Showing results 1 - 15 of 474 products found
-
Company: Microtronic
ProcessGuard auto macro semiconductor wafer defect inspection software gives you the flexibility and control over your defect wafer inspection process by unleashing the power to customize your user interface and application features to exactly what your semiconductor wafer defect inspection production process requires.
-
Company: Radiant Technologies
Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750°C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
-
Company: KLA-Tencor
KLA-Tencor''s wafer manufacturing equipment and tools include wafer manufacturing inspection (wafer surface inspection), wafer shape quality review, metrology and data management systems. Specialized wafer manufacturing quality inspection tools assess wafer surface quality and detect, count and bin defects during the wafer manufacturing process and as a critical part of outgoing wafer quality inspection. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Specifications for wafer defectivity, geometry and wafer shape quality are tightening as the dimensions of transistors become so small that the properties of the substrate can substantially affect transistor performance.
-
Company: KYEC
KYEC provides wafer grinding services for silicon wafers, including gold and solder bumped wafers. Our core strengths are on wafer grinding includes: Grinding thickness: Mass Production: 4 mils for 6" and 8? wafers, 8 mils for 12? wafers. Engineering capability: 2 mils for 6? and 8? wafers, 2 mils for 12? wafers
-
Company: EG Systems
Today's 200mm wafer production demands reliable, accurate and fast wafer probing solutions. Electroglas' 200mm automated wafer probers are based on the production-proven Horizon platform to meet these demands for high-volume, low-cost manufacturing, as well as leading-edge, multi-die and bumped wafer applications.
-
Company: KYEC
The services available at KYEC consist of single cut through or dual cut for 4?, 5?,6?,8?and 12? wafers .This includes silicon wafer, glass based , sensor, dual material , solder or gold bumped wafers.
-
Company: Das Test Haus
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
-
Company: Viscom AG
*Infrared illumination - transmitted light and reflected light.*Higher throughput.*Non-destructive inspection of the wafer''s surface and interior.*Automated reading of wafer identification and pre-alignment parallel to inspection.*Direct identification of each wafer by code reading (barcode, data matrix code, OCR).*Automatic loading and unloading.
-
Company: Starmeter Instruments
A step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying special test patterns to them.
-
Company: Micronics JAPAN Co.ltd
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
-
Company: Rudolph Technologies
For both standard and flip chip wafers, the Wafer Scanner™ Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes.
-
Company: InTEST
Temptronic ThermoChucks are conductive heating and cooling systems for wafer testing at temperature. Its primarily use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in. A few specialized applications include Low leakage probing (fA level), and High voltage probing (up to 10kV). -65C to +300°C 150mm, 200mm & 300mm
-
Company: EG Systems
Leading-edge 300mm wafer production demands wafer probing that can address shrinking geometries and deliver extremely accurate, high-throughput for fine-pitch probing applications and advanced devices with copper interconnects and low-k dielectrics that require special handling. Designed with our customers' production challenges in mind, Electroglas' 300mm wafer probers provide reliable, accurate, high-throughput production capability for real-world test environments.
-
Company: Advantest
The E3310 is a WAFER MVM-SEM* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
-
Company: FormFactor
The FormFactor TouchMatrix™ wafer probe solution is designed specifically to deliver the lowest overall test cost per die for 200mm and 300mm NAND and NOR Flash wafer testing. It provides massive parallelism and adjusts to variations in manufacturers’ test equipment and product designs, to optimize probe planarity and speed set-up. Together, these features improve productivity and reduce the total cost of ownership.
-
Company: TestEdge
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
