Showing results: 196 - 208 of 208 items found.
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SAE J1708/J1587 -
Au Group Electronics
The Au SAE J1708/J1587 simulators (Gen II, V1.00A release) can simulate up to 44 most frequently used Engine/Transmission/ABS parameters, warnings and diagnostic messages. Up to six Engine MID, three transmission MID and six ABS MID can be field configured. All editions can run independently (without personal computer). This family of simulators are designed very easy to use. It is widely used as valuable tools for any situation from product-line test, incoming inspection, business demonstration to product development and product validation.
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J1939 -
Au Group Electronics
The Au SAE J1939 simulators (Gen II, includes V1.00A releases and V2.00A releases) can generate SAE J1939 signal for up to three controller applications (CA): Engine, ABS and Transmission. Au J1939 simulators are designed so easy to use, even product line operator and sales personal can use them without Controller Area Network training. Au J1939 simulator can run all by itself and doesn''t require complicate software settings or user''s knowledge and experience on Controller Area Network. It is widely used as valuable tools for any situation from product-line test, incoming inspection, business demonstration to product development and product validation.
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NuVant Systems, Inc.
The spectroelectrochemical cell enables acquisition of infrared and Raman spectra of working electrode discs (variable sizes, up to 10 mm OD) under flowing solution. Working electrodes available include: Pt, Au, Ag, Cu, glassy carbon, etc. The cell uses a Pt-wire counter electrode and a Ag/AgCl reference electrode. For use with the EZpump peristaltic pump. Adapts to the Harrick Praying MantisTM Diffuse Reflection Accessory.
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FISCHERSCOPE X-RAY/XULM -
Helmut Fischer AG
Flexible instrument for measuring coating thickness with multiple usesBoth thin and thick coatings (e.g. 50 nm Au or 100 m Sn) can be measured equally well through selectable high voltage filter combinationsThe micro-focus tube enables small measurement spot sizes at short measurement distances of just 100 mHigh count rates of a few kcps through proportional counter tubeMeasuring direction from bottom to top, this allows for quick and easy sample positioningLarge measurement chamber with a cutout (C-slot)
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#TPS120 -
NSI Industries
AC to DC Power Supply: 12V 2.5A with intl adapter plugs for (NA, EU, AU, UK), 849160008446
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SparkFun Electronics
If you are not needing a lot of power to start your FPGA adventure, or are looking for a more economical option, the Alchitry Cu FPGA Development Board might be the perfect option for you! The Alchitry Cu is a "lighter" FPGA version than the Alchitry Au but still offers something completely unique. FPGAs, or Field-Programmable Gate Arrays, are an advanced development board type for engineers and hobbyists alike to experience the next step in programming with electronics. The Cu truly exemplifies the trend of more affordable and increasingly powerful FPGA boards arriving each year. This board is a fantastic starting point into the world of FPGAs and the heart of your next project. Finally, now that this board is built by SparkFun, we added a Qwiic connector for easy I2C integration!
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Teledyne Labtech
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Bourns
a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100 % Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Bourns
Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Au Group Electronics
The Au Truck / Bus Fleet Management System (FMS) simulator can generate Controller Area Network (CAN) signal per Truck FMS Standard (Vers. 02.00) and Bus FMS Standard (Vers. 00.02). Au FMS simulators are designed very easy to use. All editions can run independently (without personal computer). Au FMS Simulators are widely used as valuable tools for any situation from product-line test, incoming inspection, business demonstration, to product development and product validation.
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1621 -
IET Labs
The GenRad1621 Capacitance Measurement system is a completely self-contained system capable of capacitance measurements in increments as small as 0.1 aF (10-4 pF) and conductance measurements in increments as small as 100 aU (10-7 U; equivalent to a shunt resistance of 1010 M). Measurements are three terminal, with 2- or 3-terminal connection, and provision is also made for the connection of an external standard for comparison measurements.
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Teledyne Defense Electronics
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
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Teledyne Defense Electronics
Teledyne Labtech offers a comprehensive build-to-print microwave module and microwave components manufacturing service. This includes MMIC placement, Au wire bonding, SMT assembly and test.Our microwave MIC production facility is housed in a class 10,000 clean room that accommodates manual chip placement and semi-automatic wire bond assembly. Dedicated microwave components manufacturing is undertaken within production cells established to meet specific customer or product requirements.
