ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
Isolated USB Digital I/O Modules (OEM Version Available)
USB-7230/7250
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The USB-7230/7250 USB-based digital I/O modules feature high voltage on/off control and monitoring, and isolation voltage supported up to 2500VRMS. The USB-7230 provides 32-CH isolated digital I/O and 2-CH frequency/event counters. The USB-7250 provides 8-CH relay output (4 form C and 4 form A), 8-CH isolated DI, and 2-CH frequency/event counters. The USB-powered USB-7230/7250 features removable screw-down terminals for easy device connectivity, and the included multi-functional stand fully supports desktop, rail, or wall mounting.
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Product
PICMG Single Board Computers
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ADLINK's industrial Slot Single Board Computers (SBCs) and backplanes follow PCI Industrial Computer Manufacturers Group (PICMG) 1.0 and 1.3 standards, with card-on-backplane architecture delivering faster Mean Time to Repair (MTTR) over conventional motherboard designs, flexible backplane configurations, functional with a broad range of off-the-shelf peripheral cards. ADLINK’s wide range of PICMG 1.0/1.3 CPU board-compatible backplanes are fully co-functional with ADLINK systems, for flexible configuration and expandability in industrial applications.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
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The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
3U Intel® Core™ i7-2715QE 2.1 GHz Quad-Core Processor-based PXI Controller
PXI-3980
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The ADLINK PXI-3980 PXI embedded controller, based on the second generation Intel® Core™ i7 processor is specifically designed for hybrid PXI based testing systems, delivering a rugged yet stable platform for a wide variety of testing and measurement applications.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
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- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
FEC Accelerator Based On Intel® VRAN Dedicated Accelerator ACC100
PCIe-ACC100
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ADLINK’s PCIe-ACC100 is a PCIe interface accelerator adapter developed based on Intel's vRAN Dedicated Accelerator ACC100 eASIC chip. It supports 4G and 5G codec acceleration, checksum rate matching, onboard 4G ECC memory, and hybrid automatic repeat request technology (HARQ). The PCIe form factor HHHL (half-height, half-length) can meet the needs of most application scenarios.
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Product
Industrial Fanless Mini PC (Dual 4K Media Player)
EMP-100 Series
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- Palm size and slim design (H: 28mm)- Intel® Celeron® N6210/J6412 processor- Support 2x HDMI output- Support 12V DC input- 1 x DDR4 SO-DIMM, up to 16GB- 1 x M.2 2280 Key M for optional storage device- 1 x M.2 2230 Key E for optional Wi-Fi/BT Module- 3 x USB 3.2 Gen.1 (Type-A)
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Product
3U CompactPCI® Subsystem with 13-slot Backplane, 2 + 1 CompactPCI® Redundant Power Modules
cPCIS-2633 Series
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- 3U CompactPCI® backplane with 12 peripheral cand slots and one system slot- 2 + 1 hot swappable 500 W + 250 W CompactPCI® Power supply (supports three 250 W PSUs)- Temperature, voltage, and fan monitoring LEDs- Supports current sharing on +5V, +3.3V, and +12V- PICMG® 2.11 47-pin power interface- Hot-swappable cooling fans & filter
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Product
32-CH EtherCAT I/O Terminal Base For M-Type Modules
ECAT-TB32-M-DIN
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The ECAT-TB32-M-DIN is a 32-channel EtherCAT I/O Terminal Base designed specifically for ADLINK's M-Type EtherCAT IO Slave Modules. This terminal base unit serves as a foundational component for enabling communication and interaction with various peripheral devices through the EtherCAT protocol.
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Product
Digital I/O Module
ND-6050
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- Interface: RS-485- 7 TTL digital inputs- 8 open collector DO- Output up to 30V, 30mA max. load- Programmable input polarity
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Product
NXP® ARM Based Open Frame Touch Panel PC
SP2-IMX8 Series
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- NXP i.MX8M Plus high-performance processor- Built-in 2.3 TOPS NPU for entry level AI computing (ex. AOI)- PCAP touch screen (7"/10") with true flat design- 32GB eMMC and external Micro SD slot for storage expansion- Expansible I/O design from edge I/O- Support Multi-OS: Linux, Windows, Android- Support Speaker, Mic-in, Line-out and buzzer- Support 1GbE LAN TSN
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
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ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
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Product
AI-ADAS Solutions
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The ADLINK integrated AI-ADAS solution includes one automotive-grade ECU, eight cameras, and the vision-AI algorithm. It is compatible with many ADAS features, including FCW, LDW, AVM, BSIS, BSD, and DMS. Increase your fleet safety by working with just one partner.






















