3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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3D Machine Vision Systems
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Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
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Appearance Inspection
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We perform quality assurance agency of customers' important products through inspection.
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160-Pin DIN41612 Connector, Solder Pin, Male
92-960-160-M
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Suitable for users to create their own cable assemblies, this product can be supplied with or without the backshell. For applications in LXI products where 4 connectors are used in a horizontal row if the user requires all connectors to have a second fixing then the connector can be fitted with an optional screwlock assembly.
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Substrate Inspection Apparatus
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The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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Advanced 3D Graphic
Geo Surface3D PRO
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ScienceGL offers 3D visualization for extended GIS data that combines multiple layer terrain and multi-variable thematic map in one interactive 3D screen. Visualize Digital Elevation Model (DEM), land map, roads, satellite image, LIDAR data in the same screen. Combine terrain data with vector graphics, businesses thematic map, weather map, etc. Use transparancy to highlight more important data. The unique combination of GIS and multi-variable thematic maps helps to discover trends and patterns quickly and accurately. No other data presentation method comes close to expressing so much information within such a small space.
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Solder Cup Connector Kit
Y1141A
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Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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Semiconductor Inspection (SEMI)
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A process for detecting any particles or defects in a wafer.
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Reflow / Wave Solder Process Dashboard
Vantage
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Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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Specialist Inline Inspection
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NDT Global treats each pipeline individually from the offset. Before a project even begins, a feasibility study of the pipeline detail is conducted by NDT Global, to determine the appropriate tool and required modifications to complete the inspection. NDT Global has an extensive engineering capability in this regard and has a proven track record in providing tailored solutions to deal with a wide variety of pipeline characteristics.
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Abrasive & Blast Inspection
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Blasting parameters: A number of important parameters need to be monitored during the blasting or water jetting process, these include: air pressure (at the nozzle), nozzle diameter, blast media contamination & pH values in order to avoid recontamination of the substrate during blasting.
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Concrete Inspection System
StructureScan Pro
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Geophysical Survey Systems, Inc.
StructureScan Pro is a versatile concrete inspection system offering a wide variety of antenna options for concrete and other applications. Based on the SIR 4000 controller, the StructureScan Pro provides the GPR professional with solutions to any scanning situation.
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Portable Strain Gage Welding and Soldering Unit
700
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A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.
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Tracing-Type Non-Contact Inspection System For LCD/STN/Touch Panel/FPC
TTS
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*"Probe + Non-Contact Sensor" enables to delect SHORT after sticking LCD*No Fixture in LCD Inspection*Applicable to FPC Inspection
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Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Offshore Inline Inspection
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Data quality and first-run success represent the founding principles of NDT Global. By providing highly accurate results, in the first instance, our customers can have confidence in the inspection data to make fully informed decisions on future interventions - be that extending the inspection interval or making required repairs while, at the same time, also limit the requirement for costly verification's. Our latest generation of tools represent a step change in pipeline inspection accuracy and can significantly reduce overall project cost.
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Thickness and Flaw Inspection
FOCUS PX / PC / SDK
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Olympus offers a complete advanced phased array integration solution that meets the requirements of your most demanding customers. The solution includes the FOCUS PX, a powerful and scalable acquisition unit; FocusPC, a powerful data acquisition and analysis software program; and three software development kits (SDK), FocusControl, FocusData, and OpenView SDK, to customize your software interface based on your application and control FocusPC for a fully automated inspection solution.
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3D Machine Vision Process Control Solutions
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In the age of automation and robotics, manufacturers utilizing automated dispensing in their assembly lines face growing challenges to maintain process control of their manufacturing processes. To eliminate errors and optimize product quality, they increasingly need the help of machine vision based “eyes of automation”. Whether manufacturing automobiles or medical devices, they need high-speed inspection tools to confirm the accuracy of their dispensing process and the overall quality of their products.
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Automatic Flight Inspection System
AT-930DG
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Fully Automatic OperationAll-Weather CapabilityDifferential GPS Position ReferenceHigh Accuracy and Maximum ReliabilityWindows User Interface SoftwareEasy to Operate and Easy to LearnMinimum Maintenance RequirementsModular System ArchitectureLong-Term Supportability
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Connector Inspection
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The USB Connector Inspection System features easy focusing with high resolution imaging. The system includes standard software that provides image display, image capture, digital zoom, auto calibration, and basic analysis tools. Pass/Fail analysis and reporting features are optional software features. The Inspection System scope is fully compatible with the FiberWarrior Pro OTDR as well as other FiberWarrior Pro test sets, providing a full fiber optic testing solution.
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3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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High Precision Angular Positioning Calibration and Geometry Inspection
LabStandard
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Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.Designed for horizontal and vertical applications with self-locking worm gearing and a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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3D Semiconductor & MEMS Process Modeling Platform
SEMulator3D
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SEMulator3D® is a semiconductor process modeling platform that offers wide ranging technology development capabilities. Based on highly efficient physics-driven voxel modeling technology, SEMulator3D has a unique ability to model complete process flows. Starting from input design data, SEMulator3D follows an integrated process flow description to create the virtual equivalent of the complex, 3D structures created in the fab.SEMulator3D process modeling and analysis is used for fast and accurate “virtual fabrication” of advanced nano-fabrication processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles.
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Cylinder Inner Wall Inspection
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The CylinderInspector is an optical, non-destructive inspection and measurement tool for cylinder surfaces.
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Area Scan 3D Camera
3D-A5000 Series
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Cognex’s 3D-A5000 series is an area scan 3D camera designed to capture high-resolution 3D images. It features 3D LightBurst technology which rapidly acquires images to maximize throughput. High-resolution 3D images combined with industry-leading Cognex 3D vision tools enable reliable and accurate solutions to applications such as assembly verification, in-line measurement, and robotic guidance.
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IPC Inspection
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Customers of MASER Engineering that are designing electronic products and thereby using bare and assembled Printed Circuit Boards (PCB's) are interested in the manufacturing quality of the PCB and assembling quality of the PCBA.
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3D Bundle
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Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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Direct 3D RightMark
D3D RM
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D3DRightMark is an independent non-commercial open-source graphics card benchmarking project developed by iXBT.com. It's called to help users estimate graphics cards performance and quality in synthetic tests and real apps, e.g. games. Synthetic tests allow estimating performance and capabilities of separate graphics cards subsystems in order to forecast their behavior in either applications, both existing (that is overall estimation of suitability and prospects for an entire application range) and developing, provided that a given accelerator demonstrates peculiar behavior under such applications.
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3D Scanner
peel 3
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peel 3 can handle any application in: aftermarket & tuning, AR, VR & digital content, education, heritage preservation and art, product design, healthcare, and MRO and engineering.
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Inspection Solutions
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Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
