ODS Series - Optical Displacement Measurement Systems The optical displacement measurement systems of the ODS series are specially designed for measuring the ultrasonic vibration displacement at bond tools of wire & flip-chip die bonders.

Wafer Scanner For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.

CI-T120S/CI-T130S - Component Inspection The new CI-T120S and CI-T130S Component Inspector address the growing inspection needs of Flip Chip substrates for 100% 2D & 3D metrology and inspection at high volume and accuracy.

MEMs Probe Card MicroProbe's Mx and Vx product platforms. The Mx-FinePitch probe card supports fine pitch, wire bond wafer testing for logic and SoC devices. Fine pitch scalable down to 40um in-line, 20/40um staggered designs. The Vx-MP probe card supports high-density flip chip wafer testing for devices such as cutting-edge microprocessors and SoCs. Flip chip pitch scalable to 130um and below.

Apollo - Vertical Probe Cards Apollo vertical probe cards are suitable for area-array and perimeter-layout probing applications, including both flip chip and pre-bump or aluminum pad application. Broad range of probe diameters and tip geometries, scalable to 135um pitch.

BGA - Video Inspection The Optilia Flexia BGA inspection system offers everything you need for high quality optical inspection of BGA, µBGA, Flip-Chip packages and other components that require technical edge in inspection. It is built around the highly flexible Definition digital video microscope with ultra small side viewing BGA zoom lens and produces high-resolution images for visual inspection and digital image and video recording

Gen5™ C - -Mode Scanning Acoustic Microscope The Gen5 delivers the broadest range of capabilities available. Whether your needs are for non-destructive failure analysis of a flip chip or bonded wafer, process development, R&D, high-rel qualification for a military application, or medium-volume screening of a batch of smart cards, the Gen5 is the one machine that can meet all of your demands.

RTX-113 - X-ray Inspection System The RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs and Flip Chips.The system is very versatile and features Glenbrook's patented, award-winning X-ray camera technology that generates high-resolution.

ScanCOMPONENT - PC Based Offline Component Programming System ScanCOMPONENT is a PC based offline component programming system for the creation of vision data files for the smallest flip chip and bumped packages to the largest odd form devices. Wafer trays, nozzles, shields, lead frames and feeder tapes can also be imaged, measured and processed. The system includes a calibrated high-resolution color scanner platform combined with a powerful, easy to use, software package.?

SMD-7007 The Sniper Flo-Master, SMD-7007 combines the unique High Power, Low Temperature, reflow operation of APE?s Flo-Master with the latest technology in optic engineering and alignment design. The SMD-7007 provides absolute control in positioning all ultra fine pitch, and BGA packaging technologies including Flip Chip bumped packages.

phoenix pcba|inspector - 2D Microfocus X-ray Inspection System The phoenix pcba|inspector is a high-resolution 2D microfocus X-ray inspection system designed for inspecting solder joints (e.g. BGA, QFN, QFP, PTH, CSP, Flip Chip) in board assemblies, but also for inspection of electronic and mechanic components and more.

Dragon FL - IC Substrates Dragon FL is specially engineered to scan High Technology Fine Line PCB's down to 12.5 Microns line-space technology. Its precise detection ability combined with cutting edge optics, offers a reliable AOI solution for high-end applications such as fine-line PCBs, Chip Carriers PCBs (BGAs, CSPs, Flip Chip BGAs, COF and other challenging IC Substrate applications) and Sequential Build-Up PCBs (laser via, photo via, conformal mask etc.)

Packaging Assistance With over thirty years of combined package engineering experience in organics and ceramics, TestEdge can provide technical support for bringing your chip, package, and assembly together. We are committed to meeting and exceeding your requirements, from R&D to production. We can supply: Package selection. Traditional & stud wafer bumping interface. Cost, performance & thermal tradeoffs . Die pad, wire bond, & flip chip constraints. Production feasibility studies. Off-shore and domestic production interface.