3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
04 With Soldering Eyelets | 1 Wafer | 24 Positions
04-1xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Turnkey NDT Corrosion Inspection Services
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Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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Product
Optical Inspection Machine
3D AOI
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3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Product
X-ray Inspection System
Cougar ECO / Cheetah ECO
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Cheetah and Cougar ECO X-ray inspection systems for use in the electronics industry. These microfocus systems, which have been developed by Yxlon in Germany, are characterized by an excellent price-performance ratio. Being entry-level systems in two sizes, each of them provides best inspection results in quality control in the SMT and semiconductor industries.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
Fiber Optic Inspection Microscope
80761
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The Miller 400x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment. Includes 2.5mm universal adapter cap and zipper case.
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Wireless Fiber Inspection Probe
OCI-20BN-W
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OCI-20BN-W is a portable optical fiber connector inspector for checking fiber and connector end-face cleanliness, ideal for bench top and fiber optic network installation technicians to eliminate error caused by poor quality or improper cleaning.OCI-20BN-W offers excellent viewing on connector/fiber end-face and is able to feature to record and save image/video of fiber end-face; It can be connected to PC or phone by WIFI.More than 40 assorted high-precision tips designed for inspection solutionsAngled/Lengthened tips for awkward positions.Connect smart phone for testing FiberEye2 is the application on an android or IOS smart phone to capture, display and record the fiber end-face image from the Wi-Fi probe.Connect tablet/laptop for testing EFD is the analysis software on Windows tablet/laptop to have dusts, and scratches on end face inspected, analyzed, compiled and reported
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Product
Tyre Inspection Systems
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The VLT tyre inspection system can check several tyre and wheel related items, such as tread depth and sideslip. All measurements are done very fast when the vehicle is on the roller brake tester.
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Product
X5 XL800 X-Ray Inspection
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Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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Product
AOI/SPI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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Product
Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
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Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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Product
Manual Spin Air Bearing Rotary Table for Optimal Circular Geometry Inspection
GeoInspec
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Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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Product
Open-Frame Collet Socket with Solder Tail Pins
Series 518
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Open Frame Collet Sockets with Solder Tail Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. Choose from several pin styles. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
Optical Inspection
3D AOI
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In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Product
Ultrasound Inspection
ULTRAPROBE 10,000
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The Ultraprobe 10,000 brings Ultrasound Inspection technology to a whole new level. With this one system, inspectors can perform condition analysis, record sounds, store and manage data.
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Product
Soldering Test
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The soldering tests are conducted to determine if materials can withstand soldering effects, such as resistance to soldering heat, as well as the solderability of components during the manufacturing process.
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Product
High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Inline Wafer Electrical quality Inspection
ILS-W2
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the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Post Wire and Die Bond Inspection Machine
IV-E1700
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IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Product
Benchtop 3D Optical Profilometers
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Compact, non-contact metrology instruments used for high-precision, sub-nanometer to micrometer-level measurement of surface topography, roughness, and step heights.
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Product
Automated 3D Scanner
HDI Compact
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The HDI Compact 3D scanning system eliminates the tedious work involved with manually scanning an object. Save time and get stunning results everytime. The HDI Compact is an automated 3D scanning solution. The rotary table automatically spins the object and stops at predetermined intervals. The scan head captures high resolution, accurate 3D scans of an object each time. Once the object spins a full 360 degrees, all the scans are then automatically cleaned up and merged together to create a full digital 3D model.
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Battery Inspection
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We design, develop and manufacture X-ray solutions specifically for battery cells. At Exacom we stand for passion, innovation, out of the box thinking, honesty and reliability, as well as speed and a hands on mentality.
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3D Video Microscope
BVM-20102B
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High-resolution CCD sensor, built-in analog/digital converter, analog and digital signal directly display on the screen, can also simultaneously display on TV and computer through corresponding interfaces; taking photo and video through software; easy operation, reducing user's fatigue and injury.
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Product
04 With Soldering Eyelets | 2 Wafers | 24 Positions
04-2xx3-00/30-xx
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Very robust, multi wafer selector with 15° detent angle, switching torque up to 20 Ncm and a rotational life up to 25'000 cycles
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Product
Automated Surface Inspection for Glossy Components
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Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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Product
3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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Product
Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
