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Probers

Transfer and connect test target to contactor or move probes to target.

See Also: Probing, Probing Stations, Nano Probes, Flying Probes, Wafer Probers, Interrogation


Showing results: 31 - 45 of 61 items found.

  • Fully Automatic MRAM Probe System With Initializers

    OHT Inc.

    *This system can measure MRAM characteristics automatically.*Automatically initializes(resets) before and shorten the time of measurement by having a built in initializer.*Generates strong and constant magnetic fields. (Prober: Max 1.5T, Initializer: 2.7T (the highest in the industry)

  • Software

    Gate Oxide Integrity Option - Materials Development Corporation

    Oxide integrity of MOS devices can be evaluated by various techniques such as Time Dependent DielectricBreakdown, Charge to Breakdown, or ramped voltage.  When used with a prober, map distribution of breakdown fields.  Output the data using histograms, cumulativefailure, or Weibull plots.

  • Probe Only Manipulator

    LSP - inTEST Corporation

    The LSP mounts to standard prober hinge mounts with easy access to service and engineering locations. This reduces the floor space per test cell, saving you significant capital expenses. And you’ll be able to quickly and easily set up your ATE to wafer probe.

  • FPP Software

    Four Point Probe - Materials Development Corporation

    For use with a manual four point prober, the MDC FPP Software operates in a convenient, single screen that displays both measurement parameters and testresults.  The FPP software can measure Resistivity, Conductivity, Resistance, Doping, Thickness, and SheetResistance when used with a compatible current source and voltmeter or SMU.

  • MPI SENTIO®Software Suite

    MPI Advanced Semiconductor Test

    By using a novel approach based on simplicity and truly intuitive operation, MPI was first to develop a revolutionary multi-touch prober control software suite to address today’s challenges of operating complex test systems. It saves significantly training time and makes the operators’ life as easy as possible!

  • Coaxial Cable Termination Toolkit

    ICFP - Ardent Concepts, Inc.

    Ardent’s ICFP is a next generation coaxial cable termination toolkit for advanced system design de-embedding, de-bugging, and calibration. Designed for the lowest loss access to signal paths on an IC circuit footprint, this solution is a simple, cost effective alternative to expensive probers and x-y tables for Engineers who need to probe multiple signals at once.

  • Software

    Customized Software - Materials Development Corporation

    If the software packages offered do not meet your specific needs,special software can be written for custom applications.The engineers and programmers at MDC candevelop or modify applications to fit your requirements.  Examples include: *Customer specific measurements *Interfacing with required meters *Production versions of measurements *Interfacing with probers and other measurement platforms *Specialized requirements

  • WaferPro Express On-Wafer Measurement Program Software

    Keysight Technologies

    WaferPro Express software performs automated wafer-level measurements of semiconductor devices such as transistors and circuit components. It provides turnkey drivers and test routines for a variety of instruments and wafer probers. Its new user interface makes it easy to setup and run complex wafer-level test plans, while powerful customization capabilities are enabled by the new Python programming environment.

  • Wide Band Gap Production System

    Reedholm Systems

    Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.

  • Die Sorter Handler

    4605-HTR - TESEC, INC

    4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.

  • Memory Test System

    T5230 - Advantest Corp.

    T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.

  • Probe System

    Acculogic Sprint 4510 - Terotest Systems Ltd.

    The Sprint 4510 family of flying probers are well known for their speed, reliability, ease of use and large world-wide installed base.Flying probe testers have few restrictions on access, require no test fixtures, and can test boards with virtually unlimited number of nets, allowing test developers to turn a program around in a short time.

  • Full Wafer Test System

    FOX-1P - Aehr Test Systems

    Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.

  • Low-leakage Switch Matrix Family

    Keysight Technologies

    Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test.  Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution.  Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested.  This reduces both test time and cost.  Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.

  • Wafer Sort

    TestEdge, Inc.

    TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability

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