BGA
Surface mount chip package, which uses solder balls for its connectors.
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Product
DDR4 X16 2-wing BGA Interposer For Logic Analyzers, Connects To 61-pin ZIF
W4641A
Interposer
The W4641A DDR4 2-wing BGA interposer for DDR4 x16 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A the W4641A is the smallest BGA interposers for DDR4 x16 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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Product
Get Flexible, Get FlexiFLASH
LatticeXP2
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*Up to 885 Kbits sysMEM™ embedded block RAM and up to 83 Kbits distributed RAM*sysCLOCK™ PLLs up to four analog PLLs per device that enable clock multiply, divide and phase shifting*Three to eight sysDSP blocks for high performance multiply and accumulate.*Pre-engineered source synchronous IOs for DDR/DDR2 up to 200 MHz and 7:1 LVDS interface support up to 600 Mbps*Available in csBGA, TQFP, PQFP and BGA packaging
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Product
Futureproof Your Control PLD And Bridging Designs
MachXO3
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*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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Product
Ultra High Speed Pick & Place
MC889
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The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Product
High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Product
GHz Elastomer Sockets
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Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Product
High-Throughput Film Frame Handler
MCT FH-1200
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FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Product
Buffered Analog Crosspoint Switches
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Analog Devices buffered video crosspoint switches offer multiple configurations from 8x8 up to 32x32 channels with gain of 1 or 2 and are offered in LQFP, LFCSP, and BGA packages. These crosspoint switches can be programmed either in serial or parallel modes and are used primarily for routing high speed signals, including composite video (NTSC, PAL, SECAM) and component video (YUV, RGB) in applications such as studios, video on demand, in-flight entertainment, surveillance, and video teleconferencing.
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Product
RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
Interposer
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Product
In-Circuit Tester Integration
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The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
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Product
Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Product
BGA Rework Station
PDR IR-E3 Evolution
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The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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Product
Low Power FPGA Featuring Hardened MIPI D-PHY, LVDS, SLVS, SubLVDS, & Open LDI Bridging
CrossLink
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*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per PHY*15 programmable source synchronous I/O pairs for camera and display interfacing*Available in amazingly small 2.46 mm x 2.46 mm WLCSP packages and BGA packages with 0.4 mm, 0.5 mm and 0.65 mm pitch
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Product
X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Product
For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Product
Silver Button Sockets
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For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Product
SMT Rework Station
RW1210
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Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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Product
Adapters
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- Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors & Fix adapters – Prototype, probe & analysis adapters – Receptacles, extenders, rotators and socket plugs– Electronic modules
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Product
Low Power MIPI Bridging Solution With Integrated Flash
CrossLinkPlus
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*Instant-on (< 10 ms) configuration with integrated flash memory*Integrated flash enables flexible reprogramming in the field*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port*11 programmable, source synchronous I/O pairs for camera and display interfacing*Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch*Comprehensive library of IP and reference designs, compatible with CrossLink
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Product
HDMI/DVI Receivers
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HDMI® receivers and DVI receivers remain in high demand for professional, consumer, and automotive video applications, with HDMI nodes constantly increasing. Analog Devices offers a range of HDMI/DVI receivers that enable high quality conversion of digital video data to formats such as HDMI, MIPI, and TTL. Applications include video distribution, gaming, and HDMI/DVI consumer device connectivity for automotive infotainment systems. Our portfolio of HDMI receivers and DVI receivers offers competitive advantages such as automotive qualification, superior HDMI/DVI equalizer performance, comprehensive audio extraction, and small packages (6 mm × 6 mm, 0.5 mm pitch BGA).
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Product
X-Ray Inspection System
MX1
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Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Product
Boundary-Scan Interactive Analyzer & Toolkit
ScanExpress JTAG Debugger
Analyzer
Test probe access is a luxury—modern electronic system design techniques such as blind and buried vias or ball-grid-array (BGA) devices guarantee limited signal access. Test points quickly reduce precious board real-estate and can even degrade performance. ScanExpress JTAG Debugger overcomes these limitations to provide the control and visibility necessary to quickly debug and test hardware, using a simple JTAG port to interface with IEEE-1149.1 compliant devices.Whether debugging prototype hardware, enhancing production tests with boundary-scan control, or diagnosing a faulty board in the field, ScanExpress Debugger’s easy-to-use and versatile interface helps engineers test and debug systems faster and more efficiently.
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Product
Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Product
LPDDR3 178-ball BGA Interposer For Logic Analyzers
W3301A
Interposer
The W3301A LPDDR3 rigid BGA interposer for LPDDR3 178-ball DRAM enables capture of simultaneous read and write traffic at data rates in excess of 1866 Mb/s. E5406A Soft Touch probes and U4201A cables connect the W3301A LPDDR3 BGA interposer into the U4164A logic analyzer module. The W3301A LPDDR3 178-ball rigid BGA interposer allows signal access to the LPDDR3 signals critical to your debug and validation effort through a U4164A logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR3 178-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR3 signals.
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Product
Automatic Test System
Star-Rec
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Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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Product
Labelling Systems
8000BL
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The Model 8000BL is a high volume labelling system for tray-borne devices. Equipped with tray stackers and a Zebra 90XiII label printer, the 8000BL can apply labels safely, accurately and quickly to BGAs, QFPs, TSOPs, PGAs, etc.
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Product
Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
Panel PC
- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Product
Grypper "Y"
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Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Product
PMC Module
PMC-CycloneII-64LVTTL
PMC Module
User Programmable Altera Cyclone II FPGA 672 BGA, EP2C35, EP2C50, EP2C70, Stand alone possibility, Single wide PMC Module, 64 LVTL, Optional User clock oscillator
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Product
Aspen Sockets
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Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
