ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
Intel Atom® Processor-Based Ultra Compact Embedded Platform
MXE-200 Series
Embedded Platform
ADLINK's new Matrix MXE-200 series Ultra Compact Embedded Platform, based on the Intel Atom® SoC processor E3845/E3826, With superior-class construction meeting a wide variety of specific industrial needs, the MXE-200 series offers the most reliable Ultra Compact Embedded Platform for use in harsh environments, compliant with industrial grade EMI/EMS (EN61000-6-4,61000-6-2), protecting customer assets and reducing TCO. Opposing conventional correlations between size and computing power, the MXE-200 series features large-scale performance in an ultra-compact package.
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Product
Jetson Xavier™ NX Edge Inference Platform
DLAP-211-JNX
Platform
- Deep learning acceleration with Jetson Xavier™ NX- Compact fanless system 148(W)x120(D)x49.1(H)mm*- Wide temperature range from -20°C to 70°C
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Product
Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
Computer on Module
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
MAPS Core
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An all-in-one core package includes the ADLINK products’ driver, device management utility-ACE and, PXI configuration setting utility
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Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
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Product
8-CH 24-Bit High-Resolution Dynamic Signal Acquisition Module
PCIe-9529
Analog Input Module
The ADLINK PCIe/PXIe-9529 is a high-performance, high density, 8-CH analog input dynamic signal acquisition module. The PCIe/PXIe-9529 features eight 24-bit simultaneously sampling analog input channels. The 24-bit sigma-delta ADC provides a sampling rate of 192 kS/s at high resolution, making it ideal for higher dynamic range signal measurement. All channels are sampled simultaneously and accept input range up to ±10V, and the analog inputs support software-selectable AC or DC coupling and 4 mA bias current for integrated electronic piezoelectric (IEPE) sensors. The module is especially designed to meet the requirements of vibration analysis and audio testing.
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Product
2 PICMG® CPU, 7 PCI™, 1 ISA Slots Backplane
HPCI-9S7U
Backplane
- Segment: 1- Slots: 2 PICMG® CPU, 7 PCI™, 1 ISA- Supports AT, ATX power supplies- Dimensions: 213.4 mm x 259.1 mm
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Product
4/8-CH 12-Bit 1 MS/s Analog Output Multi-Function PXI modules
PXI-2500 Series
Analog Output Module
ADLINIK PXI-2501 and PXI-2502 are high-speed, high-performance analog output multifunction PXI modules. These devices are able to update up to 8-CH, 12-bit analog outputs imultaneously sustaining 1 MS/s. The reference sources and output polarities are programmable individually per channel. Combine this with the multiplying PXI architecture, ADLINK PXI-2500 series PXI modules can generate complex modulated analog signals. The hardware-based arbitrary waveform generation frees CPU intervention even when all analog outputs are updating at full speed, and the lengths of waveforms are only limited by the system memory. The PXI-2500 series integrate up to 8-CH, 400 kS/s, 14-bit single-ended analog inputs with programmable polarity, 24-CH programmable digital I/O lines, and 2-CH 16-bit general-purpose timer/counters.
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Product
COM Express Type 7 10GbE SFP+ Network Adapter Card
CEI-4x10G SFP+
Network Interface Controller
- Support up to four 10GbE SFP+ interfaces- COM.0 R3.1 Type 7 compliant- Dedicated for Express-ID7
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Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
I-Pi SMARC Development Kit Based On NXP® I.MX 95 Six-Core Arm® Cortex-A55, M7 & M33
I-Pi SMARC IMX95
Software Development Kit
The ADLINK LEC-IMX95 is a powerful and versatile SMARC module that delivers high-performance computing, graphics, machine learning, and vision capabilities for IoT and industrial applications. It is based on the NXP i.MX95 processor, which integrates six Arm Cortex-A55 cores, one Arm Cortex-M7 core, one Arm Cortex-M33 core, an Arm Mali GPU, an ISP, and an eIQ Neutron NPU that can run at up to 2 TOPS.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280






















