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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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NUV-PL SiC Defect Inspection System
VS6845E
Industrial Vision Technology Pte Ltd.
Comply with IEC63068-3 Standard: Test method for defects using photoluminescence, Model VS-6845 SiC Wafer defect inspection system has capability on Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices.
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
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Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
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Semiconductor Wafer Defect Inspection Management Software
ProcessGuard
Microtronic ProcessGUARD Software is the desktop client for the EagleView auto macro wafer defect inspection system. ProcessGUARD is a high volume, high speed semiconductor wafer defect inspection management solution that provides an easy-to-use, customizable and extensible platform and interface to automate your fabs defect inspection process. ProcessGUARD is feature rich (see below) and its newest releases include complete wafer randomization software, a user-defined defect library, and an integrated trainer and knowledge base.
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VIP Cabin Management Systems
Where elegance meets powerful functions, add a new level of electronic sophistication to your cabin.
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Dual Sensor Enhanced Vision Systems
EVS
Enhance your safety and situational awareness while flying with Max-Viz dual sensor enhanced vision systems (EVS) from Astronics. These multi-spectral imagers include a long wave infrared sensor, a visible light + near infrared sensor, and patented blending and dynamic range management image processing to enable pilots to see clearly during day and night.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Inflight Entertainment System Hardware
Innovative IFEC solutions that enable connectivity, entertainment, and control.
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4U 8-Slot CompactPCI® System with Redundant Power Supplies
cPCIS-6418U
The cPCIS-6418U Series Subsystem is designed for maximum density and has 8 horizontal slots for 6U cPCI boards with 80mm RTMs. The chassis is 4U in height and standard 19" rack mount width.
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Mezzanine System
5362
ECM P/N 5362 provides eight channels of LVDS I/O with fixed 100 ohm termination. Speeds are up to 200M bits per second. All channels power up as inputs. Software can then enable outputs on a channel by channel basis.
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System Integration
G Systems develops fully integrated systems and we know that both software and hardware are equally important to system design. Our focus on code quality and optimization ensures customers receive efficient and maintainable code. We specialize in LabVIEW development and all of our LabVIEW developers are certified developers or architects. We’re also highly skilled in mechanical and electrical hardware design and builds on a wide variety of data acquisition, signal conditioning, RF, and distributed communication platforms.
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USB2.0 Module With 2 CAN Bus Nodes ARINC825 Compliant For Testing & Simulation of Avionic ARINC825/CAN Bus Systems
APU825-2
USB2.0 module with 2 CAN bus nodes ARINC825 compliant for testing and simulation of Avionic ARINC825/CAN bus systems.
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Mezzanine System
5658
ECM P/N 5658 provides eight channels of 16 bit current measurement in the 0 to 25 milli-amp range. Each channel allows independent common mode voltages from -100 volts to +100 volts. Current detection is accomplished with a precision 100 ohm current sense resistor, creating a voltage drop of 2V in the current loop at 20 milli-amps.
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Medalist i1000D Small Foot Print Inline and Offline In-Circuit Systems
U9405A
Unlike traditional bridge type board handlers that add a 3rd party equipment on your offline ICT systems, we provide a one-stop shopping experience when you are automating your in-circuit test.
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VIP IFEC & CMS Systems
Astronics is the smart choice for inflight connectivity, entertainment, and cabin management solutions for VIP, VVIP, and business aircraft. From the highest-performing global SATCOM connectivity for optimum productivity and entertainment, to our Avenir IFE/CMS line that incorporates the latest technologies to deliver native 4K video distribution through the highest bandwidth Ethernet network system in the industry, Astronics is ready with a cutting-edge solution that delivers the ultimate VIP experience.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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IPC Systems
Industrial Server-Grade System delivers a scalable high performance platform for a wide array of industrial applications.
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Mezzanine System
5158
The 5158 Electrical Conversion Module (ECM) provides eight (8) RS-232 outputs and eight (8) RS-232 inputs. Built around Maxim 1488 & 1489 chips for true RS232 levels and voltage tolerance, all outputs come up in the 1, mark or idle state. Electrically this is a negative output voltage, the start bit is always a 0 or a positive voltage level.
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Validation System
FLEX BMS
The FLEX BMS™ Validation System is a quick-connecting, highly flexible test system for rapid evaluation of centralized, single-board and distributed battery management systems. Utilizing Bloomy’s industry-leading battery cell simulators, COTS instrumentation, industry-standard connectors, and models that run in real-time, the FLEX BMS™ Validation System can easily be reconfigured to test a wide variety of BMSs. The FLEX BMS™ Validation System is used by national and regional safety and standards labs for certifying the BMS for a wide array of e-mobility products and applications.
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Systems
In addition to our ISO 9001:2008 certification, we are proud to have the highest possible score for delivery-on-time and QA rating - 100% - from all the major aerospace companies.
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Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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The Compact AI GigE Vision Systems for the Edge with Intel Movidius Myriad VPU
EOS-i6000-M Series
The ADLINK AI Plug-and-Play (PnP) Solution is a set of ADLINK AI edge hardware and data connectivity platforms that help our partners build and deploy AI solutions faster and simpler. With ADLINK Data River™ enabled at AI edge platforms, devices, AI inferences, and data integrations, the AI PnP Solution offers a crossplatform, flexible, scalable solution that delivers business value.
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Test Requirements Document (TRD) System
TRD Software
The Test Requirements Document (TRD) System helps users develop and document the strategy and structure of test programs.
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Mezzanine System
5235
The 5235 ECM provides 16 bits of simple digital I/O. The digital I/O is connected directly to the digital I/O on the carrier card. Inputs are clamped to about 3V by FET buffer ICs, and are 5V tolerant.
