Showing results: 16 - 22 of 22 items found.
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Testing Machines, Inc.
Bulk density apparatus is testing equipment used to measure the bulk density property of powder, granules and other “divided” solids, especially used in reference to mineral components (soil, gravel, sand), chemical substances, (pharmaceutical), plastics like polyethylene (hdpe or mdpe) pvc, polystyrene etc, or foodstuff and any other masses of granular or particulate matter. Bulk density is defined as the mass of many particles of the material divided by the total volume they occupy. The total volume includes particle volume, inter-particle void volume and internal pore volume.
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National Technical Systems
Scanning Acoustic Microscopy, also known as C-SAM or Acoustic Micro Imaging or AMI, outstanding benefit is its ability to find hidden defects within assemblies and materials that can occur during manufacturing or environmental testing. Defects such as delaminations, voids and cracks can be identified and analyzed more effectively using Acoustic Microscopy than with any other inspection method.Unlike other non-destructive techniques such as X-Ray and Infrared Imaging, Acoustic Microscopy is highly sensitive to the elastic properties of the materials it travels through. Because of this, the ability of Acoustic Microscopy to find and characterize these physical defects is clearly superior. Typical applications include production control, failure analysis, and product development.Through the use of ultra-high frequency ultrasound, C-SAM non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.
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FLIR MR265 -
Teledyne FLIR
The FLIR MR265 is a professional pin and pinless moisture meter with thermal imaging designed to show you exactly where to investigate issues related to moisture, air leaks, and insulation voids. Featuring IGM™ (Infrared Guided Measurement) and MSX® (Multi-Spectral Dynamic Imaging enhancement) technology, the MR265 helps you quickly scan and target problem areas, visually guiding you to the spot where you can confidently take measurements, analyze readings, and ensure that problems are fixed. Using FLIR Thermal Studio™, you can then create and share professional reports that include findings and proof of repairs – giving your clients peace of mind that mold, rot, or moisture challenges have been resolved.
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MX1 -
Manncorp
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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DIR CT -
Scope T&M Pvt, Ltd.
SCOPE proudly introduces Dir CT, a CT Polarity Tester specially designed to verify correctness of polarity of current transformers cores in live EHV switchyards. Polarity test is one of the most common yet crucial tests required to be done on current transformers by commissioning as well as maintenance engineers. Even though it is commonly conducted check, there was no all in one simple tool available for this measurement. DIR CT fills this void to perfection, it is expected to significantly reduce the time taken for polarity checks on numerous CT in sub-station, especially during commissioning of new sub-stations
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EV Group
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Lambient Technologies
Organizations working on new thermosets or new thermoset formulations need an intimate understanding of how these materials cure before they can proceed to the next step in the research, quality control, or production process. What happens when the material is heated? When is the best time to apply pressure to squeeze out voids? How fast does the material react at 120C? 150C? 180C? Most organizations today address this need by curing a sample for an arbitrary amount of time before using inexact, error-prone manual methods, or complex thermal analytical instruments to test cure state. Maybe the sample has reached the end of cure, but maybe not. With traditional methods, it’s difficult to tell for sure. How can organizations determine whether they’re processing materials longer than necessary? Dielectric cure monitoring lets them know for sure.
