Memory Test Systems
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Burn-In Test
The N3500 is Neosem Technology’s fourth generation memory test system. Specifically designed for Flash Components and Flash Cards, the N3500 tester-on-a-board architecture targets the broadest range of DUT technologies in various form factors and packages. Each Tester Board (or “Blade”) contains 288 I/O pins and 32 DPS supplies.
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Communications Test System for Frontline Diagnostics
CTS-2750
The CTS-2750 is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The field-upgradeable, software-defined architecture features easy-to-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets can be created easily using the included TestEZ® software suite.
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In-Circuit Test System
TestStation LX
TestStation LX is a cost-effective in-circuit test solution providing high-volume electronics manufacturers with reliable, high-quality test for the latest printed circuit board assembly technologies.
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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Bluetooth RF Test System
FRVS
FRVS is recognized by the Bluetooth SIG as a validated test system for qualification testing of products to Bluetooth BR/EDR and low energy RF test specifications.
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Communications Test System for Frontline Diagnostics
ATS3000P
The ATS3000P is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000P also includes the sophisticated IF and baseband I/Q DigitalSignal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easyto-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets are available for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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VLSI Test System
3380D
The 3380D/3380P/3380 test system have 4 wires HD VI source and any-pins-to-any-site high parallel test (multi-sites test) functions (256 I/O pins to test 256 ICs in parallel) that can meet the upcoming higher IC testing demands.
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Test System
UltraFLEX
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
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HV Test System for Patient Monitors
HV test enclosure for testing medical products (patient monitors). Insulated test booth with large space for DUT.3 different test nests for adapting different devices.Displays from patient monitors are checked. For this, insulation tests and leakage current measurements must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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Mixed Signal Battery Test System
The Mixed-Signal Battery-Test System is an automated test platform designed to meet today’s advanced battery test requirements. The platform is ideal for testing a range of battery cells and packs, and can be used in applications such as research and design, quality control, and end-of-line manufacturing. Its distributed architecture provides a scalable solution with configurable system components to accommodate specific applications.
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SSD Test Systems
Enables Rapid SSD Development and Production Ramp with Flexible Test Solution In the high-growth and highly competitive SSD market, a test system that supports multiple protocols can eliminate the need for retooling and achieve faster transitions from one product version — or one product generation — to the next. Advantest SSD Test System allows manufacturers to rapidly grow their product portfolios while remaining adaptable to the many changing needs of the evolving SSD market. This tester improves users’ engineering efficiency with powerful, easy-to-use software tools and a revolutionary multi-protocol hardware architecture, enabling accelerated SSD product development and a faster time-to-manufacturing ramp.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Test System
BMS HIL
The BMS Hardware-in-the-Loop (HIL) Test System is a high performance platform providing all necessary input signals used for battery pack simulation. A real-time operating system executes complex cell and pack models commonly used for BMS algorithm development and firmware regression testing.
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Radar Test System
UTP 5065
Radar sensors are core elements to realize autonomous driving. The UTP 5065 radar test system from NOFFZ Technologies has a compact vertical design and contains everything needed to allow State-of-the-Art measurement and sensor calibration. The test bench setup and component selection are tuned to get best possible results for highly accurate and cost-efficient testing in production of automotive radar sensors.
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Image Sensor Testing
IP750Ex-HD Family
The IP750EX-HD has been the test platform that has enabled the industry to manufacture high quality CCD and CMOS image sensors, and it is the most economical platform to meet the needs of newer technologies such as Time of Flight (ToF) sensors. When you use a smartphone, high performance digital still camera, or in-home security and surveillance system, these applications have image sensors most likely tested by Teradyne’s IP750ExHD.
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BMS Manufacturing Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Scienlab Battery Test System - Cell Level
SL1007A
The SL1007A Scienlab Battery Test System – Cell Level enables you to accurately and productively test battery cells for automotive and industrial applications. The bidirectional power supply charges and discharges your cells under test with very high efficiency.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Universal Test System
LEON System
A universal ICT, FCT, ISP and Boundary Scan platform.Based on the ABex platform, which directly integrates Konrad analog bus technology and PXI/PXIe in one chassis, the LEON platform can be configured to solve various test challenges. Due to this architecture only one system provides the complete test flow combining ICT, ISP, Boundary Scan and FCT.Various form factors and configurations allow a perfect combination between cost, speed and test coverage. The modular architecture provides the possibility to reconfigure or upgrade the systems based on your test needs.The LEON System software provides a powerful development and test execution environment which directly supports NI TestStand. All systems and components could be integrated into third party software using supplied APIs.
