Showing results: 256 - 270 of 405 items found.
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MPU-6050 -
SparkFun Electronics
The MPU-6050 is a serious little piece of motion processing tech! By combining a MEMS 3-axis gyroscope and a 3-axis accelerometer on the same silicon die together with an onboard Digital Motion Processor™ (DMP™) capable of processing complex 9-axis MotionFusion algorithms, the MPU-6050 does away with the cross-axis alignment problems that can creep up on discrete parts.
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ADXL345 -
SparkFun Electronics
This new version adds two standoff holes as well as an extra decoupling capacitor. The ADXL345 is a small, thin, low power, 3-axis MEMS accelerometer with high resolution (13-bit) measurement at up to +-16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2C digital interface.
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CRY6151B -
Hangzhou JiGao Electroacoustical Science and Technology Co.,Ltd
CRY6151B is a full-featured electro-acoustic device tester newly launched by our company. It is powerful and stable. It can measure headphones (USB, Bluetooth, anti-noise), microphones (electret, MEMS, dynamic coil type), headphones. Performance indicators of microphone assemblies, receivers / headphone speakers, speakers / speakers (common, Bluetooth), speaker crossover devices, and other electroacoustic devices.
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MicroLine® Series -
VIEW Micro-Metrology
The MicroLine series of non-contact critical dimensional measurement systems are ideal for semiconductor and MEMS applications. MicroLine systems automatically measure linewidth, overlay, and other critical features on wafers and photomasks. Systems are capable of measuring features from 0.5 m to 400 m in size. Measurement repeatability is 10 nm at 1 s (with 100x objective).
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STI3000 -
Solidus Technologies, Inc.
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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ESCP-SAPT Transmitter -
ES Systems
ESCP-SAPT pressure transmitters consist of a MEMS capacitive pressure sensor die, which is underpinned by ES’ innovative microfabrication process that has been proven suitable for the mechanical, radiation and temperature environment of space applications. The full custom, radiation-hardened signal conditioning IC was designed entirely by ES, utilizing a standard deep submicron CMOS process of a European foundry.
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Model 800E -
OAI
The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Renesas Electronics Corp.
Automotive Head-Up Displays (HUDs) are benefiting from big innovations in MEMS projection systems and are central to ADAS and safety. The latest laser scanned-MEMS projection systems can provide higher resolution images and at a lower cost. Renesas' highly integrated laser diode driver enables automotive head-up displays (HUDs) with high resolution, high color-depth and high frame-rate projections.
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MiCS5524 -
Adafruit
Give your next sensor project a nose for gasses with the Adafruit MiCS-5524 Gas Sensor Breakout. This breakout makes it easy to use this nice sensor from SGX Sensortech. The MiCS-5524 is a robust MEMS sensor for indoor carbon monoxide and natural gas leakage detection, it''s suitable also for indoor air quality monitoring; breath checker and early fire detection.
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PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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Bruker Nano Surfaces
Bruker is the worldwide leader in 3D surface measurement and inspection, offering fast, non-contact analyses for samples ranging in size from microscopic MEMS to entire engine blocks. Our microscopes are the culmination of ten generations of proprietary Wyko® Technology advances that provide the high sensitivity and stability necessary for precision 3D surface measurements in applications and environments that are challenging for other metrology systems.
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WMA-300 -
Falco Systems
The WMA-300 is a high voltage, wide bandwidth laboratory amplifier. Its high output voltage, current and wide bandwidth have been designed to serve the needs of a wide variety of high-tech experiments. The WMA-300 can be used for MEMS actuation, EO-modulators, PZT (piezo) positioners, ultrasonics, and many other applications. Two WMA-300 amplifiers and a WMA-IB-HS phase inverter - buffer can be used to double the output voltage.
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MMA8452Q -
SparkFun Electronics
This breakout board makes it easy to use the tiny MMA8452Q accelerometer in your project. The MMA8452Q is a smart low-power, three-axis, capacitive MEMS accelerometer with 12 bits of resolution. This accelerometer is packed with embedded functions with flexible user programmable options, configurable to two interrupt pins. Embedded interrupt functions allow for overall power savings relieving the host processor from continuously polling data.
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DiCon Fiberoptics, Inc.
DiCon's MEMS tunable optical filter offers many advantages over a traditional tunable optical filter; increased accuracy & resolution, a faster tuning speed, as well as a durability that will last for over a billion tuning cycles, all in a compact package. Options are available for either 100 GHz or 50 GHz channel spacing as well as operation in either the O-band, C-band or L-band wavelength ranges.
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Shenzhen Golight Technology Co.,Ltd
Mini OSA is based on MEMS tunable filter and high precision photoelectric control unit and detection unit. Its measurement precision is superior to the traditional OSA in C-band and O-band. And built-in USB communication interface is easy for system integration and SDK.