 210 V)
PZ2110A
Source Measure Unit
The Keysight PZ2110A is a precision source / measure unit (SMU) that expands precise measurements from conventional static measurements and pulsed measurements, to fast dynamic measurements. It is ideal for a wide variety of current versus voltage (IV) measurement tasks that require both high resolution and accuracy. The PZ2110A can accurately perform characterization, parametric tests, and reliability tests of semiconductors, active / passive components, and general electronic devices.
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Product
Trusted Semiconductor Die/Wafer Source
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To offer a complete Turn-Key Solution requires the ability to source both leading edge high density and older die/wafer products. DPACI has factory direct access to Static Ram, Flash and DRAM Die/Wafer. For obsolete parts, DPACI can assist you with sourcing or recommend an upgrade. DPACI has access to roadmaps, data sheets and die maps to assist you with your choices.
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Product
MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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Product
3.4 MP Google Coral Camera
E-CAM30_CUCRL
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e-CAM30_CUCRL is a 3.4 MP 4 lane MIPI CSI-2 custom lens camera board for Google Coral development board. This Google coral camera is based on 1/3" inch AR0330 CMOS Image sensor from ON Semiconductor® with 2.2 µm pixel.
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Product
Transmission Line Pulse Testing
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Transmission Line Pulse testing, or TLP testing, is a method for semiconductor characterization of Electrostatic Discharge (ESD) protection structures. In the Transmission Line Pulse test, high current pulses are applied to the pin under test (PUT) at successively higher levels through a coaxial cable of specified length. The applied pulses are of a current amplitude and duration representative of the Human Body Model (HBM) event (or a Charged Device Model – CDM – event in the case of Very Fast TLP, or VF-TLP).
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
1/2.5" 5.0 MP Low Noise USB Camera (Color)
See3CAM_CU55
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See3CAM_CU55 is a 5.0MP USB3.1 Gen1 UVC Color Camera with S-mount (also known as M12 board lens) lens holder. It is a two-board solution containing camera sensor board based on 1/2.5" AR0521 image sensor from ON Semiconductor and USB3.1 Gen 1 Interface board. The powerful on-board Image Signal Processor (ISP) brings out the best image quality of this 2.2micron pixel 5MP AR0521 CMOS image sensor making it ideal for next generation of high resolution surveillance, biomedical instruments and biometric authentication applications.
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Product
High Voltage Isolation Test Systems
HT 9460 and 9464
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Accurate and non-destructive production testing of ac Isolation Voltage and Partial Discharge. With over 450 systems installed worldwide the 946X series of test systems are the standard and system of choice used by the majority of semiconductor manufacturers that produce optically isolated devices.
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Product
Automatic Online Flatness and Surface Appearance System
UltraSort200
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The UltraSort continues our 25 year tradition of providing metrology solutions to semiconductor wafer manufacturers. Designed for volume wafer production, this automated system offers superior performance in rapid, repeatable, accurate, noncontact qualification of silicon and alternative substrate wafers.
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Product
Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
Confocal Sensors (White Light)
confocalDT
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The confocal chromatic confocalDT measuring system is used for fast distance and thickness measurements. Different sensor models and controller interfaces open versatile fields of application, e.g., in the semiconductor industry, glass industry, medical engineering and plastics production.
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Product
DC Power Supplies
LPS Series
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The LPS series power supplies are designed for various applications in semiconductor equipment along with OEM and industrial applications. Available for use in constant current or constant voltage applications they are available in power levels from 1,000 to 13,500 Watts. Common applications include heater, filament and magnet supplies along with test and burn-in applications. All models can be paralleled for increased power and custom configurations are available.
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Product
Multi-Surface Profiler
Tropel® FlatMaster® MSP
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The Tropel® FlatMaster® MSP (Multi-Surface Profiler) is a frequency stepping interferometer that provides fast and accurate metrology for semiconductor wafers up to 300mm in diameter. In seconds up to 3 million data points are collected with sub-micron accuracy enabling total thickness and flatness characterization over the entire surface.
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Product
High Speed & Precision Pressure Insensitive Mass Flow Module
D700MG
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Critical semiconductor manufacturing processes continuously desire precision gas flow control devices that enable both future innovation, and lab to fab transition of leading edge memory and logic device. HORIBA's propose the new pressure based MFC D700MG, the upper compatible model of the D500MG to support customer’s challenges.
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Product
Front & Backside, Semi-Automatic Mask Aligner
Model 800E
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The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Product
Hand Socket Lid
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Hand socket lid is normally used to run evaluation tests on semiconductor devices prior to High Volume Manufacturing mode. It can also be used as a trouble shooting tool at bench test.
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Product
High Voltage 50 Ω Pulse Generator
TLP-12010A
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High Power Pulse Instruments GmbH
The high-current TLP/HMM test system TLP-12010A offers advanced features intended for the characterization of semiconductor devices, discrete components, such as TVS, varistors, capacitors, gas tubes, circuits and systems in the high power time domain. It includes high current I-V characteristics inpulsed operation mode, turn-on/off transient characteristics of the device, breakdown effects, charge recovery effects e.g. reverse recovery, Safe-Operating-Area (SOA) and ESD measurements in general.
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Product
Seno-Con Test System
PANTHER 2K QST
Test System
Qmax Test Technologies Pvt. Ltd.
Panther 2K-QST is a versatile ultra fast Seno-Con test system designed to test high volume ,low to high pin count consumer semiconductor IC’s for its assembly line wire bonding faults. Its innovative test technology helps learn from known good device and test against target device drastically reduces time required to develop Test programs.The operating software is designed in such a way that it is fully user friendly with GUI programming.
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Product
Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.





























