Showing results: 46 - 56 of 56 items found.
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Amitron Corp.
The Amitron process is capable of producing 20 plus ounces of finished copper and reliably spray coat a protective and consistent solder mask with imaged nomenclature. Amitron utilizes a unique process referred to as "Laminated Deposition". This combination of processes allows extreme copper thickness requirements to become very practical and cost effective. The process utilizes heavy base copper that when placed in our plating and etching systems will deliver consistent and reliable high power circuits.
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MKS Instruments
The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Hukseflux Thermal Sensors B.V.
NR01 is a market leading 4-component net radiation sensor, mostly used in scientific-grade energy balance and surface flux studies. It offers 4 separate measurements of solar and longwave radiation, facing both up and down. NR01 owes its popularity to its excellent price / performance ratio and major improvements relative to comparable instruments. These advantages include weight, ease of levelling, solar offsets in the longwave measurement and pyrgeometer heating, reducing measurement errors caused by dew deposition.
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IR-300 Series -
HORIBA, Ltd.
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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Aspect -
Onto Innovation
Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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LINZA 150 -
EssentOptics Ltd.
LINZA 150 spectrophotometer is designed for broadband transmittance and reflectance measurement of lenses and lens assemblies (objectives) ensuring that only perfect lenses are approved for lens assemblies, delivered to customers or meet specs provided to your lens supplier. The instrument is perfectly suited for both routine lens measurements and sophisticated improvement of lens production technology: Fast on-axis transmittance measurement of individual convex/concave lenses. Fast on-axis transmittance measurement of lens assemblies (objectives). Unattended on-axis and off-axis reflectance measurement of individual lenses providing measurement data virtually from any area on lens surface (both convex and concave). Ideal for fine-tuning of deposition technology used to produce coatings on lenses.
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AMULET -
FujiFilm Corp.
The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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Machine Vision Products
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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KLA-Tencor Corp
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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KLA-Tencor Corp
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
