Showing results: 1 - 10 of 10 items found.
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SEM -
Materials Evaluation and Engineering
JEOL JSM-6610 LV LaboratoryScanning electron microscopy (SEM) uses electrons for imaging to obtain higher magnifications and greater depth of field than light microscopes. The instruments at MEE are capable of variable-pressure, or low vacuum, SEM (VPSEM), as well as traditional high-vacuum conditions for sample observation. VPSEM is a specialized method using a variable-pressure sample chamber that allows direct evaluation of samples that are not readily examined with a traditional high-vacuum SEM. Nonconductive or vacuum sensitive samples that would typically require additional sample preparation can be directly analyzed in VPSEM without the need for additional sample preparation, such as carbon or metallic conductive coatings. This reduces both sample preparation time and distractions in microanalysis. Our laboratory also has a field emission SEM (FESEM) for critical high-magnification work and low-voltage (LVSEM) applications. Each instrument has a spacious sample chamber that can accommodate large and irregularly-shaped specimens and accessories for feature dimensional analysis and chemical microanalysis.
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Rocky Mountain Laboratories, Inc.
Scanning Electron Microscopy (SEM Analysis) can produce images of almost any sample at magnifications of 15-300,000X. The SEM has tremendous depth of field allowing for imaging that cannot be accomplished using optical microscopy. Conductive and nonconductive samples can be imaged. When operated in the backscatter (BSE) detection mode, differences in material composition can be observed. Elemental analysis can be performed on any feature observed with an integrated Energy Dispersive Spectroscopy (EDS) detector.
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National Technical Systems
The use of Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS) in the analysis of failure related issues of printed circuit boards (PCBs), assemblies (PCAs), and electronic components (BGA, capacitors, resistors, inductors, connectors, diodes, oscillators, transformers, IC, etc.) is a well-established and accepted protocol. As opposed to or simply in addition to normal optical microscopy, SEM/EDS allows for the “inspection” of areas of interest in a much more informative way.
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ZEISS Correlative Cryo Workflow -
Carl Zeiss AG
ZEISS Correlative Cryo Workflow connects widefield, laser scanning, and focused ion beam scanning electron microscopy in a seamless and easy-to-use procedure. The solution provides hardware and software optimized for the needs of correlative cryogenic workflows, from localization of fluorescent macromolecules to high-contrast volume imaging and on-grid lamella thinning for cryo electron tomography.
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Curtiss Wright IMR Test Labs
The metallurgical group is well equipped and staffed (9 full-time metallurgists and technicians) to evaluate materials ranging from cast iron to superalloys to composites. They are experienced in classical metallographic techniques, as well as the latest preparation methods. Advanced analytical tools such as image analysis and scanning electron microscopy (SEM) are used in their evaluations.
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AXIS Supra -
Kratos Analytical Ltd
AXIS SupraTM is an X-ray photoelectron spectrometer (XPS) with unrivalled automation and ease of use for materials surface characterisation. The patented AXIS technology ensures high electron collection efficiency in spectroscopy mode and low aberrations at high magnifications in parallel imaging mode. XPS spectroscopy and imaging results can be complemented by additional surface analysis techniques such as: ultraviolet photoemission spectroscopy (UPS); Schottky field emission scanning Auger microscopy (SAM) and secondary electron microscopy (SEM) and ion scattering spectroscopy (ISS). The AXIS Supra replaces the AXIS Ultra DLD as Kratos' flagship x-ray photoelectron spectrometer.
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National Technical Systems
Contamination Analysis, which begins with a set of basic evaluations that on most occasions will answer the “What is this?” question. The protocol contains four parts:*Visual Examination*Organic Analytical Testing by Fourier Transform Infrared (FTIR) Spectroscopy*Elemental Analytical Testing by Scanning Electron Microscopy / Energy Dispersive X-Ray Spectroscopy (SEM/EDS)*Ionic Analytical Testing by Ion Chromatography (IC)
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Rocky Mountain Laboratories, Inc.
Cross sections are prepared by mounting samples in epoxy and then grinding and polishing the mount for imaging in the optical microscope or Scanning Electron Microscopy (SEM). Valuable information from cross sectioning can include: film thicknesses, inclusions, corrosion thickness, dimensional verification, and subsurface defects. Metallographic cross sections are typically etched to reveal the microstructure. Microstructural analysis can provide information about heat treatment history, corrosion susceptibility, as well as undesirable microconstituents.
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Aerotech, Inc.
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Inolytix
IGC: Inverse Gas Chromatography; Understand surface energies, polarities, acid/base properties and nanomorphology on powders and fibers. ToF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry. Localize your molecules at the first nanos! 2D imaging with resolution up to 200 nm. Highest sensitivity up to 10 ppm. CM: Quarz Crystal Microbalance In-situ observation of thickness and stiffness of any films in liquid environmentSEM: Scanning Electron Microscopy Images say more than words, especially with an artistic eye XPS/ESCA: X-ray Photoelectron Spectroscopy/Electron Spectroscopy for Chemical Analysis.
