Showing results: 511 - 525 of 591 items found.
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SG-S05A -
Jinge Testing Machine Co.,Ltd
It tests the feature about vulcanization and searches for the best suitable vulcanization time.It adopts digital intelligent temperature-controller to adjust and sets easily.Its stability, reappear and accuracy is better than the general rotor rheometer.The microcomputer uses import CMOS chip which has high dependability.It draws、calculates and prints automatically,and has copy or blowwing up function. It adopts computer-control and interface to collect、store or deal with data and print test result .This machine's function is better than other types and shows high automatization features. It has functions about curve-comparing and blow up.It uses series of windows operation system flat and graphical software operation interface.The data is dealed with much truly.The user's test operation becomes faster, flexibly and protect conveniently.
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Arduino MKR Vidor 4000 -
Arduino llc
The Arduino MKR Vidor 4000 brings Arduino's ease of use to the work with the most powerful reprogrammable chips that exist: FPGAs. With Vidor you can create a board where all pins are PWM signals controlling the speed of motors. You can capture sound in real time and make a sound effect pedal for your guitar. It is possible to create a real-time computer reading sensor information and sending it to a state-of-the-art monitor or capture video and overlay sensor information on the image that will then later be sent over to a screen. You can connect to the Arduino IoT Cloud and control a complex laboratory machine running a large amount of motors. You could even prototype your own processors inside the FPGA and have it to work in parallel to the other microcontroller on the board. Vidor is a device that invites for experimentation, precision, and high speed computation.
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LEC-AL -
ADLINK Technology Inc.
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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TEST-901 -
Beijing GFUVE Electronics Co.,Ltd.
TEST-901 primary current injection test set adopts ARM Chip to control its output process and large capacity of toroidal transformers. It is equipped with LCD display and current meter; it can show primary current value, second current value, turn ratio and the action time. Packing is used as aluminum alloy body with PC panel. TEST-901 is mainly applied to CT turn ratio testing in the power system and contact resistance test which need large current.
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AIM GmbH
AIM’s > ARINC 429 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. The latest versions also support avionics discrete I/O.
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AIM GmbH
AIM’s AFDX®/ARINC664P7 test, simulation, monitoring and analysis modules use our field proven Common Core hardware design giving you the best performance, best feature set and highest functional integration on the market. The use of SoC (System on Chip) based core designs with multiple processors for real time bus protocol and application support, massive memory and IRIG-B time code encoder/decoder functions are standard. Versions are available to support the Boeing specific ARINC664P7 extensions.
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778572-36 -
NI
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2536 is a high-density 8x68 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring FET relays, the PXI‑2536 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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CEM881 -
Axiomtek Co., Ltd.
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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AWS-0102 -
Anokiwave Inc.
The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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742 Family -
CAEN S.p.A.
The 742 is the Switched Capacitor Digitizer family, based on the DRS4 chip by PSI, with the highest sampling frequency (5GS/s) and channel density. It can record very fast signals from scintillators coupled to PMTs, Silicon Photomultipliers, APD, Diamond detectors and others, and save them with high efficiency and precision for advanced timing analysis. The 742 family has an additional channel (two channels in case of VME boards) which can be used as time reference for time of fight measurements. The resolution of this kind of measurements can reach up to 50 ps.
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KLA-Tencor Corp
KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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KLA-Tencor Corp
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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BD3 Hydrophone Testing Options -
Seismic Source Co.
*32-bit, high speed, ADC chip for lower noise and increased accuracy*Three different operation with a single unit*8 Gigabytes of Data Storage, Expandable to 16*GPS based time and location saved for every record*Stable and rugged unit for use in all conditions*Three-Channels, unit checks three at once to save time and effort*All test data saved in non-volatile memory for later download and retrieval*Connects to PC via Ethernet or optional Wi-Fi to download results for display, analysis, report generation and archival
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EXC-4000VME/MCH-x / EXC-4000VXI/MCH-x -
Excalibur Systems, Inc.
The EXC-1553VME/MCH and EXC-1553VXI/MCH cards are based on a MIL-STD 1553 certified "Summit" chip used in many flight critical systems. Each dual redundant channel supports both MIL-STD-1553A and MIL-STD 1553B protocols. Up to eight channels may be programmed individually to operate as a Bus Controller, Remote Terminal, Bus Monitor, or Remote Terminal / Concurrent Bus Monitor. The 32 K x 16 of RAM allotted to each channel for the storage of data and control parameters may be updated in real time.
