Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Patented DPEM Process for Die Removal
DPEM (Decapsulate Plastic Encapsulated Module) is DPACI’s patented Turn-Key Solution to replacement of obsolete high reliability devices in legacy systems. From dissolving the plastic encapsulation of a semiconductor device to re-bonding new wires onto a chip or package lead frame, complete solutions are offered. DPACI retains reliability test data as well as customer testimonials for the process and can share this information on a need-to-know basis.
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Data Analytics
KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.
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mmWave Sensors
The world’s most precise millimeter wave sensor available today on a single chip. The world’s most precise millimeter wave sensor available today on a single chip. TI’s CMOS single-chip sensors integrate an RF front-end with a DSP and MCU.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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SWIR Linear Array
1024L1
Princeton Infrared Technologies, Inc.
The 1024L1 is a 1024x1 state of the art InGaAs linear array imager on 12.5 µm pitch that was built for both spectroscopy and machine vision in the short wave infrared band. The 1024L1-12.5-T is an advanced digital array with the lowest read noise available <110e- for a 250 μm tall pixel. Our new advanced SWIR On-chip Noise Suppression Circuit will enable some spectroscopic applications to see read noise levels <80e-. A single ROIC chip is used thus minimizing variation from output to outpu...show more -
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Embedded Development Kit
TySOM
The TySOM Embedded Development Kit is for the embedded designer who needs a high-performance RTL simulator/debugger for their embedded applications such as IoT, Factory Automation, UAV and Automotive. The kit includes Riviera-PRO Advanced Verification Platform and a Xilinx Zynq development board that contains single Zynq chip (FPGA + Dual ARM Cortex-A9), memories (DDR3, uSD), communication interfaces (miniPCIe, Ethernet, USB, Pmod, JTAG) and multimedia interfaces (HDMI, audio, CMOS camera).
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Low Resistance Metal Film Chip Resistor
RTX
This specification is applicable to lead and halogen free RTX series low resistance metal film chip resistors. Lead free products mean lead free termination meets RoHS requirement.
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Digital I/O Card
PCIe-DIO-120
This product is a x1 lane PCIe DIO board available in economy to high-performance models ranging from basic 72-, 96, and 120 DIO lines to advanced COS detection. The card emulates 8255 compatible chips using FPGA technology, providing up to 120 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs.
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Resister
Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor...show more -
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FPGA Card
VP869
The VP869 is a high-performance 6U OpenVPX FPGA processing board featuring two Xilinx® UltraScale+™ FPGAs and a Zynq® 7000 Series multiprocessor system-on-chip (MPSoC). It is designed for the most demanding mission critical military, defense, and industrial applications where extreme FPGA processing and I/O bandwidth capabilities are needed. Applications include electronic warfare, signal intelligence, radar/sonar, and high performance embedded computing.
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802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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PCIe 4.0 RAID Controller
MegaRAID 9560-16i
The MegaRAID 9500 series is the industry’s first PCIe Gen 4.0 RAID adapter family, offering PCIe Gen 4.0 host and storage interfaces. The MegaRAID 9560-16i adapter, based on the SAS3916 high-port count PCIe 4.0 x8 RAID-on-Chip (RoC), delivers twice the performance of previous generations.
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Comprehensive Analysis for MediaLB Data
MediaLB System
A MediaLB system consists of several MediaLB devices and one MediaLB controller (typically an INIC chip). The INIC serves as a transceiver for the MOST network and as a controller for MediaLB, which assures synchronization to the MOST network.
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Module Spectrum
nRF52805 Series
Raytac nRF52805 tiny and low cost modules spectrum covers MDBT42TV-192K & MDBT42TV-P192K series with both Chip Antenna and PCB Antenna option for selection
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PROBE CARD
the electrical characteristics of the individual CHIPs in WAFER that have been completed through the FAB stage during the semiconductor fabrication process
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Embedded Boards
UltraZed Family
Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of ...show more -
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High Speed Ethernet DAQ
Ultraview's ethernet based acquisition boards bring low noise, large channel count solutions to common open-source platforms. The flexibility of being able to combine a large number of publicly available firmware/software modules with laboratory quality data acquisition chips makes many previously difficult project integrations possible at a fraction of the cost of developing the entire system.
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Computer-On-Module
CM22301
LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-pe...show more -
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Receiver Conformance Test Application for IEEE 802.3bm
M8091BMCA
IEEE 802.3bm Receiver Test Application for 25GAUI-1 Chip-to-Module, Chip-to-Chip, Cable and Backplane.
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isoPower
Analog Devices isoPower® technology utilizes proprietary iCoupler® chip scale transformers to integrate isolated dc-to-dc converts with data isolation into a single package. This enables designers to implement isolation in designs without the cost, size, power, performance, and reliability constraints found with optocouplers. With more than one billion channels shipped into the field, these magnetically isolated products are a safe, reliable and easy-to-use alternative to optocouplers.
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SparkFun Cryptographic Co-Processor Breakout
ATECC508A (Qwiic)
The SparkFun ATECC508A Cryptographic Co-Processor Breakout allows you to easily add strong authentication security to your IoT node, edge device, or embedded system. It includes two Qwiic ports for plug and play functionality. Utilizing our handy Qwiic system, no soldering is required to connect it to the rest of your system. However, we still have broken out 0.1"-spaced pins in case you prefer to use a breadboard. The ATECC508A chip is capable of many cryptographic processes, including, but not limited to:
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SparkFun MicroMod Teensy Processor
The SparkFun MicroMod Teensy Processor leverages the awesome computing power of the NXP iMXRT1062 chip and pairs it with the M.2 MicroMod connector to allow you to plug it into your choice of compatible MicroMod Carrier Board. With the M.2 MicroMod connector, connecting your Teensy Processor is a breeze. Simply match up the key on your processor's beveled edge connector to the key on the M.2 connector and secure it with a screw (included with all Carrier Boards). Adding a Teensy to your desired project has never been easier!
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Metal Alloy Low Resistance Chip Resistor
MR
*Low Resistance / TCR / Inductance*Excellent long term stability*RoHS compliant and halogen free*Lead free*High precision current sensing and voltage division
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MPI Sorter Series
MPI’s Sorter Series are improving production efficiency and yields for market sectors related to LED chip, package production, discrete device handling, and IC substrate manufacturing. Deploying MPI’s Pick & Place technology, the Sorter Line offers dedicated sorting and defect inspection solutions particularly suited for GaN, GaAs, Vertical LED Chip, Flip Chip, and Laser Diode applications. With a proven heritage of and market-advanced technologies, MPI offers competitive and differentiated solutions that are scalable and cost-effective.
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ISO 26262 FMEDA Solution
OneSpin automates the FMEDA steps through a series of safety apps integrated in a comprehensive, interoperable flow that leverages structural analysis, formal proofs, and expert knowledge. The apps can be applied at chip level, and support both RTL and gate-level design models. Crucially, the OneSpin FMEDA flow does not require a test bench, reduce or eliminates slow and effort-intensive fault simulation, and quickly detects shortcomings in the safety architecture.
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Infrared Moisture Analyzer
LD-LIMA-A10
Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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3U Processor Board
CP39101
LinkedHope Intelligent Technologies Co.,Ltd.
CP39101 is a 3U CompactPCI 4-channel independent isolated serial communication board, designed for industrial communication applications, compliant with PICMG R3.0 2.1 specification.CP39101 adopts EXER 17D158 communication processor as the master control chip. Each of the on-board 4-channel serial port can be individually configured as RS232, RS485 or RS422, and in any mode, CP39101 can be operated properly in extended temperature ( -40℃ to +85℃ ) range.
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Reliability Testing
ELES Semiconductor Equipment SpA
ELES designs and manufacturers reliability test solutions to verify the performance of integrated circuits from concept validation to high volume production during all the test phases. No other company can provide universal equipment for all the reliability tests, or can guarantee a seamless data flow between phases or can apply on chip embedded reliability engineering for data tracking and failure investigation. Clients use our functional test data to proactively analyse va...show more -
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Electronic Inspection Systems
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.