Showing results 1 - 15 of 496 products found
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Company: Corning
Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Company: Radiant Technologies
Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750°C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
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Company: KLA-Tencor
KLA-Tencor''s wafer manufacturing equipment and tools include wafer manufacturing inspection (wafer surface inspection), wafer shape quality review, metrology and data management systems. Specialized wafer manufacturing quality inspection tools assess wafer surface quality and detect, count and bin defects during the wafer manufacturing process and as a critical part of outgoing wafer quality inspection. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Specifications for wafer defectivity, geometry and wafer shape quality are tightening as the dimensions of transistors become so small that the properties of the substrate can substantially affect transistor performance.
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Company: KLA-Tencor
KLA-Tencor''s wafer manufacturing equipment and tools include wafer manufacturing inspection (wafer surface inspection), wafer shape quality review, metrology and data management systems. Specialized wafer manufacturing quality inspection tools assess wafer surface quality and detect, count and bin defects during the wafer manufacturing process and as a critical part of outgoing wafer quality inspection. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Specifications for wafer defectivity, geometry and wafer shape quality are tightening as the dimensions of transistors become so small that the properties of the substrate can substantially affect transistor performance.
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Company: KYEC
KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes: Grinding thickness: Mass Production: 4 mils for 6" and 8? wafers, 8 mils for 12? wafers. Engineering capability: 2 mils for 6? and 8? wafers, 2 mils for 12? wafers
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Company: Nanotronics Imaging
Nanotronics Automation wafer loaders are engineered with versatility in mind. Each bench-top wafer loader can handle a wide variety of wafer sizes and easily integrate with other machines.
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Company: EG Systems
Today's 200mm wafer production demands reliable, accurate and fast wafer probing solutions. Electroglas' 200mm automated wafer probers are based on the production-proven Horizon platform to meet these demands for high-volume, low-cost manufacturing, as well as leading-edge, multi-die and bumped wafer applications.
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Company: KYEC
The services available at KYEC consist of single cut through or dual cut for 4?, 5?,6?,8?and 12? wafers .This includes silicon wafer, glass based , sensor, dual material , solder or gold bumped wafers.
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Company: Das Test Haus
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Company: Viscom AG
*Infrared illumination - transmitted light and reflected light.*Higher throughput.*Non-destructive inspection of the wafer''s surface and interior.*Automated reading of wafer identification and pre-alignment parallel to inspection.*Direct identification of each wafer by code reading (barcode, data matrix code, OCR).*Automatic loading and unloading.
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Company: Starmeter Instruments
A step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them.
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Company: Micronics JAPAN Co.ltd
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Company: Rudolph Technologies
For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
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Company: EG Systems
Leading-edge 300mm wafer production demands wafer probing that can address shrinking geometries and deliver extremely accurate, high-throughput for fine-pitch probing applications and advanced devices with copper interconnects and low-k dielectrics that require special handling. Designed with our customers' production challenges in mind, Electroglas' 300mm wafer probers provide reliable, accurate, high-throughput production capability for real-world test environments.
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Company: InTEST
Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primarily use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA level), and High voltage probing (up to 10kV). -65C to +300°C 150mm, 200mm & 300mm
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Company: Advantest
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
