Gold
invaluable naturally occurring material able to withstand corrosion, highly conductive. Also known as: Au
See Also: Precious Metal, Platinum, Au, Gold Test
-
Product
Isothermal Titration Calorimeters
MicroCal ITC Range
-
The "Gold Standard" for measuring binding affinity and stoichiometry. MicroCal ITC isothermal titration calorimeters are used to study a wide range of biomolecular interactions. The applications range from drug design to fundamental research such as the understanding and regulation of signal transduction pathways. These systems deliver direct, label free and in-solution measurements of binding affinity and thermodynamic parameters in a single experiment. They have high sensitivity, low sample consumption and options for automation to minimize ‘hands on’ time. A choice of instruments ensures that MicroCal ITC calorimeters meet the varied and demanding requirements of today’s life science laboratories.
-
Product
Gold Tester
-
Napco Precision Instruments Co
Provides the lowest cost option for gold purity analysis needs. A proportional counter system, this the lowest priced X-ray fluorescence unit in the gold tester filed.
-
Product
8G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L8GN16-SGH
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
ScanSpection
SS15000-IC
-
The revolutionary scanner system, for the inspection of low to medium volume PCB Assemblies were programming is not required. The system compares between a known good (Gold) board and a sample board.
-
Product
Cantilever Probe Card
-
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
-
Product
Capacitance Bridge
1621
-
The GenRad1621 Capacitance Measurement system is a completely self-contained system capable of capacitance measurements in increments as small as 0.1 aF (10-4 pF) and conductance measurements in increments as small as 100 aU (10-7 U; equivalent to a shunt resistance of 1010 M). Measurements are three terminal, with 2- or 3-terminal connection, and provision is also made for the connection of an external standard for comparison measurements.
-
Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
4G SO-DDR3-1600 512X8 1.35V SAM -20~85℃
AQD-SD3L4GN16-SGH
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
MANIA TEST PROBE
SERIES 76
-
ElectricalMAXIMUM CURRENT: 3 amps continuousat working travel, non - inductiveRESISTANCE: At 35 mA test current,50 mOHMS meanMaterial and FinishesPLUNGER: Heat treated berylliumcopper, FINISH: -2E / -2P Hard nickel plated-2D / -2E138 24 Kt gold plated,BARREL: Phosphor bronze, nickel platedSPRING: Stainless steel, silver platedPIN: Music wire, hard nickel plated
-
Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type H, Ø0.80mm, 230gf
K100-H080230-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style H, Tip Diameter Ø0.80mm, Spring force 230gf, Steel with Gold Plating.
-
Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type I, Ø1.26mm, 155gf
K100-I126155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style I, Tip Diameter Ø1.26mm, Spring force 155gf, Steel with Gold Plating.
-
Product
Standard 1.00 (28.30) - 5.40 (153.00) Battery Probe
BIP-10
Battery Probe
Current Rating (Amps): 5Average Probe Resistance (mOhm): 30Resistance Remark: Probe Resistance Steel: 30 mOhms, Gold plated: 100 mOhmsTest Center (mil): 260Test Center (mm): 6.60Full Travel (mil): 157Full Travel (mm): 4.00Recommended Travel (mil): 126Recommended Travel (mm): 3.20Overall Length (mil): 591Overall Length (mm): 15.00
-
Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type C, Ø1.50mm, 155gf
K100-C150155-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style C, Tip Diameter Ø1.50mm, Spring force 155gf, Steel with Gold Plating.
-
Product
Miniature Adjustable Pressure Switch
MDA
-
Sense differential pressure with this Miniature Adjustable Pressure Switch. The switch features field adjustable set point and gold inlay contacts. Air or other compatible fluids can be used on the ?high side?.
-
Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
Metrology Software
-
ZYGO has been developing metrology software for decades – our commitment to helping our customers measure confidently, and the heart of our quality guarantee. Our original instrument software, MetroPro, established itself as a gold standard in the optical metrology world. Now, its successor Mx continues that legacy: trusted, easy to use, and heavily customizable.
-
Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
PCIe Adapter for XMC
PCIe4LXMCX1
-
Simple and easy to use. Install PCIe4LXMCX1 into your PCIe system to adapt an XMC card. The XMC can have bezel and or rear IO. Pn4 and/or Pn6 are supported with PCIe8LXMCX1. 8 lanes are routed from the PCIe gold fingers to the XMC position. XMC´s with up to 8 lanes can be used. The PCIe lanes to/from the XMC are routed per PCIe specifications with matched lengths and impedance control.
-
Product
Thin Film
-
Substrates: ceramics, glass, soft substrates. Conductor: Au, Pt, Pd, Ni, Cu, Ta, WTi. Dielectrics: Polyimide, SiN. Micro strip and coplanar design. Through hole metallisation, filled via. Integrated resistor and capacitor. Air bridges. Polyimide Multilayer.
-
Product
RF/Microwave Assembly Capability
-
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.
-
Product
Kelvin Clip
BU-78K
-
Kelvin Clip, Gold Plated Brass, 10 Amps, 2.3″ Length, 1/2″ Jaw Opening,
-
Product
Ring Disk Electrode
-
This ring-disk type electrode developed by NTT Advanced Technology Corporation is a form of printed electrodes. Users can choose them from Carbon, Gold and Platinum applied versions. Available as a working electrode of radial flow cells, achieves complete reduction/oxidation on the center disk at ultra-low flow rate because of its fine coulometric electrolysis efficiency. This also enables to analyze subsequent reaction as well as identification and quantitation of the sample at the same time.
-
Product
Waveguide Bends
-
Fairview Microwave’s lines of precision waveguide bends are widely used in applications such as high efficiency RF, microwave and mm-wave transmissions, satellite and military communications, radar, telecom, instrumentation and test benches. In waveguide systems that require a signal to turn or bend 90 degrees, Fairview’s waveguide bends are used to facilitate that bend or turn without degrading the transmission signal. These WG bends operate from 5.85 GHz to 90 GHz across 12 frequency bands and are available in sizes from WR-12 to WR-137. This family of waveguide bends also boast low loss and VSWR as low as 1.08:1 and are available in both E-plane and H-plane configurations. They are constructed using gold plated, oxygen free hard copper (OFHC) or painted copper alloy depending on the model and are also offered with either a UG-style flange per the military standard or a CPR-style flange. Many models are RoHS compliant.
-
Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
16G DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-D5V16GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger, Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
SO-DIMM DDR2 Memory
-
Enable better electrical performance and speed (compared to SO-DDR) with Advantech. We offers industrial grade SO-DDR2 800/667 memory with 30μ" gold plating connector (200 pin), featuring 1.8v operating voltage and better bandwidth.
-
Product
High Force Type Probe For PCB, K100 Series 100mil Pitch, Type K, Ø1.50mm, 305gf
K100-K150305-SKAU
Spring Probe
K100 Series, Pitch 100mil, Tip Style K, Tip Diameter Ø1.50mm, Spring force 305gf, Steel with Gold Plating.
-
Product
Plugbord
3719-6
-
VECTOR Electronics and Technology, Inc.
72 Gold plated edge contacts (36 each side)on 0.100"(2.54mm) centers. Pad per hole and peripheral buses, same both sides. Row and column legends provided
-
Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
-
DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
