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PANELMAP Boin GmbH Contact Info Send To Colleague PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D ...more -
WAFERMAP-View.OCX Boin GmbH Contact Info Send To Colleague WAFERMAP-View.OCX for Windows is a software development kit for both the semiconductor and disk drive industry. It offers 7 different types of graphics of WAFERMAP for Windows as an ActiveX control. WAFERMAP-View.OCX is the perfect solution for scanning ellipsometers, four point probes and others. WAFERMAP-View.OCX employs an innovative object orie ...more -
WAFERMAP Boin GmbH Contact Info Send To Colleague WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, ...more
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Definition: Detect film and surface conditions of under an Angstrom thick. |