Flip Chip Test
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BladeRunner 175™ - 175 micron Flip Chip Wafer Probing Solution BladeRunner175™ (BR175) is designed for the unique challenges of 90-nanometer logic wafer test. Using proprietary MicroForce™ probing technology, the 175-micron-pitch flip chip wafer probing solution combines low probe force with stable contact resistance to reduce risk of damage and help increase test yield.
ODS Series - Optical Displacement Measurement Systems The optical displacement measurement systems of the ODS series are specially designed for measuring the ultrasonic vibration displacement at bond tools of wire & flip-chip die bonders.
LaserVia AOIM - HDI Inspection igh-Density Interconnection or HDI and Flip-chip are revolutionizing the production of precision electronics. Traditional blind via inspection employed only a 3D measuring machine and a coaxial light. Blind vias were inspected one by one an approach that was labor intensive, painstaking and impractical. Our new LV265 system reduces the inspection time of HDI and Flip-chip panels from hours to mere minutes!
CI-T120S/CI-T130S - Component Inspection The new CI-T120S and CI-T130S Component Inspector address the growing inspection needs of Flip Chip substrates for 100% 2D & 3D metrology and inspection at high volume and accuracy.
Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
MEMs Probe Card MicroProbe's Mx and Vx product platforms. The Mx-FinePitch probe card supports fine pitch, wire bond wafer testing for logic and SoC devices. Fine pitch scalable down to 40um in-line, 20/40um staggered designs. The Vx-MP probe card supports high-density flip chip wafer testing for devices such as cutting-edge microprocessors and SoCs. Flip chip pitch scalable to 130um and below.
Apollo - Vertical Probe Cards Apollo vertical probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip and pre-bump or aluminum pad application. Broad range of probe diameters and tip geometries, scalable to 135um pitch.
RTX-113 - X-ray Inspection System The RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs and Flip Chips.The system is very versatile and features Glenbrook's patented, award-winning X-ray camera technology that generates high-resolution.
phoenix pcba|inspector - 2D Microfocus X-ray Inspection System The phoenix pcba|inspector is a high-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints (e.g. BGA, QFN, QFP, PTH, CSP, Flip Chip) in board assemblies, but also for inspection of electronic and mechanic components and more.
ScanCOMPONENT - PC Based Offline Component Programming System ScanCOMPONENT is a PC based offline component programming system for the creation of vision data files for the smallest flip chip and bumped packages to the largest odd form devices. Wafer trays, nozzles, shields, lead frames and feeder tapes can also be imaged, measured and processed. The system includes a calibrated high-resolution color scanner platform combined with a powerful, easy to use, software package.?
Gen5™ C - -Mode Scanning Acoustic Microscope The Gen5 delivers the broadest range of capabilities available. Whether your needs are for non-destructive failure analysis of a flip chip or bonded wafer, process development, R&D, high-rel qualification for a military application, or medium-volume screening of a batch of smart cards, the Gen5 is the one machine that can meet all of your demands.
MI-SCAN - Acoustic Scanning Microscope The MI-SCAN is a universal system that can be utilized in the FA Lab or as a Manual Production System. Inspection capabilities range from a variety of IC Plastic Packages, BGA's, Flip Chips, Ceramic Capacitors, Smart Cards, Flex Circuits, Circuit Boards, Wafers and any other parts requiring high speed, high frequency precision ultrasonic inspection.
Packaging Assistance With over thirty years of combined package engineering experience in organics and ceramics, TestEdge can provide technical support for bringing your chip, package, and assembly together. We are committed to meeting and exceeding your requirements, from R&D to production. We can supply: Package selection. Traditional & stud wafer bumping interface. Cost, performance & thermal tradeoffs . Die pad, wire bond, & flip chip constraints. Production feasibility studies. Off-shore and domestic production interface.
Dragon FL - IC Substrates Dragon FL is specially engineered to scan High Technology Fine Line PCB's down to 12.5 Microns line-space technology. Its precise detection ability combined with cutting edge optics, offers a reliable AOI solution for high-end applications such as fine-line PCBs, Chip Carriers PCBs (BGAs, CSPs, Flip Chip BGAs, COF and other challenging IC Substrate applications) and Sequential Build-Up PCBs (laser via, photo via, conformal mask etc.)
TPA - Automated Parasitic Extraction for IC Packages Turbo Package Analyzer (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today's complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexxim® or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot, and TDR
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